公开(公告)号：US20230099295A1

公开(公告)日：2023-03-30

申请号：US17485140

申请日：2021-09-24

Applicant: QUALCOMM Incorporated

Inventor： Arjang SHAHRIARI ,  Ajay VADAKKEPATT ,  Ajit Kumar VALLABHANENI ,  Melika ROSHANDELL ,  Mahdi NABIL ,  Mehdi SAEIDI ,  Paul PENZES

IPC: G02B26/00 ,  G09G3/34 ,  H01L23/473

Abstract: A device that includes a first integrated device, a second integrated device configured to be electrically coupled to the first integrated device and an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a back surface of the device by looping a liquid in the electrowetting device, along the back surface of the device.