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    SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE
    1.
    发明申请
    SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20190035713A1

    公开(公告)日：2019-01-31

    申请号：US15663680

    申请日：2017-07-28

    Applicant: QUALCOMM Incorporated

    Inventor： Rupal Govindbhai PRAJAPATI ,  Shujuan WANG ,  Peng WANG

    IPC: H01L23/427 ,  H05K7/20

    Abstract: An apparatus for cooling an electronic device is disclosed. In an aspect, the apparatus includes a vapor chamber coupled to a heat generating component of the electronic device. In an aspect, the vapor chamber is coupled to an inner surface of an outer cover of the electronic device and conforms to a shape of the inner surface of the outer cover. In another aspect, the vapor chamber forms the outer cover of the electronic device. The vapor chamber comprises a sealed container, a wick structure disposed on an inner surface of the sealed container, and a fluid contained in the sealed container, wherein as heat is applied to an evaporator side of the sealed container coupled to the heat generating component, the fluid vaporizes over a condenser side of the sealed container opposite the evaporator side and returns to the evaporator side via the wick structure.

    SKIN MATERIAL DESIGN TO REDUCE TOUCH TEMPERATURE
    2.
    发明申请
    SKIN MATERIAL DESIGN TO REDUCE TOUCH TEMPERATURE 审中-公开
    皮肤材料设计减少触摸温度

    公开(公告)号：US20150261267A1

    公开(公告)日：2015-09-17

    申请号：US14594984

    申请日：2015-01-12

    Applicant: QUALCOMM Incorporated

    Inventor： Unnikrishnan VADAKKANMARUVEEDU ,  Jon James ANDERSON ,  Vinay MITTER ,  Peng WANG

    IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16

    CPC classification number: G06F1/203 ,  C09K5/14 ,  F28F13/003 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/182 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/1633 ,  Y10T29/49002 ,  Y10T428/2982

    Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

    Abstract translation: 电子设备包括壳体，壳体具有多个侧面和壳体中的电子部件。 多孔和导热材料与壳体相关联。 该材料具有导热性（k）和10％至70％之间的孔隙率，其导致该材料的比热（＆rgr;）和密度（Cp），使得k *＆rgr; * Cp在0（ J * W）/（m4 * K2）和1,000,000（J * W）/（m4 * K2）。 该材料可以是：热导率在0.5-2W / m-K之间，密度在1000-2500kg / m3之间，比热在500-1000J / kg-K之间的玻璃基材料; 热导率在300-400W / m-K之间，密度在4000-8000kg / m 3和比热200-300J / kg-K之间的金属基材料; 并且具有导热性的塑料基材料可以在0.1-0.4W / m-K之间，密度在400-1000kg / m 3之间，比热在1900-2000J / kg-K之间。

    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS
    3.
    发明申请
    SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS 有权

    公开(公告)号：US20210129995A1

    公开(公告)日：2021-05-06

    申请号：US17247546

    申请日：2020-12-16

    Applicant: QUALCOMM Incorporated

    Inventor： Peng WANG ,  Don LE ,  Jon James ANDERSON ,  Chinchuan CHIU

    IPC: B64D13/00 ,  B64C39/02 ,  F28D15/04 ,  B64D33/08 ,  F28D15/02

    Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

    MULTI-ROTOR AERIAL DRONE WITH THERMAL ENERGY HARVESTING
    4.
    发明申请
    MULTI-ROTOR AERIAL DRONE WITH THERMAL ENERGY HARVESTING 审中-公开

    公开(公告)号：US20190061970A1

    公开(公告)日：2019-02-28

    申请号：US15689994

    申请日：2017-08-29

    Applicant: QUALCOMM Incorporated

    Inventor： Peng WANG ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

    IPC: B64D41/00 ,  B64D27/24 ,  B64C39/02 ,  H02N11/00 ,  H01L35/00

    Abstract: Some features pertain to a quad-rotor or other aerial drone having a thermoelectric generator (TEG) for harvesting waste heat from a processor of the drone. The TEG is positioned, in some examples, with its inner metal electrode coating adjacent the drone processor to function as the “hot” side of the TEG. The outer metal electrode coating of the TEG forms a portion of the outer surface of the housing of the drone to function as the “cold” side of the TEG. The inner and outer metal coatings of the TEG are coupled to a battery recharger so current generated by the TEG during operation of the drone can help recharge the drone battery to extend flight time. In some examples, an outer perimeter of the TEG extends into an airflow region near the drone rotors so propeller wash serves to cool the perimeter of the TEG.

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