公开(公告)号：US20150261267A1

公开(公告)日：2015-09-17

申请号：US14594984

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan VADAKKANMARUVEEDU ,  Jon James ANDERSON ,  Vinay MITTER ,  Peng WANG

IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16

CPC classification number: G06F1/203 ,  C09K5/14 ,  F28F13/003 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/182 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/1633 ,  Y10T29/49002 ,  Y10T428/2982

Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

Abstract translation: 电子设备包括壳体，壳体具有多个侧面和壳体中的电子部件。 多孔和导热材料与壳体相关联。 该材料具有导热性（k）和10％至70％之间的孔隙率，其导致该材料的比热（＆rgr;）和密度（Cp），使得k *＆rgr; * Cp在0（ J * W）/（m4 * K2）和1,000,000（J * W）/（m4 * K2）。 该材料可以是：热导率在0.5-2W / m-K之间，密度在1000-2500kg / m3之间，比热在500-1000J / kg-K之间的玻璃基材料; 热导率在300-400W / m-K之间，密度在4000-8000kg / m 3和比热200-300J / kg-K之间的金属基材料; 并且具有导热性的塑料基材料可以在0.1-0.4W / m-K之间，密度在400-1000kg / m 3之间，比热在1900-2000J / kg-K之间。

公开(公告)号：US20190331142A1

公开(公告)日：2019-10-31

申请号：US15967500

申请日：2018-04-30

Applicant: QUALCOMM Incorporated

Inventor： Victor CHIRIAC ,  Jorge ROSALES ,  Jon James ANDERSON

IPC: F04F99/00 ,  H01L23/427

Abstract: A device that includes an integrated device and a heat dissipating device coupled to the integrated device. The heat dissipating device includes an electro-osmotic (EO) pump. The electro-osmotic (EO) pump includes a casing comprising a first opening and a second opening; a membrane located in the casing; an anode electrode; a cathode electrode; and a catalyst layer formed on a surface of the membrane. The membrane includes a plurality of channels. The electro-osmotic (EO) pump is configured to provide a fluid to flow from the first opening of the casing, through the plurality of channels of the membrane and out of the second opening of the casing. The catalyst layer is configured to recombine gas ions that are produced by the electro-osmotic (EO) pump.

公开(公告)号：US20190257589A1

公开(公告)日：2019-08-22

申请号：US16398001

申请日：2019-04-29

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis ROSALES ,  Le GAO ,  Don LE ,  Jon James ANDERSON

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/427 ,  F04B17/00 ,  F04B49/06

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

公开(公告)号：US20210129995A1

公开(公告)日：2021-05-06

申请号：US17247546

申请日：2020-12-16

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Don LE ,  Jon James ANDERSON ,  Chinchuan CHIU

IPC: B64D13/00 ,  B64C39/02 ,  F28D15/04 ,  B64D33/08 ,  F28D15/02

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

公开(公告)号：US20150241092A1

公开(公告)日：2015-08-27

申请号：US14189823

申请日：2014-02-25

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun PARK ,  Victor Adrian CHIRIAC ,  Jon James ANDERSON ,  Alex Kuang-Hsuan TU

IPC: F25B21/04 ,  F25B21/02

CPC classification number: F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  G06F1/203 ,  G06F1/206

Abstract: Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

Abstract translation: 用于控制移动系统中的热流的方法和装置。 该方法包括确定至少一个温度传感器中的每一个的温度值。 该方法确定多个位置中的每个位置处的当前温度阈值的增量值。 该方法将每个增量值映射到热模块。 该方法计算热流方向信号以使用以下至少一个来最小化正增量值：系统级模型和IC级热模型。 该方法将热流方向信号传输到至少一个热电模块，其中热电模块与多于一个的温度传感器相关联。