公开(公告)号：US20210129995A1

公开(公告)日：2021-05-06

申请号：US17247546

申请日：2020-12-16

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Don LE ,  Jon James ANDERSON ,  Chinchuan CHIU

IPC: B64D13/00 ,  B64C39/02 ,  F28D15/04 ,  B64D33/08 ,  F28D15/02

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

公开(公告)号：US20190257589A1

公开(公告)日：2019-08-22

申请号：US16398001

申请日：2019-04-29

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis ROSALES ,  Le GAO ,  Don LE ,  Jon James ANDERSON

IPC: F28D15/02 ,  H05K7/20 ,  H01L23/427 ,  F04B17/00 ,  F04B49/06

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

公开(公告)号：US20180170553A1

公开(公告)日：2018-06-21

申请号：US15385136

申请日：2016-12-20

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Don LE ,  Jon ANDERSON ,  Chinchuan Andrew CHIU

IPC: B64D13/00 ,  F28D15/04 ,  F28D15/02 ,  B64C39/02

CPC classification number: B64D13/006 ,  B64C39/024 ,  B64C2201/027 ,  B64C2201/108 ,  B64D33/08 ,  F28D15/0275 ,  F28D15/04 ,  F28D2021/0021

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.