公开(公告)号：US20200033066A1

公开(公告)日：2020-01-30

申请号：US16047275

申请日：2018-07-27

Applicant: QUALCOMM Incorporated

Inventor： Victor Adrian CHIRIAC ,  Jorge Luis ROSALES

IPC: F28D15/02 ,  F28D15/06

Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

公开(公告)号：US20200271388A1

公开(公告)日：2020-08-27

申请号：US16281477

申请日：2019-02-21

Applicant: QUALCOMM Incorporated

Inventor： Sean Charles ANDREWS ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

IPC: F28D15/02 ,  H01L23/427 ,  F28F21/08

Abstract: Certain aspects of the present disclosure provide a heat-dissipating device with enhanced interfacial properties. One example heat-dissipating device generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer comprising a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.

公开(公告)号：US20190061970A1

公开(公告)日：2019-02-28

申请号：US15689994

申请日：2017-08-29

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

IPC: B64D41/00 ,  B64D27/24 ,  B64C39/02 ,  H02N11/00 ,  H01L35/00

Abstract: Some features pertain to a quad-rotor or other aerial drone having a thermoelectric generator (TEG) for harvesting waste heat from a processor of the drone. The TEG is positioned, in some examples, with its inner metal electrode coating adjacent the drone processor to function as the “hot” side of the TEG. The outer metal electrode coating of the TEG forms a portion of the outer surface of the housing of the drone to function as the “cold” side of the TEG. The inner and outer metal coatings of the TEG are coupled to a battery recharger so current generated by the TEG during operation of the drone can help recharge the drone battery to extend flight time. In some examples, an outer perimeter of the TEG extends into an airflow region near the drone rotors so propeller wash serves to cool the perimeter of the TEG.

公开(公告)号：US20150241092A1

公开(公告)日：2015-08-27

申请号：US14189823

申请日：2014-02-25

Applicant: QUALCOMM Incorporated

Inventor： Hee Jun PARK ,  Victor Adrian CHIRIAC ,  Jon James ANDERSON ,  Alex Kuang-Hsuan TU

IPC: F25B21/04 ,  F25B21/02

CPC classification number: F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  G06F1/203 ,  G06F1/206

Abstract: Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

Abstract translation: 用于控制移动系统中的热流的方法和装置。 该方法包括确定至少一个温度传感器中的每一个的温度值。 该方法确定多个位置中的每个位置处的当前温度阈值的增量值。 该方法将每个增量值映射到热模块。 该方法计算热流方向信号以使用以下至少一个来最小化正增量值：系统级模型和IC级热模型。 该方法将热流方向信号传输到至少一个热电模块，其中热电模块与多于一个的温度传感器相关联。