公开(公告)号：US20200271388A1

公开(公告)日：2020-08-27

申请号：US16281477

申请日：2019-02-21

Applicant: QUALCOMM Incorporated

Inventor： Sean Charles ANDREWS ,  Jorge Luis ROSALES ,  Victor Adrian CHIRIAC

IPC: F28D15/02 ,  H01L23/427 ,  F28F21/08

Abstract: Certain aspects of the present disclosure provide a heat-dissipating device with enhanced interfacial properties. One example heat-dissipating device generally includes a first heat spreader configured to be thermally coupled to a region configured to generate heat, a second heat spreader, an interposer thermally coupled to at least one of the first heat spreader or the second heat spreader, at least one interfacial layer comprising a graphene material disposed on at least one surface of the interposer, and a phase change material disposed between the at least one interfacial layer and at least one of the first heat spreader or the second heat spreader and thermally coupled to at least one of the first heat spreader or the second heat spreader.