公开(公告)号：US20190331142A1

公开(公告)日：2019-10-31

申请号：US15967500

申请日：2018-04-30

Applicant: QUALCOMM Incorporated

Inventor： Victor CHIRIAC ,  Jorge ROSALES ,  Jon James ANDERSON

IPC: F04F99/00 ,  H01L23/427

Abstract: A device that includes an integrated device and a heat dissipating device coupled to the integrated device. The heat dissipating device includes an electro-osmotic (EO) pump. The electro-osmotic (EO) pump includes a casing comprising a first opening and a second opening; a membrane located in the casing; an anode electrode; a cathode electrode; and a catalyst layer formed on a surface of the membrane. The membrane includes a plurality of channels. The electro-osmotic (EO) pump is configured to provide a fluid to flow from the first opening of the casing, through the plurality of channels of the membrane and out of the second opening of the casing. The catalyst layer is configured to recombine gas ions that are produced by the electro-osmotic (EO) pump.

公开(公告)号：US20180368279A1

公开(公告)日：2018-12-20

申请号：US15624877

申请日：2017-06-16

Applicant: QUALCOMM Incorporated

Inventor： Victor CHIRIAC ,  Jorge ROSALES ,  Peng WANG

IPC: H05K7/20 ,  G06F1/20

Abstract: Techniques for heat reduction are disclosed. An apparatus may include a heat-generating component, an insulative layer having a first surface in contact with the heat-generating component and a second surface opposite the first surface, and a heat-conducting component disposed on the second surface of the insulative layer.