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    Image sensor module architecture
    1.
    发明授权
    Image sensor module architecture 有权
    图像传感器模块架构

    公开(公告)号：US07350712B2

    公开(公告)日：2008-04-01

    申请号：US11096020

    申请日：2005-03-31

    Applicant: Kraig A. Quinn ,  Douglas E. Proctor ,  Robert Herloski ,  John C. Juhasz ,  Charles J. Urso, Jr. ,  Frederick O. Hayes, III

    Inventor： Kraig A. Quinn ,  Douglas E. Proctor ,  Robert Herloski ,  John C. Juhasz ,  Charles J. Urso, Jr. ,  Frederick O. Hayes, III

    IPC: G06K7/10

    CPC classification number: G06K7/10732

    Abstract: Image sensor module architecture provides flexible mounting of illuminators in an imaging apparatus with flexible fasteners. The architecture involves one or more LED-based illuminators that may be mounted adjustably to provide high intensity and uniform profile luminescence. The supporting imaging and electronic circuit components are quickly assembled and disassembled from the image sensor module by using a flexible multi-function clip having multiple segments for holding multiple objects together.

    Abstract translation: 图像传感器模块架构提供了灵活的照明器安装在具有柔性紧固件的成像设备中。 该架构涉及可以可调节地安装的一个或多个基于LED的照明器，以提供高强度和均匀的轮廓发光。 支持成像和电子电路组件通过使用具有多个段的柔性多功能夹将图像传感器模块快速组装和拆卸，以将多个物体保持在一起。

    Assembly for mounting semiconductor chips in a full-width-array image scanner
    3.
    发明授权
    Assembly for mounting semiconductor chips in a full-width-array image scanner 失效
    用于将半导体芯片安装在全宽阵列图像扫描器中的组件

    公开(公告)号：US5545913A

    公开(公告)日：1996-08-13

    申请号：US330299

    申请日：1994-10-17

    Applicant: Kraig A. Quinn ,  Josef E. Jedlicka ,  Brian T. Ormond

    Inventor： Kraig A. Quinn ,  Josef E. Jedlicka ,  Brian T. Ormond

    IPC: H01L25/04 ,  H01L31/0203 ,  H01L31/00

    CPC classification number: H01L25/042 ,  H01L24/32 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10158

    Abstract: An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along a surface of a support substrate. A plurality of semiconductor chips is disposed along the elongated bead, each semiconductor chip including a linear array of photosensors on a front surface thereof, and a back surface attached to the support substrate by the electrically conductive adhesive. A connection block is disposed along another portion of the elongated bead, the block including a first surface contacting the bead, a second surface, and a conductor extending from the first surface to the second surface.

    Abstract translation: 组件有助于安装一组邻接的半导体芯片，例如对准的芯片，以在数字扫描器或复印机中形成光传感器的单个全页宽线性阵列。 导电粘合剂的细长珠沿着支撑基底的表面延伸。 多个半导体芯片沿着细长的凸条设置，每个半导体芯片包括前表面上的光电传感器的线性阵列和通过导电粘合剂附着到支撑基板的后表面。 连接块沿着细长的胎圈的另一部分设置，该块包括接触胎圈的第一表面，第二表面和从第一表面延伸到第二表面的导体。

    Assembly of imaging arrays for large format documents
    4.
    发明授权
    Assembly of imaging arrays for large format documents 失效
    用于大幅面文档的成像阵列的组装

    公开(公告)号：US06747259B1

    公开(公告)日：2004-06-08

    申请号：US09677742

    申请日：2000-10-03

    Applicant: Kraig A. Quinn

    Inventor： Kraig A. Quinn

    IPC: H01L2700

    CPC classification number: H05K3/305 ,  H01L27/146 ,  H05K1/142 ,  H05K2201/0108 ,  Y02P70/613

    Abstract: An imaging apparatus is formed of two or more imaging subarrays. Each imaging subarray is formed of a printed wiring board containing semiconductor imaging chips. The end chip of each board projects beyond the edge of the board. The imaging subarrays are joined together so that the projecting end chips may be closely spaced from one and another, without the circuit boards contacting one another. Glass tie bars formed of a low thermal expansion glass secure the boards to one another. A light curable adhesive secures each tie bar to the printed wiring board.

    Abstract translation: 成像装置由两个或更多个成像子阵列形成。 每个成像子阵列由包含半导体成像芯片的印刷线路板形成。 每个板的终端芯片超出了板的边缘。 成像子阵列连接在一起，使得突出的末端芯片可以彼此紧密地间隔开，而不使电路板彼此接触。 由低热膨胀玻璃形成的玻璃连接条将板固定在一起。 可光固化的粘合剂将每个连接杆固定到印刷线路板上。

    Construction of scanning or imaging arrays suitable for large documents
    5.
    发明授权
    Construction of scanning or imaging arrays suitable for large documents 失效
    构建适合大型文件的扫描或成像阵列

    公开(公告)号：US06252780B1

    公开(公告)日：2001-06-26

    申请号：US09127461

    申请日：1998-07-31

    Applicant: Kraig A. Quinn

    Inventor： Kraig A. Quinn

    IPC: H05K111

    CPC classification number: H01L27/14601 ,  H04N1/03 ,  H04N2201/02456 ,  H04N2201/0247 ,  H04N2201/02479 ,  H04N2201/02495 ,  H05K1/142

    Abstract: Semiconductor chips, such as photosensor arrays in a full-width scanner, are mounted on printed wiring boards. The printed wiring boards are in turn mounted on a second layer of printed wiring board material. The two layers of printed wiring board material are attached so that the seams between adjacent printed wiring boards in each layer alternate in a brick-like fashion. This structure enables arrays of semiconductor chips to be constructed in relatively long lengths, with minimal risk of damage caused by thermal stresses.

    Abstract translation: 半导体芯片，例如全宽扫描仪中的光电传感器阵列，安装在印刷电路板上。 印刷线路板又安装在第二层印刷线路板材料上。 安装两层印刷线路板材料，使得每层中相邻印刷线路板之间的接缝以砖状方式交替。 这种结构使得半导体芯片的阵列能够以较长的长度构造，并且具有最小的热应力损伤风险。

    Full width array read or write bars having low induced thermal stress
    6.
    发明授权
    Full width array read or write bars having low induced thermal stress 失效
    具有低感应热应力的全宽阵列读或写条

    公开(公告)号：US5528272A

    公开(公告)日：1996-06-18

    申请号：US166855

    申请日：1993-12-15

    Applicant: Kraig A. Quinn ,  Mark A. Cellura ,  Jeffrey D. Barner ,  Donald J. Drake

    Inventor： Kraig A. Quinn ,  Mark A. Cellura ,  Jeffrey D. Barner ,  Donald J. Drake

    IPC: B41J2/14 ,  B41J2/155

    CPC classification number: B41J2/155 ,  B41J2/14072 ,  B41J2202/20

    Abstract: A full width read and/or write assemblies, such as a full width thermal ink jet printbar, is disclosed, having materials with both a high thermal coefficient of expansion and a low thermal coefficient of expansion. A suitable adhesive which provides lateral give while firmly holding the respective components together provides dimensional stability to the printbar element having a low thermal coefficient of expansion when components having high thermal coefficient of expansion are assembled thereto. The flexible or floating mounting enabled by lateral give of the adhesive allows for the application of cost effective materials with a high thermal coefficient of expansion to be used for support functions such as, for example, circuit boards and ink manifolds. The flexible or floating mounting relieves shear stress cased by a differential in the expansion or contraction of materials having a different thermal coefficient of expansion. Since the thermal expansion of the various components expand and contract from a center location thereof, this center location is bonded by an adhesive which does not provide lateral give, so that alignment between parts are maintained while the remainder of the respective components float relative to each other and prevent thermally induced stresses which tend to cause warpage.

    Abstract translation: 公开了一种全宽度读/写组件，例如全宽度热喷墨印刷棒，其具有高热膨胀系数和低热膨胀系数的材料。 当将具有高热膨胀系数的部件组装在一起时，提供侧向赋予的合适的粘合剂同时牢固地保持各个部件一起为具有低热膨胀系数的打印头元件提供尺寸稳定性。 通过侧面给予粘合剂的柔性或浮动安装允许将具有高热膨胀系数的成本有效的材料应用于诸如电路板和油墨歧管的支撑功能。 柔性或浮动式安装可减轻由不同热膨胀系数的材料的膨胀或收缩差异引起的剪切应力。 由于各种部件的热膨胀从其中心位置膨胀和收缩，所以该中心位置通过不提供横向给定的粘合剂粘结，从而保持部件之间的对准，同时各部件的其余部分相对于每个部件浮动 另一种并防止易引起翘曲的热致应力。

    Replacing semiconductor chips in a full-width chip array
    7.
    发明授权
    Replacing semiconductor chips in a full-width chip array 失效
    更换半导体芯片在全宽度芯片阵列

    公开(公告)号：US5753959A

    公开(公告)日：1998-05-19

    申请号：US779045

    申请日：1997-01-06

    Applicant: Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

    Inventor： Kraig A. Quinn ,  Brian T. Ormond ,  Josef E. Jedlicka

    IPC: G02B27/00 ,  B41J2/155 ,  B41J2/16 ,  H01L21/98 ,  H01L27/14 ,  H01L29/06 ,  H01L33/00 ,  H04N1/028 ,  H01L31/00

    CPC classification number: H01L25/50 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2202/19 ,  B41J2202/20 ,  H01L29/0657 ,  H01L2924/0002

    Abstract: Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips. By increasing the spacing of a defective chip from neighboring chips, the defective chip can be removed while minimizing the risk of damage to neighboring chips. Also, batches of chips can be originally manfactured on a single wafer as either "regular" chips or "replacement" chips, with the replacement chips being slightly shorter in a critical dimension.

    Abstract translation: 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。 通过增加有缺陷的芯片与相邻芯片的间隔，可以去除有缺陷的芯片，同时最小化对相邻芯片的损坏风险。 此外，批次的芯片可以原始地在单个晶片上制造为“常规”芯片或“替换”芯片，替换芯片在临界尺寸上略短。

    Semiconductor wafer divisible into chips for creating or recording images
    9.
    发明授权
    Semiconductor wafer divisible into chips for creating or recording images 失效
    半导体晶片可分为用于创建或记录图像的芯片

    公开(公告)号：US5668400A

    公开(公告)日：1997-09-16

    申请号：US587058

    申请日：1996-01-16

    Applicant: Kraig A. Quinn

    Inventor： Kraig A. Quinn

    IPC: G02B27/00 ,  B41J2/155 ,  B41J2/16 ,  H01L21/98 ,  H01L27/14 ,  H01L29/06 ,  H01L33/00 ,  H04N1/028

    CPC classification number: H01L25/50 ,  B41J2/155 ,  B41J2/1601 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2202/19 ,  B41J2202/20 ,  H01L29/0657 ,  H01L2924/0002

    Abstract: Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips. By increasing the spacing of a defective chip from neighboring chips, the defective chip can be removed while minimizing the risk of damage to neighboring chips. Also, batches of chips can be originally manufactured on a single wafer as either "regular" chips or "replacement" chips, with the replacement chips being slightly shorter in a critical dimension.

    Abstract translation: 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。 通过增加有缺陷的芯片与相邻芯片的间隔，可以去除有缺陷的芯片，同时最小化对相邻芯片的损坏风险。 此外，批次的芯片最初可以在单个晶片上制造为“常规”芯片或“替换”芯片，替换芯片在临界尺寸上略短。

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