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公开(公告)号：US06927381B2
公开(公告)日：2005-08-09
申请号：US10656622
申请日：2003-09-05
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
摘要翻译： 用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。 峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。 在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。
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公开(公告)号：US5521125A
公开(公告)日：1996-05-28
申请号：US328789
申请日：1994-10-28
申请人： Brian T. Ormond , Josef E. Jedlicka
发明人： Brian T. Ormond , Josef E. Jedlicka
IPC分类号： H01L21/304 , H01L21/78
CPC分类号： H01L21/78 , H01L21/3043
摘要： A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.
摘要翻译： 用于从晶圆制造半导体芯片的晶片设计和切割技术。 一系列氧化物层沉积在硅衬底表面的第一和第二区域中。 这些区域由其中没有氧化物层的街道分开，并且连续的氧化物层形成具有与硅衬底的表面垂直的表面的垂直壁。 冲击吸收材料沉积在街上，在其中形成凹面弯月面。 当晶片切成芯片时，吸震材料阻止硅颗粒轨迹运动。
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公开(公告)号：US06646248B2
公开(公告)日：2003-11-11
申请号：US09841279
申请日：2001-04-24
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： H01L2700
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
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公开(公告)号：US06252220B1
公开(公告)日：2001-06-26
申请号：US09299122
申请日：1999-04-26
申请人： Josef E. Jedlicka , Debra S. Vent
发明人： Josef E. Jedlicka , Debra S. Vent
IPC分类号： H01L2700
CPC分类号： H01L27/1462 , H01L27/14632 , H01L27/14687
摘要： The present invention relates to a sensor cover glass for covering photosensitive chips for generating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other digital imaging device or system. More specifically, the present invention relates to providing a sensor cover glass with an infrared filter material for blocking infrared light from reaching the photosensitive chips. This system is particularly applicable to color input imaging devices or systems.
摘要翻译： 本发明涉及用于覆盖用于从原始图像产生电信号的感光芯片的传感器盖玻璃，例如可以在数字扫描仪，复印机，传真机或其他数字成像设备或系统中找到。 更具体地说，本发明涉及提供具有用于阻挡红外光到达感光芯片的红外滤光材料的传感器盖玻璃。 该系统特别适用于彩色输入成像设备或系统。
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公开(公告)号：US06201293B1
公开(公告)日：2001-03-13
申请号：US09196462
申请日：1998-11-19
IPC分类号： H01L23495
CPC分类号： H01L27/14601 , H01L27/14632 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface. A first primary color filter layer is deposited over at least first inner photosite and first outer photosite, and the first primary color filter layer transmits a primary color.
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公开(公告)号：US6165813A
公开(公告)日：2000-12-26
申请号：US416127
申请日：1995-04-03
IPC分类号： G02B27/00 , B41J2/155 , B41J2/16 , H01L21/98 , H01L27/14 , H01L29/06 , H01L33/00 , H04N1/028 , H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： H01L25/50 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , B41J2202/19 , B41J2202/20 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.
摘要翻译： 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。
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公开(公告)号：US5604362A
公开(公告)日：1997-02-18
申请号：US603513
申请日：1996-02-20
IPC分类号： G02B5/20 , H01L21/02 , H01L27/14 , H01L31/0216 , H01L27/148
CPC分类号： H01L31/02162
摘要： In a photosensitive chip suitable for full-color imaging, separate photosites on the chip correspond to different primary colors in an original image. Each primary-color photosite is filtered with a polyimide doped to a particular primary color. The red-filtering layer and the blue-filtering layer are left on the non-photosensitive portions of the main surface of the chip, and together serve as a non-reflective area which prevents stray reflections from the chip. The chip is further provided with a base layer of infrared-filtering polyimide.
摘要翻译： 在适用于全彩色成像的感光芯片中，芯片上的独立照片对应于原始图像中的不同原色。 用掺杂到特定原色的聚酰亚胺过滤每个原色的光亮度。 红色滤光层和蓝色滤色层留在芯片的主表面的非感光部分上，并且一起用作防止来自芯片的杂散反射的非反射区域。 芯片还设置有红外滤光聚酰亚胺的基层。
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8.发明授权Method of fabricating image sensor dies and the like for use in assembling arrays 失效制造用于组装阵列的图像传感器管芯等的方法
公开(公告)号：US5219796A
公开(公告)日：1993-06-15
申请号：US787444
申请日：1991-11-04
IPC分类号： H01L21/304 , H01L21/78 , H01L31/18
CPC分类号： H01L21/78 , H01L21/304 , H01L31/1804 , Y02E10/547 , Y10S148/028
摘要： An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.
摘要翻译： 用于形成具有允许模具与其它类似模具组装的面的单个模具的改进方法，以形成具有最小碎裂和断裂的一个和/或二维扫描阵列，其中晶片的活性侧被蚀刻以形成具有 与模具相邻的槽的壁具有相对宽的表面以便于锯切，在与每个分隔槽相对的晶片的不活动侧中切割宽槽，并且通过沿着分隔槽锯切切割晶片，锯定位成使得 面对模具的锯片的侧面与宽壁的中点对准，从而在锯切壁的下半部分时，其余的凹槽被消除，留下壁的上半部分以防止锯切过程中的开裂和碎裂。
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公开(公告)号：US4814296A
公开(公告)日：1989-03-21
申请号：US90827
申请日：1987-08-28
IPC分类号： B28D5/00 , B27G19/10 , F28D5/00 , H01L21/301 , H01L21/304 , H01L21/306 , H01L27/148
CPC分类号： B27G19/10 , H01L21/3043 , Y10S148/028
摘要： A process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays wherein the active side of a wafer is etched to form small V-shaped grooves defining the die faces, relatively wide grooves are cut in the inactive side of the wafer opposite each V-shaped groove, and the wafer cut by sawing along the V-shaped grooves, the saw being located so that the side of the saw blade facing the die is aligned with the bottom of the V-shaped groove so that there is retained intact one side of the V-shaped groove to intercept and prevent cracks and chipping caused by sawing from damaging the die active surface and any circuits thereon.
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公开(公告)号：US4641949A
公开(公告)日：1987-02-10
申请号：US769515
申请日：1985-08-26
CPC分类号： G03G15/65 , B65H43/02 , G03G2215/00371 , G03G2215/00611 , G03G2215/00632 , G03G2215/00734
摘要： The present invention is concerned with a switching element comprised of oppositely disposed conductive fiber brushes and/or brush-like elements for detecting the presence or absence of paper at various locations in a xerographic copy machine. The oppositely disposed brushes are made from poly-acrylo-nitrile, a carbon based polymer material, which can be fabricated with relatively low values of resistance. Typical fiber bundles may consist of 6000 individual fibers each of 6-10 microns in diameter. In operation each individual conductive fiber acts as a separate electrical path through which the external circuit is completed. Passage of paper through the "nip" of the fiber to fiber electrical contact opens the circuit which is easily detected through associated circuitry which indicates the presence of paper. Likewise, arrays incorporating multiple such sensor switches may be fabricated for the purpose of indicating the size of the document interrupting specific low resistance fiber-fiber switches.
摘要翻译： 本发明涉及由相对设置的导电纤维刷和/或刷状元件组成的开关元件，用于在静电复印机中的各个位置检测是否存在纸。 相对布置的刷子由聚丙烯腈（碳 - 丙烯腈）制成，其可以制造成具有相对较低的电阻值。 典型的纤维束可以由直径为6-10微米的6000个单独纤维组成。 在操作中，每个单独的导电纤维作为外部电路完成的单独的电路径。 将纸通过纤维的“咬合”到纤维电接触，打开电路，通过指示纸张存在的相关电路容易地检测。 同样，可以制造并入多个这样的传感器开关的阵列，用于指示中断特定的低电阻光纤开关的文件尺寸。
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