-
公开(公告)号：US5521125A
公开(公告)日：1996-05-28
申请号：US328789
申请日：1994-10-28
申请人： Brian T. Ormond , Josef E. Jedlicka
发明人： Brian T. Ormond , Josef E. Jedlicka
IPC分类号： H01L21/304 , H01L21/78
CPC分类号： H01L21/78 , H01L21/3043
摘要： A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.
摘要翻译： 用于从晶圆制造半导体芯片的晶片设计和切割技术。 一系列氧化物层沉积在硅衬底表面的第一和第二区域中。 这些区域由其中没有氧化物层的街道分开，并且连续的氧化物层形成具有与硅衬底的表面垂直的表面的垂直壁。 冲击吸收材料沉积在街上，在其中形成凹面弯月面。 当晶片切成芯片时，吸震材料阻止硅颗粒轨迹运动。
-
2.发明授权Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same 有权具有减少滤光器薄膜边缘像素光电子的光学器件及其制造方法公开(公告)号：US06255133B1
公开(公告)日：2001-07-03
申请号：US09641292
申请日：2000-08-18
IPC分类号： H01L21302
CPC分类号： H01L27/14601 , H01L27/14632 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface. A first primary color filter layer is deposited over at least first inner photosite and first outer photosite, and the first primary color filter layer transmits a primary color.
摘要翻译： 本发明涉及在边缘像素上具有减小的滤光器薄化的电光装置，以及用于减少最接近诸如感光芯片的光电装置的边缘的像素上的滤光层的薄化的方法， 例如，在全色数字复印机或扫描仪中。 半导体晶片包括限定由凹槽分开的多个芯片区域和突片区域的主表面，其中所述芯片区域包括内部光斑，外部光电子和键合焊盘。 在突片区域的主表面上沉积多个堤坝，并且在主表面之外沉积清晰层，而不包括粘合垫。 或者，在除了接合焊盘之外的主表面上沉积透明层，然后将多个突片沉积在主表面上的突片区域中。 第一原色滤色器层沉积在至少第一内部光泽和第一外部光泽上，并且第一原色滤色器层透过原色。
-
3.发明授权Assembly for mounting semiconductor chips in a full-width-array image scanner 失效用于将半导体芯片安装在全宽阵列图像扫描器中的组件
公开(公告)号：US5545913A
公开(公告)日：1996-08-13
申请号：US330299
申请日：1994-10-17
IPC分类号： H01L25/04 , H01L31/0203 , H01L31/00
CPC分类号： H01L25/042 , H01L24/32 , H01L31/0203 , H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/10158
摘要： An assembly facilitates mounting a set of abutted semiconductor chips, such as chips aligned to form a single full-page-width linear array of photosensors in a digital scanner or copier. An elongated bead of electrically conductive adhesive extends along a surface of a support substrate. A plurality of semiconductor chips is disposed along the elongated bead, each semiconductor chip including a linear array of photosensors on a front surface thereof, and a back surface attached to the support substrate by the electrically conductive adhesive. A connection block is disposed along another portion of the elongated bead, the block including a first surface contacting the bead, a second surface, and a conductor extending from the first surface to the second surface.
摘要翻译： 组件有助于安装一组邻接的半导体芯片，例如对准的芯片，以在数字扫描器或复印机中形成光传感器的单个全页宽线性阵列。 导电粘合剂的细长珠沿着支撑基底的表面延伸。 多个半导体芯片沿着细长的凸条设置，每个半导体芯片包括前表面上的光电传感器的线性阵列和通过导电粘合剂附着到支撑基板的后表面。 连接块沿着细长的胎圈的另一部分设置，该块包括接触胎圈的第一表面，第二表面和从第一表面延伸到第二表面的导体。
-
4.发明授权Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same 有权具有减少滤光器薄膜边缘像素光电子的光学器件及其制造方法公开(公告)号：US06222180B1
公开(公告)日：2001-04-24
申请号：US09669124
申请日：2000-09-25
IPC分类号： G01J350
CPC分类号： H01L27/14632 , G01J3/51 , G01J3/513 , H01L27/14621 , H01L27/14687
摘要： The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.
摘要翻译： 本发明涉及具有减小的外部光斑的过滤器薄化的半导体器件以及用于减少外部光斑的滤光层的薄化的方法。 半导体器件包括主表面，该主表面包括限定在主表面中的多个光斑和接合焊盘，其中所述光斑包括内部光斑和外部光泽。 所述半导体器件还包括沉积在所述主表面上而不是所述接合焊盘和外部光泽的清晰层，以及沉积在至少第一内部光泽和第一外部光泽上的第一原色滤色器层，所述第一原色滤色器透过原色 。
-
公开(公告)号：US06198093B1
公开(公告)日：2001-03-06
申请号：US09196394
申请日：1998-11-19
IPC分类号： G01J350
CPC分类号： H01L27/14632 , G01J3/51 , G01J3/513 , H01L27/14621 , H01L27/14687
摘要： The present invention relates to semiconductor devices with a reduced filter thinning of outer photosites and a method for reducing the thinning of filter layers of the outer photosites. A semiconductor device includes a main surface including a plurality of photosites and bonding pads defined in the main surface, wherein the photosites include inner photosites and outer photosites. The semiconductor device further includes a clear layer deposited over the main surface exclusive of the bonding pads and outer photosites, and a first primary color filter layer deposited over at least first inner photosite and first outer photosite, the first primary color filter transmitting a primary color.
-
公开(公告)号：US06201293B1
公开(公告)日：2001-03-13
申请号：US09196462
申请日：1998-11-19
IPC分类号： H01L23495
CPC分类号： H01L27/14601 , H01L27/14632 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface. A first primary color filter layer is deposited over at least first inner photosite and first outer photosite, and the first primary color filter layer transmits a primary color.
-
公开(公告)号：US6165813A
公开(公告)日：2000-12-26
申请号：US416127
申请日：1995-04-03
IPC分类号： G02B27/00 , B41J2/155 , B41J2/16 , H01L21/98 , H01L27/14 , H01L29/06 , H01L33/00 , H04N1/028 , H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： H01L25/50 , B41J2/155 , B41J2/1601 , B41J2/1603 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1635 , B41J2202/19 , B41J2202/20 , H01L29/0657 , H01L2924/0002 , H01L2924/00
摘要： Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.
摘要翻译： 用于全页幅扫描器的光传感器阵列或全页宽喷墨打印机的半导体芯片安装在基板上，以保持相邻芯片之间的合理一致的间隔。 为了从阵列中除去有缺陷的芯片，衬底被均匀地推向限定凸弓的工作表面。 或者，沿着芯片的邻接边缘提供背切，并且围绕这些背切切割的硅可被锯掉以将有缺陷的芯片与邻近的好的芯片隔开。
-
公开(公告)号：US5604362A
公开(公告)日：1997-02-18
申请号：US603513
申请日：1996-02-20
IPC分类号： G02B5/20 , H01L21/02 , H01L27/14 , H01L31/0216 , H01L27/148
CPC分类号： H01L31/02162
摘要： In a photosensitive chip suitable for full-color imaging, separate photosites on the chip correspond to different primary colors in an original image. Each primary-color photosite is filtered with a polyimide doped to a particular primary color. The red-filtering layer and the blue-filtering layer are left on the non-photosensitive portions of the main surface of the chip, and together serve as a non-reflective area which prevents stray reflections from the chip. The chip is further provided with a base layer of infrared-filtering polyimide.
摘要翻译： 在适用于全彩色成像的感光芯片中，芯片上的独立照片对应于原始图像中的不同原色。 用掺杂到特定原色的聚酰亚胺过滤每个原色的光亮度。 红色滤光层和蓝色滤色层留在芯片的主表面的非感光部分上，并且一起用作防止来自芯片的杂散反射的非反射区域。 芯片还设置有红外滤光聚酰亚胺的基层。
-
9.发明授权Method of fabricating image sensor dies and the like for use in assembling arrays 失效制造用于组装阵列的图像传感器管芯等的方法
公开(公告)号：US5219796A
公开(公告)日：1993-06-15
申请号：US787444
申请日：1991-11-04
IPC分类号： H01L21/304 , H01L21/78 , H01L31/18
CPC分类号： H01L21/78 , H01L21/304 , H01L31/1804 , Y02E10/547 , Y10S148/028
摘要： An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.
摘要翻译： 用于形成具有允许模具与其它类似模具组装的面的单个模具的改进方法，以形成具有最小碎裂和断裂的一个和/或二维扫描阵列，其中晶片的活性侧被蚀刻以形成具有 与模具相邻的槽的壁具有相对宽的表面以便于锯切，在与每个分隔槽相对的晶片的不活动侧中切割宽槽，并且通过沿着分隔槽锯切切割晶片，锯定位成使得 面对模具的锯片的侧面与宽壁的中点对准，从而在锯切壁的下半部分时，其余的凹槽被消除，留下壁的上半部分以防止锯切过程中的开裂和碎裂。
-
10.发明授权Reflective test patches for translucent color filters in photosensitive semiconductor chips 失效光敏半导体芯片中半透明滤色片的反光测试贴片
公开(公告)号：US5808297A
公开(公告)日：1998-09-15
申请号：US693781
申请日：1996-07-22
申请人： Josef E. Jedlicka , Brian T. Ormond
发明人： Josef E. Jedlicka , Brian T. Ormond
CPC分类号： H01L27/14687 , H01L27/14621
摘要： Semiconductor chips for use in a chip array assembly for scanning of hard-copy images include rows of photosensors, each row of photosensors having a polyimide filter layer for passing one primary color. In addition to the photosensors, a reflective area is provided on the chip, with filter portions provided on the reflective area. The filter portions are created at the same time as the filter layers placed on the photosensors. The filter layers disposed on the reflective area can be used as test sites for determining the light transmissivity of the filter layers on the photosensors.
摘要翻译： 用于扫描硬拷贝图像的芯片阵列组件的半导体芯片包括光传感器行，每行光电传感器具有用于传递一种原色的聚酰亚胺滤光层。 除了光电传感器之外，在芯片上提供反射区域，其中设置在反射区域上的过滤部分。 过滤器部分与放置在光电传感器上的过滤层同时产生。 设置在反射区域上的滤光层可以用作测定光电传感器上的滤光层透光率的测试位置。
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.018 秒)
