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    Monolithic optical beam splitter with focusing lens
    2.
    发明授权
    Monolithic optical beam splitter with focusing lens 有权

    公开(公告)号：US09664909B1

    公开(公告)日：2017-05-30

    申请号：US13940130

    申请日：2013-07-11

    Applicant: KLA-Tencor Corporation

    Inventor： Bret Whiteside ,  Patrick Czarnota ,  Juergen Reich ,  Sam Shamouilian

    IPC: G02B27/14 ,  G02B27/10

    CPC classification number: G02B17/086 ,  G02B27/141

    Abstract: A beam splitter includes first and second prisms. The first prism includes first, second, and third optical surfaces. The second prism includes three surfaces, one of which faces the second surface of the first prism and both transmit and reflect light. The first surface of the first prism is curved and forms a lens for focusing light either transmitted or reflected by the common interface between the two prisms. The first prism is from a single piece of material. Fabrication includes making two cuts through a lens to cut-out an intermediate section. A portion of the intermediate section is cut-off to form the third surface of the first prism. The first surface of the first prism corresponds to the curved top surface of the lens. The second surface of the first prism corresponds to the bottom plano surface of the lens. The first and second prisms are then combined.

    Monitoring Incident Beam Position in a Wafer Inspection System
    3.
    发明申请
    Monitoring Incident Beam Position in a Wafer Inspection System 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US20140071437A1

    公开(公告)日：2014-03-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

    Multi-Spot Defect Inspection System
    4.
    发明申请
    Multi-Spot Defect Inspection System 有权
    多点缺陷检测系统

    公开(公告)号：US20140268118A1

    公开(公告)日：2014-09-18

    申请号：US13834662

    申请日：2013-03-15

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Zhiwei Xu ,  Christian Wolters ,  Juergen Reich ,  Bret Whiteside ,  Guoheng Zhao ,  Jijen Vazhaeparambil ,  Stephen Biellak ,  Sam Shamouilian ,  Mehdi Vaez-Iravani

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/956

    Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

    Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

    Multi-spot defect inspection system
    6.
    发明授权
    Multi-spot defect inspection system 有权
    多点缺陷检测系统

    公开(公告)号：US09182358B2

    公开(公告)日：2015-11-10

    申请号：US13834662

    申请日：2013-03-15

    Applicant: KLA-Tencor Corporation

    Inventor： Zhiwei Xu ,  Christian Wolters ,  Juergen Reich ,  Bret Whiteside ,  Guoheng Zhao ,  Jijen Vazhaeparambil ,  Stephen Biellak ,  Sam Shamouilian ,  Mehdi Vaez-Iravani

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/9501 ,  G01N21/956

    Abstract: The disclosure is directed to a system and method for inspecting a spinning sample by substantially simultaneously scanning multiple spots on a surface of the sample utilizing a plurality of illumination beams. Portions of illumination reflected, scattered, or radiated from respective spots on the surface of the sample are collected by at least one detector array. Information associated with at least one defect of the sample is determined by at least one computing system in communication with the detector array. According to various embodiments, at least one of scan pitch, spot size, spot separation, and spin rate is controlled to compensate pitch error due to tangential spot separation.

    Abstract translation: 本公开涉及一种用于通过基本上同时使用多个照明光束扫描样品表面上的多个点来检查纺丝样品的系统和方法。 通过至少一个检测器阵列收集从样品表面上的各个点反射，散射或辐射的照射部分。 与样品的至少一个缺陷相关联的信息由与检测器阵列通信的至少一个计算系统确定。 根据各种实施例，控制扫描间距，光斑尺寸，光点分离和旋转速率中的至少一个以补偿由于切点分离引起的俯仰误差。

    Monitoring incident beam position in a wafer inspection system
    10.
    发明授权
    Monitoring incident beam position in a wafer inspection system 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US08934091B2

    公开(公告)日：2015-01-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/00 ,  H01L21/67 ,  G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

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