公开(公告)号：US20180038803A1

公开(公告)日：2018-02-08

申请号：US15230330

申请日：2016-08-05

Applicant: KLA-Tencor Corporation

Inventor： Steve (Yifeng) Cui ,  Chunsheng Huang ,  Chunhai Wang ,  Christian Wolters ,  Bret Whiteside ,  Anatoly G. Romanovsky ,  Chuanyong Huang ,  Donald Warren Pettibone

IPC: G01N21/88 ,  G01N21/94 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

公开(公告)号：US10324045B2

公开(公告)日：2019-06-18

申请号：US15230330

申请日：2016-08-05

Applicant: KLA-Tencor Corporation

Inventor： Steve (Yifeng) Cui ,  Chunsheng Huang ,  Chunhai Wang ,  Christian Wolters ,  Bret Whiteside ,  Anatoly G. Romanovsky ,  Chuanyong Huang ,  Donald Warren Pettibone

IPC: G01N21/88 ,  G01N21/00 ,  G01N21/95 ,  G01N21/956

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.