公开(公告)号：US20160265904A1

公开(公告)日：2016-09-15

申请号：US15063057

申请日：2016-03-07

Applicant: KLA-Tencor Corporation

Inventor： Chunhai Wang ,  Chunsheng Huang ,  Andrew An Zeng ,  Frederick Arnold Goodman ,  Shouhong Tang ,  Yi Zhang

IPC: G01B11/06 ,  G02B27/28 ,  G02B17/00 ,  G01B11/24 ,  H04N5/225

CPC classification number: G01B11/06 ,  G01B9/02021 ,  G01B9/0203 ,  G01B11/24 ,  G01B11/2441 ,  G01B2290/70 ,  G02B17/008 ,  G02B27/283 ,  H04N5/225

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

Abstract translation: 半导体测量工具具有折射镜配置，其引导光束多次通过相同的空间以减小尺寸和占地面积。 此外，折叠镜可以以小于四十五度反射光束; 从而允许与现有技术相比较小的折叠镜。

公开(公告)号：US10324045B2

公开(公告)日：2019-06-18

申请号：US15230330

申请日：2016-08-05

Applicant: KLA-Tencor Corporation

Inventor： Steve (Yifeng) Cui ,  Chunsheng Huang ,  Chunhai Wang ,  Christian Wolters ,  Bret Whiteside ,  Anatoly G. Romanovsky ,  Chuanyong Huang ,  Donald Warren Pettibone

IPC: G01N21/88 ,  G01N21/00 ,  G01N21/95 ,  G01N21/956

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.

公开(公告)号：US09903708B2

公开(公告)日：2018-02-27

申请号：US15063057

申请日：2016-03-07

Applicant: KLA-Tencor Corporation

Inventor： Chunhai Wang ,  Chunsheng Huang ,  Andrew An Zeng ,  Frederick Arnold Goodman ,  Shouhong Tang ,  Yi Zhang

IPC: G01B9/02 ,  G01B11/06 ,  G01B11/24 ,  G02B17/00 ,  G02B27/28 ,  H04N5/225

CPC classification number: G01B11/06 ,  G01B9/02021 ,  G01B9/0203 ,  G01B11/24 ,  G01B11/2441 ,  G01B2290/70 ,  G02B17/008 ,  G02B27/283 ,  H04N5/225

Abstract: A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.

公开(公告)号：US10732424B2

公开(公告)日：2020-08-04

申请号：US16258543

申请日：2019-01-26

Applicant: KLA-Tencor Corporation

Inventor： Zhiwei Xu ,  Chunsheng Huang ,  Qing Li

IPC: G02B27/09 ,  G01N21/01 ,  G01N21/95

Abstract: A beam shaper for an optical inspection tool includes a focal lens to focus an optical beam onto a target at an oblique angle of incidence and a phase modulator to substantially flatten a top of the optical beam in the plane of the target when the optical beam is focused onto the target at the oblique angle of incidence.

公开(公告)号：US20190250414A1

公开(公告)日：2019-08-15

申请号：US16258543

申请日：2019-01-26

Applicant: KLA-Tencor Corporation

Inventor： Zhiwei Xu ,  Chunsheng Huang ,  Qing Li

IPC: G02B27/09 ,  G01N21/01

Abstract: A beam shaper for an optical inspection tool includes a focal lens to focus an optical beam onto a target at an oblique angle of incidence and a phase modulator to substantially flatten a top of the optical beam in the plane of the target when the optical beam is focused onto the target at the oblique angle of incidence.

公开(公告)号：US20180038803A1

公开(公告)日：2018-02-08

申请号：US15230330

申请日：2016-08-05

Applicant: KLA-Tencor Corporation

Inventor： Steve (Yifeng) Cui ,  Chunsheng Huang ,  Chunhai Wang ,  Christian Wolters ,  Bret Whiteside ,  Anatoly G. Romanovsky ,  Chuanyong Huang ,  Donald Warren Pettibone

IPC: G01N21/88 ,  G01N21/94 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/956

Abstract: Methods and systems for reducing illumination intensity while scanning over large particles are presented herein. A surface inspection system determines the presence of a large particle in the inspection path of a primary measurement spot using a separate leading measurement spot. The inspection system reduces the incident illumination power while the large particle is within the primary measurement spot. The primary measurement spot and the leading measurement spot are separately imaged by a common imaging collection objective onto one or more detectors. The imaging based collection design spatially separates the image of the leading measurement spot from the image of the primary measurement spot at one or more wafer image planes. Light detected from the leading measurement spot is analyzed to determine a reduced power time interval when the optical power of the primary illumination beam and the leading illumination beam are reduced.