Abstract:
Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.
Abstract:
The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.
Abstract:
A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Abstract:
A semiconductor measuring tool has a folding mirror configuration that directs a light beam to pass the same space multiple times to reduce the size and footprint. Furthermore, the folding mirrors may reflect the light beam at less than forty-five degrees; thereby allowing for smaller folding mirrors as compared to the prior art.
Abstract:
The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.
Abstract:
The present invention includes a laser diode, a laser controller configured to adjust a wavelength of illumination from the laser diode, a beam sampler configured to receive illumination from the laser diode and configured to direct a delivery portion of illumination to a phase-shifting interferometer, the beam sampler configured to direct a reference portion of illumination along a reference path, a detector configured to receive the reference portion of illumination, an amplitude controller configured to receive information associated with optical power of the reference portion of illumination from the detector and further configured to compare optical power of the reference portion of illumination with a selected optical power, and an optical amplitude modulator configured to adjust optical power of illumination received from a first portion of the illumination path, the optical amplitude modulator configured to transmit illumination having adjusted optical power along a second portion of the illumination path.
Abstract:
Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.
Abstract:
A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a first distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the first distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.