Method for Reducing Wafer Shape and Thickness Measurement Errors Resulted From Cavity Shape Changes
    1.
    发明申请
    Method for Reducing Wafer Shape and Thickness Measurement Errors Resulted From Cavity Shape Changes 有权
    降低由形状变化导致的晶圆形状和厚度测量误差的方法

    公开(公告)号:US20130182262A1

    公开(公告)日:2013-07-18

    申请号:US13742113

    申请日:2013-01-15

    CPC classification number: G01B9/02076 G01B9/02027

    Abstract: Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.

    Abstract translation: 公开了用于减小由腔形变化导致的晶片形状和厚度测量误差的方法和系统。 在晶片测量之前立即进行腔校准处理。 每次执行该方法时校准腔体特性可降低由腔体形状变化导致的晶片形状和厚度测量误差。 附加地或替代地,利用至少二阶多项式的多项式拟合过程用于腔倾斜估计。 使用高阶多项式生成的高阶腔形状信息考虑到由于温度变化,应力等引起的空腔形状变化,有效地提高了计算出的晶片形状和厚度信息的精度。

    Dual wavelength dual interferometer with combiner-splitter

    公开(公告)号:US09651359B2

    公开(公告)日:2017-05-16

    申请号:US14945847

    申请日:2015-11-19

    CPC classification number: G01B9/02027 G01B9/02007

    Abstract: The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.

    Dual Wavelength Dual Interferometer with Combiner-Splitter
    5.
    发明申请
    Dual Wavelength Dual Interferometer with Combiner-Splitter 有权
    双波长双干涉仪与组合分路器

    公开(公告)号:US20160146590A1

    公开(公告)日:2016-05-26

    申请号:US14945847

    申请日:2015-11-19

    CPC classification number: G01B9/02027 G01B9/02007

    Abstract: The system includes a dual interferometer sub-system including a first and second channel. The system includes an illumination source. The illumination source includes a first laser source disposed along a first input path and a second laser source disposed along a second input path. The illumination sources includes a combiner-splitter element optically coupled to an output of the first laser source and an output of the second laser source and is configured to combine light of a first wavelength from the first laser source and light of a second wavelength from the second laser source. The combiner-splitter element is further configured to split the combined light into a first channel and a second channel of the dual interferometer sub-system, where the first and second each receive a portion of the light of the first wavelength and the light of the second wavelength.

    Abstract translation: 该系统包括包括第一和第二通道的双干涉仪子系统。 该系统包括照明源。 照明源包括沿着第一输入路径设置的第一激光源和沿着第二输入路径设置的第二激光源。 照明源包括光耦合到第一激光源的输出和第二激光源的输出的组合器分离器元件,并且被配置为将来自第一激光源的第一波长的光和来自第一激光源的第二波长的光组合 第二激光源。 组合分离器元件还被配置为将组合的光分成双干涉仪子系统的第一通道和第二通道,其中第一和第二通道接收第一波长的光的一部分和 第二波长。

    Method and system for stabilizing power of tunable laser in wavelength-tuning phase shift interferometer
    6.
    发明授权
    Method and system for stabilizing power of tunable laser in wavelength-tuning phase shift interferometer 有权
    在波长调谐相移干涉仪中稳定可调谐激光功率的方法和系统

    公开(公告)号:US09151667B1

    公开(公告)日:2015-10-06

    申请号:US13693089

    申请日:2012-12-04

    Inventor: Yi Zhang

    Abstract: The present invention includes a laser diode, a laser controller configured to adjust a wavelength of illumination from the laser diode, a beam sampler configured to receive illumination from the laser diode and configured to direct a delivery portion of illumination to a phase-shifting interferometer, the beam sampler configured to direct a reference portion of illumination along a reference path, a detector configured to receive the reference portion of illumination, an amplitude controller configured to receive information associated with optical power of the reference portion of illumination from the detector and further configured to compare optical power of the reference portion of illumination with a selected optical power, and an optical amplitude modulator configured to adjust optical power of illumination received from a first portion of the illumination path, the optical amplitude modulator configured to transmit illumination having adjusted optical power along a second portion of the illumination path.

    Abstract translation: 本发明包括激光二极管,被配置为调节来自激光二极管的照明波长的激光控制器,束采样器,被配置为从激光二极管接收照明并被配置为将照明的传送部分引导到移相干涉仪, 所述光束采样器被配置为沿着参考路径引导照明的参考部分,被配置为接收照明的参考部分的检测器,被配置为从所述检测器接收与所述参考部分的光功率相关联的信息的幅度控制器,并进一步配置 将照明的参考部分的光功率与所选择的光功率进行比较;以及光学幅度调制器,被配置为调整从照明路径的第一部分接收的照明的光功率,所述光学幅度调制器被配置为传输具有调节的光功率的照明 沿着第二个港口 照明路径的离子。

    Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
    7.
    发明授权
    Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes 有权
    降低晶体形状和厚度测量误差的方法是由腔形变化引起的

    公开(公告)号:US09121684B2

    公开(公告)日:2015-09-01

    申请号:US13742113

    申请日:2013-01-15

    CPC classification number: G01B9/02076 G01B9/02027

    Abstract: Methods and systems for reducing wafer shape and thickness measurement errors resulted from cavity shape changes are disclosed. Cavity calibration process is performed immediately before the wafer measurement. Calibrating the cavity characteristics every time the method is executed reduces wafer shape and thickness measurement errors resulted from cavity shape changes. Additionally or alternatively, a polynomial fitting process utilizing a polynomial of at least a second order is utilized for cavity tilt estimation. High order cavity shape information generated using high order polynomials takes into consideration cavity shape changes due to temperature variations, stress or the like, effectively increases accuracy of the wafer shape and thickness information computed.

    Abstract translation: 公开了用于减小由腔形变化导致的晶片形状和厚度测量误差的方法和系统。 在晶片测量之前立即进行腔校准处理。 每次执行该方法时校准腔体特性可降低由腔体形状变化导致的晶片形状和厚度测量误差。 附加地或替代地,利用至少二阶多项式的多项式拟合过程用于腔倾斜估计。 使用高阶多项式生成的高阶腔形状信息考虑到由于温度变化,应力等引起的空腔形状变化,有效地提高了计算出的晶片形状和厚度信息的精度。

    REDUCING REGISTRATION ERROR OF FRONT AND BACK WAFER SURFACES UTILIZING A SEE-THROUGH CALIBRATION WAFER
    8.
    发明申请
    REDUCING REGISTRATION ERROR OF FRONT AND BACK WAFER SURFACES UTILIZING A SEE-THROUGH CALIBRATION WAFER 审中-公开
    使用透彻的校准波形减少正面和背面表面的注册错误

    公开(公告)号:US20150192404A1

    公开(公告)日:2015-07-09

    申请号:US14661718

    申请日:2015-03-18

    Abstract: A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a first distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the first distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.

    Abstract translation: 公开了一种用于校准干涉仪系统的校准晶片和方法。 校准方法包括:基于两个相对强度的帧确定校准晶片中限定的孔的位置; 比较孔的位置与使用外部测量装置测量的位置; 至少部分地基于比较结果调整第一光学倍率或第二光学倍率; 基于孔的位置的比较,为第一和第二强度帧中的每一个定义第一失真图; 通过对所述第一和第二强度帧中的每一个通过映射拟合所述第一失真图来生成扩展失真图; 以及利用所述第一和第二强度帧中的每一个的所述扩展失真图来减少随后测量过程中的注册误差或光学失真中的至少一个。

Patent Agency Ranking