Abstract:
The illumination module for emitting light (5) can operate in at least two different modes, wherein in each of the modes, the emitted light (5) has a different light distribution. The module has a mode selector (10) for selecting the mode in which the module operates, and it has an optical arrangement. The arrangement includes—a microlens array (LL1) with a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P (P1);—an illuminating unit for illuminating the microlens array (LL1). The illuminating unit includes a first array of light sources (S1) operable to emit light of a first wavelength L1 each and having an aperture each. The apertures are located in a common emission plane which is located at a distance D (D1) from the microlens array (LL1). In a first one of the modes, for the lens pitch P, the distance D and the wavelength L1 applies P2=2·L1·D/N wherein N is an integer with N≥1.
Abstract:
The present disclosure describes optical imaging and optical detection modules that include sensors such as time-of-flight (TOF) sensors. Various implementations are described that, in some instances, can help reduce the amount of optical cross-talk between active detection pixels and reference pixels and/or can facilitate the ability of the sensor to determine an accurate phase difference to be used, for example, in distance calculations.
Abstract:
The present disclosure describes modules operable to perform optical sensing. The module can be operable to distinguish between signals indicative of reflections from an object or interest and signals indicative of a spurious reflection such as from a smudge (i.e., a blurred or smeared mark) on the host device's cover glass. Signals assigned to reflections from the object of interest can be used to for various purposes, depending on the application (e.g., determining an object's proximity, a person's heart rate or a person's blood oxygen level).
Abstract:
Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
Abstract:
The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.
Abstract:
A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.
Abstract:
The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.
Abstract:
An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.
Abstract:
An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P2=2LD/N, wherein N is an integer with N≥1. High-contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.
Abstract:
Optoelectronic modules (100) are operable to distinguish between signals indicative of reflections from an object of interest and signals indicative of a spurious reflection. Various modules are operable to recognize spurious reflections by means of dedicated spurious-reflection detection pixels (126) and, in some cases, also to compensate for errors caused by spurious reflections.