公开(公告)号：US11654657B2

公开(公告)日：2023-05-23

申请号：US16757727

申请日：2018-10-24

Applicant: Corning Incorporated

Inventor： Robert George Manley ,  Rajesh Vaddi

IPC: B32B17/10 ,  C03C23/00 ,  C03C15/00 ,  B32B3/26 ,  B32B27/06 ,  B32B27/28 ,  B32B27/30 ,  H01L21/768 ,  C03C17/00

CPC classification number: B32B17/10 ,  B32B3/26 ,  B32B27/06 ,  B32B27/281 ,  B32B27/308 ,  C03C15/00 ,  C03C23/0025 ,  H01L21/76814 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2457/208 ,  C03C17/002 ,  C03C2203/10

Abstract: A sub-assembly includes a glass substrate, a plurality of electronic devices, and a passivation layer. The glass substrate includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. The passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes an opening to each laser damaged region of the plurality of laser damaged regions.

公开(公告)号：US20220212981A1

公开(公告)日：2022-07-07

申请号：US17609110

申请日：2020-05-13

Applicant: Corning Incorporated

Inventor： Ming-Huang Huang ,  Hoon Kim ,  Robert George Manley ,  Rajesh Vaddi ,  Nikolay Zhelev Zhelev ,  Bin Zhu

IPC: C03C17/09 ,  C03C17/00 ,  C03C3/091

Abstract: A method of depositing a copper film on a major surface of a glass sheet includes determining a desired range of a property of the copper film, correlating a thermal history of the glass sheet to the desired range of the property of the copper film, and depositing the copper film on the major surface of the glass sheet, wherein the property of the copper film deposited on the glass sheet is within the desired range. Correlating the thermal history of the glass sheet to the desired range of the property of the copper film can include heat treating glass sheet prior to depositing the copper film on the glass sheet.

公开(公告)号：US20190312067A1

公开(公告)日：2019-10-10

申请号：US15972628

申请日：2018-05-07

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Daniel Wayne Levesque, JR. ,  Robert George Manley ,  Garrett Andrew Piech ,  Rajesh Vaddi ,  Heather Nicole Vanselous

IPC: H01L27/12 ,  H01L27/15

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US20250008654A1

公开(公告)日：2025-01-02

申请号：US18710331

申请日：2022-11-08

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Mandakini Kanungo ,  Rajesh Vaddi

IPC: H05K1/11 ,  H05K1/09

Abstract: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface extending between the major surfaces. A first electrode is attached to the first major surface and a second electrode is attached to the second major surface. A first surface interconnect is electrically connected to the first electrode. A first extension portion extends beyond an edge plane. A second surface interconnect is electrically connected to the second electrode and includes a second extension portion extending beyond the edge plane. An anisotropic conductor defines a current path between the first electrode and the second electrode. The anisotropic conductor is attached to the edge surface and extends between the first extension portion and the second extension portion such that the current path extends along the first major surface, edge surface, and the second major surface. Methods of manufacturing an electronic apparatus are provided.

公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC classification number: H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US12046481B2

公开(公告)日：2024-07-23

申请号：US17641540

申请日：2020-09-09

Applicant: CORNING INCORPORATED

Inventor： Sean Matthew Garner ,  Robert George Manley ,  Rajesh Vaddi

IPC: H01L21/48 ,  H01L21/306 ,  H01L21/768 ,  H01L23/15 ,  H01L23/538

CPC classification number: H01L21/486 ,  H01L21/30604 ,  H01L21/76898 ,  H01L23/15 ,  H01L23/5384

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

公开(公告)号：US20240140864A1

公开(公告)日：2024-05-02

申请号：US18409103

申请日：2024-01-10

Applicant: CORNING INCORPORATED

Inventor： Hoon Kim ,  Prantik Mazumder ,  Aram Rezikyan ,  Rajesh Vaddi

IPC: C03C27/04 ,  C03C17/245 ,  C03C17/36

CPC classification number: C03C27/048 ,  C03C17/245 ,  C03C17/3607 ,  C23C18/1637

Abstract: In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

公开(公告)号：US20210135114A1

公开(公告)日：2021-05-06

申请号：US16471446

申请日：2017-12-19

Applicant: CORNING INCORPORATED

Inventor： Robert George Manley ,  Karan Mehrotra ,  Barry James Paddock ,  Rajesh Vaddi ,  Nikolay Zhelev Zhelev ,  Bin Zhu

IPC: H01L51/00 ,  H01L51/05 ,  G03F7/20

Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material

公开(公告)号：US20200095684A1

公开(公告)日：2020-03-26

申请号：US16578751

申请日：2019-09-23

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Yunfeng Gu ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: C23C18/16 ,  C25D3/38 ,  C25D5/54 ,  C23C18/38

Abstract: Methods of plating a metal on a substrate including coating a nanoporous metal-oxide layer on a surface of the substrate prior to metal plating. Methods may include coating a surface of the substrate with a slurry including colloidal metal-oxide precursor particles and aluminum oxide particles. After coating, the slurry may be calcinated on the surface of the substrate to form a nanoporous metal-oxide layer on the surface. Then, a metallic film may be plated on the nanoporous metal-oxide layer. The metallic film may be plated by an electroless plating method and/or an electroplating method. Articles, such as electronic interposers, may be made using the methods of plating a metal described herein.

公开(公告)号：US11756847B2

公开(公告)日：2023-09-12

申请号：US17846320

申请日：2022-06-22

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/15 ,  C23C26/00 ,  H01L21/481 ,  H01L23/49827 ,  H01L23/49894

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.