公开(公告)号：US12046591B2

公开(公告)日：2024-07-23

申请号：US17434835

申请日：2021-04-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xuan Liang ,  Meili Wang ,  Fei Wang ,  Xue Dong ,  Qi Qi

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L25/167 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/46 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/0568 ,  H01L2224/0603 ,  H01L2224/08145 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48141 ,  H01L2224/48992 ,  H01L2224/85007 ,  H01L2924/0132 ,  H01L2924/12041

Abstract: A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

公开(公告)号：US11994696B2

公开(公告)日：2024-05-28

申请号：US17483530

申请日：2021-09-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Kang Guo ,  Renquan Gu ,  Xin Gu ,  Feng Zhang ,  Meili Wang ,  Guangcai Yuan ,  Xue Dong ,  Mengya Song ,  Duohui Li ,  Qi Yao ,  Jing Yu

IPC: G02B30/27 ,  H04N13/305

CPC classification number: G02B30/27 ,  H04N13/305

Abstract: Embodiments of the present application disclose a method for manufacturing a naked-eye 3D device and a naked-eye 3D device. The method includes: forming a display module including a plurality of pixel islands; forming a spacer layer on the display module; and forming a micro-lens array on the spacer layer, wherein the spacer layer is formed to have a thickness such that the plurality of pixel islands are located at a focal plane of the micro-lens array. The method further includes: forming an alignment mark between the spacer layer and the display module, wherein the alignment mark is used for, when forming the micro-lens array, aligning each micro-lens in the micro-lens array with one of the plurality of pixel islands.

公开(公告)号：US20220293635A1

公开(公告)日：2022-09-15

申请号：US17529969

申请日：2021-11-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chenyang Zhang ,  Fuqiang Li ,  Xue Dong ,  Meili Wang ,  Xuan Liang ,  Fei Wang ,  Mingxing Wang ,  Zhanfeng Cao ,  Yanling Han ,  Xinxin Zhao

IPC: H01L27/12

Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.

公开(公告)号：US10996517B2

公开(公告)日：2021-05-04

申请号：US16081804

申请日：2018-02-11

Applicant: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Fei Wang ,  Xiandong Meng ,  Meili Wang ,  Huijuan Wang

IPC: G02F1/13357 ,  G02F1/1335

Abstract: A backlight includes a plurality of light sources of at least three different colors disposed on a base substrate, and a plurality of grating units that are disposed on a light exit side of the plurality of light sources and are in one-to-one correspondence with the plurality of light sources. Each of the plurality of grating units is used for splitting light emitted by a corresponding one of the plurality of light sources to form in an array of uniformly distributed monochromatic spots, so that the backlight may form an array of colored spots in which at least three different colors of light spots are alternately arranged in sequence along a first direction, wherein the first direction is a row direction or a column direction of the array of colored spots.

公开(公告)号：US10249571B2

公开(公告)日：2019-04-02

申请号：US15127991

申请日：2015-10-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Meili Wang

IPC: H01L23/552 ,  H01L29/786 ,  H01L21/28 ,  H01L27/12 ,  H01L29/66

Abstract: A thin film transistor comprises an active layer; a light-protection layer disposed above the active layer and/or disposed beneath the active layer, the light-protection layer being configured to absorb light having a predetermined wavelength. By providing a light-protection layer above the active layer, light incident onto the channel region from top of the thin film transistor can be absorbed, while by providing a light-protection layer under the active layer, light incident onto the channel region from bottom of the thin film transistor can be absorbed, thereby effectively avoiding influence of light on the active layer of the channel region and ensuring a relatively strong light stability of the driving transistor in the thin film transistor. A method for manufacturing a thin film transistor and an array substrate comprising the thin film transistor as well as an array substrate and a display device comprising the thin film transistor are further provided.

公开(公告)号：US10199395B2

公开(公告)日：2019-02-05

申请号：US15122902

申请日：2015-07-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Meili Wang

IPC: H01L27/12 ,  H01L29/66 ,  H01L29/786 ,  H01L21/4763 ,  H01L29/45

Abstract: The present disclosure provides a metal oxide thin film transistor, wherein an oxygen deficiency adsorptive removal layer comprising an oxygen deficiency adsorptive removal material is provided between an active layer and a source, and/or between the active layer and a drain. The standard Gibbs free energy of formation of an oxide of the oxygen deficiency adsorptive removal material in a unit volume is larger than that of a metal oxide in the active layer. The present disclosure further provides a display substrate comprising the metal oxide thin film transistor and a display device comprising the display substrate.

公开(公告)号：US09620648B2

公开(公告)日：2017-04-11

申请号：US14555804

申请日：2014-11-28

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Meili Wang ,  Longbao Xin

IPC: H01L29/10 ,  H01L29/12 ,  H01L21/00 ,  H01L21/16 ,  H01L29/786 ,  H01L29/34 ,  H01L29/66

CPC classification number: H01L29/7869 ,  H01L29/34 ,  H01L29/66969 ,  H01L29/78618

Abstract: The invention provides a thin film transistor, an array substrate and a display device. The thin film transistor comprises a conductive oxygen vacancy reducing layer for reducing oxygen vacancies in an active layer. The oxygen vacancy reducing layer is disposed between the active layer and a source and/or the active layer and a drain. With the oxygen vacancy reducing layer, the number of the oxygen vacancies in the active layer is decreased greatly, which improves transmission rate of carriers and simultaneously reduces value of subthreshold swing of the thin film transistor.

公开(公告)号：US20240339459A1

公开(公告)日：2024-10-10

申请号：US18580211

申请日：2023-02-20

Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Meili Wang ,  Lei Wang ,  Wei Sun ,  Zhongyuan Wu ,  Xue Dong ,  Wenchao Han ,  Shuilang Dong

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/1218 ,  H01L27/1262

Abstract: A display device and a manufacturing method therefor are provided by the present application. The display devices can greatly increase the bonding precision of the chip packaging unit and the display panel, thereby the quantity of the output channels of chip packaging unit are greatly increased, thus the requirements of the high-resolution display products are satisfied. A chip packaging component is formed, wherein the chip packaging component includes at least one chip packaging unit; and the chip packaging unit includes at least a flexible base, a rigid base disposed at one side of the flexible base, and a lead layer disposed at one side of the flexible base away from the rigid base, lead layer includes at least a plurality of first leads, and orthographic projections of the plurality of first leads on the flexible base are located within an orthographic projection of rigid base on the flexible base.

公开(公告)号：US10890801B2

公开(公告)日：2021-01-12

申请号：US16318886

申请日：2018-04-23

Applicant: Beijing BOE Display Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Meili Wang ,  Xiaoling Xu ,  Yuanxin Du

IPC: G02F1/1335 ,  G02F1/133 ,  G09G3/36 ,  G02F1/13357

Abstract: The present disclosure relates to the field of display technology, and provides a backlight module, a display device, and a fabricating method for the backlight module. Specifically, the backlight module includes a first substrate having a first surface and a second surface opposite to each other, a plurality of light emitting units arranged in an array on the first surface of the first substrate, a metal wire grid polarizer on the second surface of the first substrate, and a driving circuit. The driving circuit is electrically connected to the plurality of light emitting units to drive the plurality of light emitting units to emit light toward the first substrate.

公开(公告)号：US20190196401A1

公开(公告)日：2019-06-27

申请号：US15750917

申请日：2017-07-24

Applicant: Boe Technology Group Co., LTD

Inventor： Jifeng Tan ,  Xue Dong ,  Wei Wang ,  Xin Gu ,  Feng Guan ,  Meili Wang

IPC: G03H1/22

Abstract: A reflective holographic display apparatus and a display method thereof are disclosed. The reflective holographic display apparatus includes a front light source module, a display panel and a phase plate. The front light source module is configured to provide reference lights; the display panel is configured to adjust amplitude information of the reference lights, wherein the display panel includes a reflective layer and the front light source module is located at a light exit side of the display panel; and the phase plate is configured to adjust phase information of the reference lights and located at a light exit side of the reflective layer.