公开(公告)号：US10918298B2

公开(公告)日：2021-02-16

申请号：US12968637

申请日：2010-12-15

申请人： John A. Rogers ,  Dae Hyeong Kim ,  Joshua D. Moss ,  David J. Callans ,  Brian Litt ,  Jonathan Viventi

发明人： John A. Rogers ,  Dae Hyeong Kim ,  Joshua D. Moss ,  David J. Callans ,  Brian Litt ,  Jonathan Viventi

IPC分类号： A61B5/042 ,  A61N1/05 ,  H01L23/31 ,  A61B5/07 ,  H05K1/02 ,  A61B5/00 ,  A61N1/04 ,  H01L23/00 ,  H05K3/32 ,  H01L29/786 ,  H05K1/14 ,  H01L21/683 ,  H01L27/12 ,  A61N1/36

摘要： Provided herein are biomedical devices and methods of making and using biomedical devices for sensing and actuation applications. For example, flexible and/or stretchable biomedical devices are provided including electronic devices useful for establishing in situ conformal contact with a tissue in a biological environment. The invention includes implantable electronic devices and devices administered to the surfaces(s) of a target tissue, for example, for obtaining electrophysiology data from a tissue such as cardiac, brain tissue or skin.

公开(公告)号：US10441185B2

公开(公告)日：2019-10-15

申请号：US13492636

申请日：2012-06-08

申请人： John A. Rogers ,  Dae-Hyeong Kim

发明人： John A. Rogers ,  Dae-Hyeong Kim

IPC分类号： A61B5/0408 ,  A61B5/00 ,  A61N1/05 ,  A61B5/042 ,  A61B5/07 ,  A61N1/36 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18 ,  A61N1/04 ,  A61B5/11 ,  H01L29/786 ,  H01L27/12 ,  H05K1/14 ,  H05K3/32 ,  A61B5/053 ,  A61B5/0428 ,  A61B5/0478 ,  A61B5/0492

摘要： Provided herein are skin-mounted biomedical devices and methods of making and using biomedical devices for sensing and actuation applications. For example, flexible and/or stretchable biomedical devices are provided, including electronic devices useful for establishing conformal contact with the skin of a subject. Devices disclosed herein can comprise a plurality of sensing and/or actuating devices provided as part of a skin-mounted flexible or stretchable electronic circuit.

公开(公告)号：US08470701B2

公开(公告)日：2013-06-25

申请号：US12418071

申请日：2009-04-03

申请人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

发明人： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

IPC分类号： H01L21/20

CPC分类号： H01L21/20 ,  B81B7/0093 ,  B81C1/0038 ,  B81C2201/0191 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

摘要： Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

摘要翻译： 公开了各种散热部件和制造散热部件的方法，其中与一个或多个发热部件热接触的金刚石能够散热，从而提供热调节部件。 导热金刚石以能够提供有效和最大的热传递的图案提供，远离可能易受高温损坏的部件。 这些器件和方法用于冷却易于产生显着热量的柔性电子器件，集成电路和其他复杂电子器件。 还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

公开(公告)号：US20130072775A1

公开(公告)日：2013-03-21

申请号：US13486726

申请日：2012-06-01

申请人： John ROGERS ,  Dae-Hyeong KIM ,  Brian LITT ,  Jonathan VIVENTI

发明人： John ROGERS ,  Dae-Hyeong KIM ,  Brian LITT ,  Jonathan VIVENTI

IPC分类号： A61B5/0478 ,  A61F2/72 ,  A61N5/06 ,  A61N1/36 ,  A61M5/20

CPC分类号： A61B5/0478 ,  A61B5/04001 ,  A61B5/4094 ,  A61B5/4836 ,  A61B5/6868 ,  A61B5/7246 ,  A61B5/7267 ,  A61B5/7282 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/164 ,  A61F2/72 ,  A61M5/20 ,  A61M5/31 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/36017 ,  A61N1/36025 ,  A61N1/3606 ,  A61N5/0601 ,  A61N2005/063

摘要： Provided are methods and devices for interfacing with brain tissue, specifically for monitoring and/or actuation of spatio-temporal electrical waveforms. The device is conformable having a high electrode density and high spatial and temporal resolution. A conformable substrate supports a conformable electronic circuit and a barrier layer. Electrodes are positioned to provide electrical contact with a brain tissue. A controller monitors or actuates the electrodes, thereby interfacing with the brain tissue. In an aspect, methods are provided to monitor or actuate spatio-temporal electrical waveform over large brain surface areas by any of the devices disclosed herein.

公开(公告)号：US08361177B2

公开(公告)日：2013-01-29

申请号：US12333170

申请日：2008-12-11

申请人： Dae Hyeong Kim ,  Seok Min Hong ,  Jae Hyun Jeon ,  Un Gyu Park ,  Jea Gun Park ,  Yong Kuk Kim

发明人： Dae Hyeong Kim ,  Seok Min Hong ,  Jae Hyun Jeon ,  Un Gyu Park ,  Jea Gun Park ,  Yong Kuk Kim

IPC分类号： B24D3/02 ,  C09C1/68 ,  C09K3/14 ,  C09K13/00 ,  H01L21/302 ,  C09G1/02

CPC分类号： B82Y30/00 ,  C01F17/0043 ,  C01P2004/52 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/22 ,  C09G1/02 ,  C09K3/1463

摘要： Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a barrier film in a shallow trench isolation CMP process needed to fabricate ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 μm or less) and which decreases the occurrence of scratches on a flattened surface, and a method of polishing a substrate using the same.

摘要翻译： 公开了一种抛光浆料，特别是用于化学机械抛光的浆料，其用于化学机械抛光工艺以使半导体层压体变平。 更具体地说，本发明提供一种制备浆料的方法，该方法对于在制造256兆D-RAM或更高的超高度集成半导体所需的浅沟槽隔离CMP工艺中，对用作阻挡膜的氮化物层具有高的去除选择性（ 设计规则为0.13μm以下），并且减少了在平坦化表面上的划痕的发生，以及使用其抛光基板的方法。

公开(公告)号：US08062547B2

公开(公告)日：2011-11-22

申请号：US11421965

申请日：2006-06-02

申请人： Un Gyu Paik ,  Jea Gun Park ,  Sang Kyun Kim ,  Ye Hwan Kim ,  Myoung Won Suh ,  Dae Hyeong Kim

发明人： Un Gyu Paik ,  Jea Gun Park ,  Sang Kyun Kim ,  Ye Hwan Kim ,  Myoung Won Suh ,  Dae Hyeong Kim

IPC分类号： C09K13/00

CPC分类号： C23F3/04 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/3212

摘要： A CMP slurry is provided comprising polishing particles, the polishing particle comprising organically modified colloidal silica. Also, a method of preparing a CMP slurry is provided, comprising the steps of: preparing polishing particles comprising organically modified silica; converting the polishing particles into an aqueous state; and adding pure water, a hydrophilic additive and a dispersing agent to the polishing particles. The polishing particles can be synthesized using a sol-gel process. According to the invention, a slurry having excellent polishing properties can be prepared, in which the surface properties of colloidal silica are changed to control the physical properties of the polishing particles and which can ensure a desired CMP removal rate while minimizing the occurrence of scratches.

摘要翻译： 提供包括抛光颗粒的CMP浆料，抛光颗粒包含有机改性的胶体二氧化硅。 另外，提供了制备CMP浆料的方法，包括以下步骤：制备包含有机改性二氧化硅的抛光颗粒; 将抛光颗粒转化成水状态; 并向抛光颗粒中加入纯水，亲水性添加剂和分散剂。 抛光颗粒可以使用溶胶 - 凝胶法合成。 根据本发明，可以制备具有优异抛光性能的浆料，其中改变胶体二氧化硅的表面性能以控制抛光颗粒的物理性质，并且可以确保所需的CMP去除速率同时最小化划痕的发生。

公开(公告)号：US20100002402A1

公开(公告)日：2010-01-07

申请号：US12398811

申请日：2009-03-05

申请人： John A. Rogers ,  Yonggang Huang ,  Heung Cho Ko ,  Mark Stoykovich ,  Won Mook Choi ,  Jizhou Song ,  Jong Hyun Ahn ,  Dae Hyeong Kim

发明人： John A. Rogers ,  Yonggang Huang ,  Heung Cho Ko ,  Mark Stoykovich ,  Won Mook Choi ,  Jizhou Song ,  Jong Hyun Ahn ,  Dae Hyeong Kim

IPC分类号： H05K1/00 ,  B23P17/00 ,  B05D5/12

CPC分类号： H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

摘要翻译： 本文公开了可拉伸，可折叠和任选可印刷的制造方法，用于制造当拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的诸如半导体，电子电路及其部件的装置和装置。 应变隔离层为功能器件层提供了良好的应变隔离。 多层器件被构造成将中性机械表面重合或接近具有易受应变引起的故障的材料的功能层。 中性机械表面由具有空间不均匀性质的一个或多个层定位，例如通过图案化多层器件的任何层。

公开(公告)号：US20090133336A1

公开(公告)日：2009-05-28

申请号：US12333170

申请日：2008-12-11

申请人： Dae Hyeong Kim ,  Seok Min Hong ,  Jae Hyun Jeon ,  Un Gyu Paik ,  Jea Gun Park ,  Yong Kuk Kim

发明人： Dae Hyeong Kim ,  Seok Min Hong ,  Jae Hyun Jeon ,  Un Gyu Paik ,  Jea Gun Park ,  Yong Kuk Kim

IPC分类号： C09G1/02 ,  C09K3/14

CPC分类号： B82Y30/00 ,  C01F17/0043 ,  C01P2004/52 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/22 ,  C09G1/02 ,  C09K3/1463

摘要： Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry which has high removal selectivity to a nitride layer used as a barrier film in a shallow trench isolation CMP process needed to fabricate ultra highly integrated semiconductors of 256 mega D-RAM or more (Design rule of 0.13 μm or less) and which decreases the occurrence of scratches on a flattened surface, and a method of polishing a substrate using the same.

公开(公告)号：US08934965B2

公开(公告)日：2015-01-13

申请号：US13486726

申请日：2012-06-01

申请人： John Rogers ,  Dae-Hyeong Kim ,  Brian Litt ,  Jonathan Viventi

发明人： John Rogers ,  Dae-Hyeong Kim ,  Brian Litt ,  Jonathan Viventi

IPC分类号： A61B5/04 ,  A61N5/06 ,  A61M5/20 ,  A61B5/00 ,  A61N1/05 ,  A61B5/0478 ,  A61F2/72 ,  A61N1/00 ,  A61N1/36

CPC分类号： A61B5/0478 ,  A61B5/04001 ,  A61B5/4094 ,  A61B5/4836 ,  A61B5/6868 ,  A61B5/7246 ,  A61B5/7267 ,  A61B5/7282 ,  A61B2562/046 ,  A61B2562/125 ,  A61B2562/164 ,  A61F2/72 ,  A61M5/20 ,  A61M5/31 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/36017 ,  A61N1/36025 ,  A61N1/3606 ,  A61N5/0601 ,  A61N2005/063

摘要： Provided are methods and devices for interfacing with brain tissue, specifically for monitoring and/or actuation of spatio-temporal electrical waveforms. The device is conformable having a high electrode density and high spatial and temporal resolution. A conformable substrate supports a conformable electronic circuit and a barrier layer. Electrodes are positioned to provide electrical contact with a brain tissue. A controller monitors or actuates the electrodes, thereby interfacing with the brain tissue. In an aspect, methods are provided to monitor or actuate spatio-temporal electrical waveform over large brain surface areas by any of the devices disclosed herein.

摘要翻译： 提供了用于与脑组织接口的方法和装置，专门用于监测和/或致动时空电波形。 该器件具有高电极密度和高空间和时间分辨率的一致性。 一个适应性的基底支持符合规定的电子电路和阻挡层。 定位电极以提供与脑组织的电接触。 控制器监测或致动电极，从而与脑组织接触。 在一方面，提供了通过本文公开的任何装置来监测或致动大脑表面区域上的时空电波形的方法。

公开(公告)号：US20140140020A1

公开(公告)日：2014-05-22

申请号：US13974963

申请日：2013-08-23

申请人： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

发明人： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

IPC分类号： H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

摘要翻译： 本文公开了可拉伸，可折叠和任选可印刷的制造方法，用于制造当拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的诸如半导体，电子电路及其部件的装置和装置。 应变隔离层为功能器件层提供了良好的应变隔离。 多层器件被构造成将中性机械表面重合或接近具有易受应变引起的故障的材料的功能层。 中性机械表面由具有空间不均匀性质的一个或多个层定位，例如通过图案化多层器件的任何层。