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公开(公告)号：CN1320957A
公开(公告)日：2001-11-07
申请号：CN00122531.6
申请日：2000-08-04
Applicant: 富士通株式会社
CPC classification number: H01L21/563 , H01L21/67092 , H01L21/67144 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75743 , H01L2224/81191 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83859 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/83885 , H01L2224/83951 , H01L2224/85444 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/05599
Abstract: 一种安装半导体芯片的方法,其中通过用作为底填料的粘合剂填充芯片和基板之间的间隙来安装IC芯片。底填料的轮廓线做成具有需要的形状。为此,提供有突点的磁头IC芯片放置在由底填料粘合剂覆盖并提供有焊盘的悬杆上。一焊接工具按压磁头IC芯片并对磁头IC芯片施加超声振荡,以将突点正确地焊接到焊盘上。当按压磁头IC芯片并进行超声振荡时,发出紫外线108以硬化在磁头IC芯片11和悬杆12之间扩展的粘合剂151的周边部分151a。
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公开(公告)号：CN1279464A
公开(公告)日：2001-01-10
申请号：CN00108119.5
申请日：2000-04-28
Applicant: 富士通株式会社
IPC: G11B5/60 , H01L21/607
CPC classification number: H01L24/81 , B23K1/0008 , B23K2101/40 , G11B5/4806 , G11B5/486 , G11B33/122 , H01L24/75 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/742 , H01L2224/75 , H01L2224/75302 , H01L2224/75303 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: 将磁头IC芯片装在悬浮件上将引起形变,本发明可以防止磁盘装置中磁头组件的悬浮件发生这种形变。装在悬浮件上的磁头IC芯片具有金做的凸出电极。悬浮件具有连接于磁头IC芯片相应凸出电极上的电极托。各个电极托具有金做的表面层。采用超声焊接法将磁头IC芯片的凸出电极焊接在悬浮件的电极托上。
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