公开(公告)号：US12216402B2

公开(公告)日：2025-02-04

申请号：US18503696

申请日：2023-11-07

Applicant: International Business Machines Corporation

Inventor： Gerhard Ingmar Meijer ,  Valery Weber ,  Peter Willem Jan Staar

IPC: G03F7/004 ,  C07C309/06 ,  C07C309/19 ,  C07C309/30 ,  C07C309/39 ,  C07C311/48 ,  C07C381/12 ,  C07D285/16 ,  C07F7/22 ,  C07F9/92 ,  C07F9/94 ,  G03F7/26 ,  G03F7/20

Abstract: The present invention relates to a novel photoacid generator compound cation, comprising an element having for 92 eV photons (extreme ultraviolet (EUV)) an absorption cross section of at least 0.5×107·cm2/mol; having at least two stable oxidation states; and selected from the elements of group 1 to group 15 of the periodic table of the elements. Additionally, the present invention relates to a photoacid generator comprising said photoacid generator compound cation and an anion. Furthermore, the present invention aims to provide a photoresist composition comprising said photoacid generator and an acid labile polymer. Finally, the present invention relates to a method of generating an acid using the photoresist composition and a method of forming a patterned materials feature on a substrate.

公开(公告)号：US20240382994A1

公开(公告)日：2024-11-21

申请号：US18789862

申请日：2024-07-31

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chun-wei LIAO ,  Tung-Hung FENG ,  Hui-Chun LEE ,  Shih-Che WANG

IPC: B05B15/58 ,  G03F7/26

Abstract: A method for a semiconductor manufacturing process includes circulating a solution from a tank using a pump and receiving the solution from the pump at an inlet of a valve. When a manufacturing operation occurs, the solution is directed to a first outlet of the valve that is connected to a nozzle used in the manufacturing operation. When the manufacturing operation is idle, the solution is directed to a second outlet connected to a recirculation path; and recirculated back to the tank via the recirculation path for re-use in the manufacturing operation.

公开(公告)号：US20240353094A1

公开(公告)日：2024-10-24

申请号：US18689367

申请日：2022-08-31

Applicant: Proterial, Ltd.

Inventor： Akira Sasaki

IPC: F22B1/28 ,  G03F7/26 ,  G05D7/06 ,  H01L21/67 ,  H05B3/20

CPC classification number: F22B1/284 ,  G05D7/0635 ,  H05B3/20 ,  G03F7/26 ,  H01L21/67017 ,  H05B2203/021 ,  H05B2203/022 ,  H05B2203/037

Abstract: This vaporizer comprises: a vaporizing unit for vaporizing a precursor to generate a material gas; a gas flow passageway for guiding the generated material gas to the outside of the vaporizing unit; a first heater for heating the vaporizing unit but not heating the gas flow passageway; and a second heater for heating both the vaporizing unit and the gas flow passageway. In variations, one of the first heater and the second heater has a planar shape, and include a portion having a large power consumption and a portion having a small power consumption per unit area.

公开(公告)号：US12078932B2

公开(公告)日：2024-09-03

申请号：US17050112

申请日：2019-04-23

Applicant: XEIKON PREPRESS N.V.

Inventor： Bart Wattyn

IPC: B41N3/00 ,  B41C1/02 ,  G03F7/26 ,  G03F7/30

CPC classification number: G03F7/3064 ,  B41C1/02 ,  B41N3/00 ,  B41N3/006 ,  G03F7/26

Abstract: An apparatus for treating a relief plate precursor, such as a printing plate precursor, preferably with a liquid. The apparatus includes a transport system with at least one, preferably at least two transport bars; a plate coupling station configured for coupling a relief plate precursor to the transport bar; a treatment compartment configured for treating the relief plate precursor; and a plate decoupling station configured for decoupling the treated relief plate precursor from the transport bar. The transport system is configured to automatically move each transport bar, after being coupled to a relief plate precursor in the plate coupling station, from the plate coupling station through the treatment station to the plate decoupling station, and, after being decoupled from a treated relief plate precursor, from the plate decoupling station back to the plate coupling station, such that the transport bar moves in a closed loop through the apparatus.

公开(公告)号：US20240179848A1

公开(公告)日：2024-05-30

申请号：US18551955

申请日：2022-03-23

Applicant: NAMICS CORPORATION

Inventor： Naoki OBATA ,  Makiko SATO

IPC: H05K3/10 ,  C23C18/16 ,  C23C18/38 ,  C23C28/02 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  G03F7/00 ,  G03F7/16 ,  G03F7/26 ,  H05K3/18

CPC classification number: H05K3/108 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/38 ,  C23C28/023 ,  C25D3/38 ,  C25D5/022 ,  C25D7/123 ,  G03F7/0035 ,  G03F7/16 ,  G03F7/26 ,  H05K3/18 ,  H05K3/184 ,  H05K2203/072 ,  H05K2203/0723

Abstract: The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.

公开(公告)号：US11960208B2

公开(公告)日：2024-04-16

申请号：US17053266

申请日：2019-05-08

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Masakazu Kume ,  Hiroshi Ono

IPC: G03F7/09 ,  G03F7/038 ,  G03F7/11 ,  G03F7/26 ,  H05K1/03

CPC classification number: G03F7/091 ,  G03F7/0382 ,  G03F7/11 ,  G03F7/26 ,  H05K1/036 ,  H05K1/0373

Abstract: A photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin and an ultraviolet absorber.

公开(公告)号：US20240117102A1

公开(公告)日：2024-04-11

申请号：US18273014

申请日：2022-01-11

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： Kodai MATSUURA ,  Junya HORIUCHI ,  Yu OKADA ,  Tadashi OMATSU ,  Masatoshi ECHIGO

IPC: C08G61/02 ,  C08G8/16 ,  C08G8/22 ,  G03F7/038 ,  G03F7/039 ,  G03F7/11 ,  G03F7/22 ,  G03F7/26 ,  H01L21/027

CPC classification number: C08G61/025 ,  C08G8/16 ,  C08G8/22 ,  G03F7/038 ,  G03F7/039 ,  G03F7/11 ,  G03F7/22 ,  G03F7/26 ,  H01L21/027

Abstract: A polymer having a constituent unit derived from a monomer represented by the following formula (0), wherein the polymer has sites in which the constituent units are linked by direct bonding between aromatic rings of the monomer represented by the formula (0):




wherein R is a monovalent group, and m is an integer of 1 to 5, wherein at least one R is a hydroxyl group, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, or an amino group having 0 to 40 carbon atoms and optionally having a substituent.

公开(公告)号：US20240109997A1

公开(公告)日：2024-04-04

申请号：US18277366

申请日：2022-01-28

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： Junya HORIUCHI ,  Takashi MAKINOSHIMA ,  Takashi SATO ,  Masatoshi ECHIGO

IPC: C08G8/20 ,  G03F7/11 ,  G03F7/20 ,  G03F7/26 ,  H01L21/027

CPC classification number: C08G8/20 ,  G03F7/11 ,  G03F7/20 ,  G03F7/26 ,  H01L21/0274

Abstract: An object of the present invention is to provide a novel resin that is useful as a film forming material for lithography and the like. The problem can be solved by a resin containing a constituent unit represented by the following formula (1) or (1)′:




wherein the variables in the formulas are as described in the specification.

公开(公告)号：US20230393474A1

公开(公告)日：2023-12-07

申请号：US18231447

申请日：2023-08-08

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： An-Ren ZI ,  Ching-Yu Chang

IPC: G03F7/09 ,  G03F7/039 ,  C08L101/02 ,  G03F7/004 ,  G03F7/26

CPC classification number: G03F7/094 ,  G03F7/039 ,  C08L101/02 ,  G03F7/0042 ,  G03F7/26

Abstract: A method of manufacturing a semiconductor device includes forming a photoresist underlayer including a photoresist underlayer composition over a semiconductor substrate and forming a photoresist layer comprising a photoresist composition over the photoresist underlayer. The photoresist layer is selectively exposed to actinic radiation, and the photoresist layer is developed to form a pattern in the photoresist layer. The photoresist underlayer composition includes: a first polymer having one or more of pendant acid-labile groups and pendant epoxy groups, a second polymer having one or more crosslinking groups, an acid generator, a quencher or photodecomposable base, and a solvent. The photoresist underlayer composition includes 0 wt. % to 10 wt. % of the quencher or photodecomposable base based on a total weight of the first and second polymers.

公开(公告)号：US20230350290A1

公开(公告)日：2023-11-02

申请号：US18220825

申请日：2023-07-12

Applicant: FUJIFILM Corporation

Inventor： Tetsuya KAMIMURA ,  Satomi TAKAHASHI

IPC: G03F7/004 ,  B65D85/00 ,  G03F7/16 ,  G03F7/26 ,  G03F7/20 ,  H01L21/027 ,  G03F7/039 ,  G03F7/00 ,  G03F7/075

CPC classification number: G03F7/0048 ,  B65D85/70 ,  G03F7/161 ,  G03F7/26 ,  G03F7/168 ,  G03F7/2002 ,  G03F7/162 ,  H01L21/027 ,  G03F7/16 ,  G03F7/0392 ,  G03F7/0012 ,  G03F7/0397 ,  G03F7/0758

Abstract: A pattern forming method includes a pre-wetting step of coating a substrate with a chemical liquid so as to obtain a pre-wetted substrate, a resist film forming step of forming a resist film on the pre-wetted substrate by using an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of exposing the resist film, and a development step of developing the exposed resist film by using a developer. The chemical liquid contains a mixture of two or more kinds of organic solvents and an impurity metal containing one kind of element selected from the group consisting of Fe, Cr, Ni, and Pb, in which a vapor pressure of the mixture is 50 to 1,420 Pa at 25° C.