公开(公告)号：US11292942B2

公开(公告)日：2022-04-05

申请号：US16022062

申请日：2018-06-28

申请人： Avery Dennison Corporation

发明人： Michael Zajaczkowski ,  Michael T. Waterman ,  Kyle R. Heimbach ,  Eric L. Bartholomew ,  Brandon S. Miller

IPC分类号： C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09J7/26 ,  C09J5/06 ,  C09J4/06 ,  C09J133/00 ,  C08L23/02 ,  C08L33/00 ,  C09J133/06 ,  C09J123/02 ,  C09J133/08 ,  C09J4/00 ,  C08K5/13 ,  C08K5/3442 ,  C09J133/14 ,  C09J7/38 ,  C08F222/10 ,  C08F220/18

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US11230618B2

公开(公告)日：2022-01-25

申请号：US16083700

申请日：2017-10-31

申请人： LG Chem, Ltd.

发明人： Ji Eun Kim ,  Won Taeck Lim ,  Won Mun Choi ,  Dae June Joe

IPC分类号： C08F36/14 ,  C08F8/30 ,  C08F2/38 ,  C08F4/52 ,  C08F136/06 ,  C08C19/22 ,  C08L15/00 ,  C07C251/08 ,  C07D295/15 ,  C08K5/3442 ,  C08K5/3462 ,  C08K5/26 ,  C08K5/3445

摘要： The present invention relates to a modifier represented by Formula 1, a method of preparing the same, a modified conjugated diene-based polymer having a high modification ratio which includes a modifier-derived functional group, and a method of preparing the polymer.

公开(公告)号：US10676558B2

公开(公告)日：2020-06-09

申请号：US15947228

申请日：2018-04-06

申请人： Ticona LLC

发明人： Sung Hye Kim ,  Rong Luo ,  Jared T. Kindt

IPC分类号： C08G2/08 ,  C08K5/17 ,  C08K5/3492 ,  C08K5/3445 ,  C08L61/02 ,  C08K5/00 ,  C08L59/02 ,  C08L59/04 ,  C08K5/16 ,  C08K5/31 ,  C08K5/05 ,  C08K5/3442 ,  C08K5/21 ,  A61M15/00 ,  A61M5/31 ,  A61M5/178

摘要： A polyoxymethylene polymer composition is disclosed containing a formaldehyde stabilizer package. The formaldehyde stabilizer package, which contains at least two emission control agents, dramatically and unexpectedly reduces formaldehyde emissions. The formaldehyde stabilizer package includes at least two emission control agents selected from the group of benzoguanamine compounds, a hydantoin, a substituted hydantoin, an amino acid, and an alkylene urea such as ethylene urea.

公开(公告)号：US20200024490A1

公开(公告)日：2020-01-23

申请号：US16575578

申请日：2019-09-19

申请人： Avery Dennison Corporation

发明人： Michael ZAJACZKOWSKI ,  Michael T. WATERMAN ,  Kyle R. HEIMBACH ,  Eric L. BARTHOLOMEW ,  Brandon S. MILLER

IPC分类号： C09J7/26 ,  C09J5/06 ,  C09J4/06 ,  C09J133/00 ,  C08L23/02 ,  C08L33/00 ,  C09J133/06 ,  C09J123/02 ,  C09J133/08 ,  C09J4/00 ,  C08K5/13 ,  C08K5/3442 ,  C09J133/14 ,  C09J7/38

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US20180305585A1

公开(公告)日：2018-10-25

申请号：US16022620

申请日：2018-06-28

申请人： Avery Dennison Corporation

发明人： Michael ZAJACZKOWSKI ,  Michael T. WATERMAN ,  Kyle R. HEIMBACH ,  Eric L. BARTHOLOMEW ,  Brandon S. MILLER

IPC分类号： C09J7/26 ,  C09J123/02 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C09J133/14 ,  C09J133/08 ,  C09J133/00 ,  C09J7/38 ,  C09J5/06 ,  C09J4/06 ,  C09J4/00 ,  C08L33/00

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US20170275503A1

公开(公告)日：2017-09-28

申请号：US15620774

申请日：2017-06-12

申请人： Avery Dennison Corporation

发明人： Michael ZAJACZKOWSKI ,  Michael T. WATERMAN ,  Kyle R. HEIMBACH ,  Eric L. BARTHOLOMEW ,  Brandon S. MILLER

IPC分类号： C09J7/02 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J123/02 ,  C09J133/00 ,  C09J133/08 ,  C09J133/14 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06

CPC分类号： C09J7/38 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2222/1026 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/26 ,  C09J123/02 ,  C09J133/00 ,  C09J133/064 ,  C09J133/08 ,  C09J133/14 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2400/243 ,  C09J2433/00 ,  C09J2453/00 ,  C08F2220/1858 ,  C08F218/08 ,  C08F220/06 ,  C08F2230/085 ,  C08F265/06

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US20170275501A1

公开(公告)日：2017-09-28

申请号：US15620735

申请日：2017-06-12

申请人： Avery Dennison Corporation

发明人： Michael ZAJACZKOWSKI ,  Michael T. WATERMAN ,  Kyle R. HEIMBACH ,  Eric L. BARTHOLOMEW ,  Brandon S. MILLER

IPC分类号： C09J7/02 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J123/02 ,  C09J133/00 ,  C09J133/08 ,  C09J133/14 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06

CPC分类号： C09J7/38 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2222/1026 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/26 ,  C09J123/02 ,  C09J133/00 ,  C09J133/064 ,  C09J133/08 ,  C09J133/14 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2400/243 ,  C09J2433/00 ,  C09J2453/00 ,  C08F2220/1858 ,  C08F218/08 ,  C08F220/06 ,  C08F2230/085 ,  C08F265/06

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US09725623B2

公开(公告)日：2017-08-08

申请号：US14433897

申请日：2013-10-10

申请人： Avery Dennison Corporation

发明人： Michael Zajaczkowski ,  Michael T. Waterman ,  Kyle R. Heimbach ,  Eric L. Bartholomew ,  Brandon S. Miller

IPC分类号： C08G61/04 ,  C08F2/46 ,  C08F2/50 ,  C09J7/02 ,  C09J4/06 ,  C09J123/02 ,  C09J133/00 ,  C08L23/02 ,  C08L33/00 ,  C09J133/08 ,  C09J4/00 ,  C08K5/13 ,  C08K5/3442 ,  C09J133/14 ,  C09J5/06

CPC分类号： C09J7/38 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2222/1026 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/26 ,  C09J123/02 ,  C09J133/00 ,  C09J133/064 ,  C09J133/08 ,  C09J133/14 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2400/243 ,  C09J2433/00 ,  C09J2453/00 ,  C08F2220/1858 ,  C08F218/08 ,  C08F220/06 ,  C08F2230/085 ,  C08F265/06

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US09714365B2

公开(公告)日：2017-07-25

申请号：US14433892

申请日：2013-10-10

申请人： Avery Dennison Corporation

发明人： Michael Zajaczkowski ,  Michael T. Waterman ,  Kyle R. Heimbach ,  Eric L. Bartholomew ,  Brandon S. Miller

IPC分类号： C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C09J7/02 ,  C09J4/06 ,  C09J123/02 ,  C09J133/00 ,  C08L23/02 ,  C08L33/00 ,  C09J133/08 ,  C09J4/00 ,  C08K5/13 ,  C08K5/3442 ,  C09J133/14 ,  C09J5/06

CPC分类号： C09J7/38 ,  C08F2222/1013 ,  C08F2222/102 ,  C08F2222/1026 ,  C08K5/13 ,  C08K5/3442 ,  C08L23/02 ,  C08L33/00 ,  C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/26 ,  C09J123/02 ,  C09J133/00 ,  C09J133/064 ,  C09J133/08 ,  C09J133/14 ,  C09J2205/114 ,  C09J2205/31 ,  C09J2400/243 ,  C09J2433/00 ,  C09J2453/00 ,  C08F2220/1858 ,  C08F218/08 ,  C08F220/06 ,  C08F2230/085 ,  C08F265/06

摘要： Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

公开(公告)号：US09695345B2

公开(公告)日：2017-07-04

申请号：US12741011

申请日：2008-10-28

申请人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

发明人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

IPC分类号： C09J163/00 ,  C09J133/08 ,  C09J7/02 ,  C08K5/13 ,  C08K5/3442 ,  C08K3/36 ,  C09J133/06 ,  C08K5/3445 ,  C08K5/00 ,  C08G59/62 ,  H01L21/683 ,  H01L23/00

CPC分类号： C09J163/00 ,  C08G59/621 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/13 ,  C08K5/3445 ,  C09J7/35 ,  C09J7/385 ,  C09J133/068 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0615 ,  H01L2924/351 ,  H01L2924/3511 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/06 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.