HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

    公开(公告)号:US20250059312A1

    公开(公告)日:2025-02-20

    申请号:US18932752

    申请日:2024-10-31

    Abstract: Provided are a heat-curable maleimide resin composition suitable for use in a substrate, and whose cured product has an excellent high-temperature property due to its high glass-transition temperature, an excellent dielectric property and an excellent dimension stability; and an uncured and cured resin films comprised of such composition, and having an excellent handling property. The heat-curable maleimide resin composition contains: (A) a maleimide resin having a number average molecular weight of not lower than 3,000; (B) an organic compound having, in one molecule, at least one allyl group and at least one isocyanuric ring; and (C) a reaction initiator.

    SOLVENT RESISTANT POLYMERIC MEMBRANES
    10.
    发明申请

    公开(公告)号:US20170121529A1

    公开(公告)日:2017-05-04

    申请号:US15403530

    申请日:2017-01-11

    Abstract: A radiation curable composition for preparing a polymeric membrane includes a) a membrane polymer selected from the group consisting of a polysulfone (PSU), a polyether sulfone (PES), a polyether etherketone (PEEK), a polyvinylchloride (PVC), a polyacrylonitrile (PAN), a polyvinylidene fluoride (PVDF), a polyimide (PI), a polyamide (PA) and copolymers thereof; b) a hydrophobic monomer or oligomer having at least two free radical polymerizable groups independently selected from the group consisting of an acrylate group, a methacrylate group, an acrylamide group, a methacrylamide group, a styrene group, a vinyl ether group, a vinyl ester group, a maleate group, a fumarate group, an itaconate group, and a maleimide group; and c) an organic solvent for the membrane polymer and the hydrophobic monomer. A polymeric membrane and a method for manufacturing the membrane are also disclosed.

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