公开(公告)号：US11721543B2

公开(公告)日：2023-08-08

申请号：US17060445

申请日：2020-10-01

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Raj Sakamuri ,  Ognian Dimov ,  Sanjay Malik ,  Michaela Connell ,  Ahmad A. Naiini ,  Stephanie Dilocker

IPC: H01L21/02 ,  C08L79/08 ,  H01L33/54 ,  H01L31/048 ,  H01L23/29

CPC classification number: H01L21/02109 ,  C08L79/08 ,  H01L23/293 ,  H01L31/0481 ,  H01L33/54 ,  C08L2203/16

Abstract: This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.

公开(公告)号：US20240254268A1

公开(公告)日：2024-08-01

申请号：US18594248

申请日：2024-03-04

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Binod B. De ,  William A. Reinerth ,  Sanjay Malik ,  Stephanie Dilocker ,  Raj Sakamuri

IPC: C08F279/02 ,  C08J5/18 ,  C08L51/00 ,  C09D11/101 ,  C09D11/107 ,  C09D151/04 ,  C25D5/56

CPC classification number: C08F279/02 ,  C08J5/18 ,  C08L51/003 ,  C09D11/101 ,  C09D11/107 ,  C09D151/04 ,  C25D5/56 ,  C08J2351/00

Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

公开(公告)号：US20220127459A1

公开(公告)日：2022-04-28

申请号：US17498813

申请日：2021-10-12

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Binod B. De ,  Raj Sakamuri ,  Sanjay Malik ,  Stephanie Dilocker ,  William A. Reinerth

IPC: C08L79/08 ,  C08K5/315 ,  C08K5/3475 ,  G03F7/039 ,  G03F7/20 ,  G03F7/16 ,  G03F7/32 ,  G03F7/40

Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one cyanate ester compound, the at least one cyanate ester compound containing at least two cyanate groups; and (b) at least one dielectric polymer including a polybenzoxazoie precursor polymer, a polyimide precursor polymer, or a fully imidized polyimide polymer.

公开(公告)号：US20220002463A1

公开(公告)日：2022-01-06

申请号：US17352484

申请日：2021-06-21

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Binod B. De ,  William A. Reinerth ,  Sanjay Malik ,  Stephanie Dilocker ,  Raj Sakamuri

IPC: C08F279/02 ,  C08L51/00 ,  C08J5/18 ,  C09D11/107 ,  C09D11/101 ,  C25D5/56

Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

公开(公告)号：US20250046717A1

公开(公告)日：2025-02-06

申请号：US18782630

申请日：2024-07-24

Applicant: Fujifilm Electronic Materials U.S.A, Inc.

Inventor： Stefan Vanclooster ,  Satoshi Matsui ,  Sanjay Malik ,  Binod B. De ,  William A. Reinerth ,  Stephanie Dilocker ,  Juliet Kotyk

IPC: H01L23/532 ,  C08L33/24

Abstract: The present disclosure generally relates to microelectronic devices with good reliability and related compositions and methods. In some embodiments, the methods include providing a composition comprising a hydrophobic multifunctional (meth)acrylate crosslinker and a polymer, and reacting the composition to provide a dielectric layer, wherein, when the dielectric layer is present in a microelectronic device, the microelectronic device exhibits good reliability. In certain embodiments, the compositions include a fully imidized polyimide and a hydrophobic multifunctional (meth)acrylate crosslinker, wherein the dielectric composition is suitable to provide a dielectric layer that imparts good reliability to a microelectronic device when the dielectric layer is present in the device.

公开(公告)号：US11945894B2

公开(公告)日：2024-04-02

申请号：US17352484

申请日：2021-06-21

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Binod B. De ,  William A. Reinerth ,  Sanjay Malik ,  Stephanie Dilocker ,  Raj Sakamuri

IPC: C08F279/02 ,  C08J5/18 ,  C08L51/00 ,  C09D11/101 ,  C09D11/107 ,  C09D151/04 ,  C25D5/56

CPC classification number: C08F279/02 ,  C08J5/18 ,  C08L51/003 ,  C09D11/101 ,  C09D11/107 ,  C09D151/04 ,  C25D5/56 ,  C08J2351/00

Abstract: This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.

公开(公告)号：US20210104398A1

公开(公告)日：2021-04-08

申请号：US17060445

申请日：2020-10-01

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Micheala Connell ,  Sanjay Malik ,  Raj Sakamuri ,  Ahmad A. Naiini ,  Stephanie Dilocker

IPC: H01L21/02 ,  C08L79/08 ,  H01L23/29 ,  H01L33/54 ,  H01L31/048

Abstract: This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.

公开(公告)号：US20240408590A1

公开(公告)日：2024-12-12

申请号：US18734029

申请日：2024-06-05

Applicant: Fujifilm Electronic Materials U.S.A, Inc.

Inventor： Sanjay Malik ,  William A. Reinerth ,  Binod B. De ,  Stephanie Dilocker ,  Raj Sakamuri

IPC: B01J41/02 ,  B01J41/10 ,  B01J47/02 ,  G03F7/004 ,  G03F7/32

Abstract: The present disclosure is directed to methods and systems of purifying bioderived organic solvents. The purified bioderived organic solvents can be used in a multistep semiconductor manufacturing process.

公开(公告)号：US20240248400A1

公开(公告)日：2024-07-25

申请号：US18542862

申请日：2023-12-18

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Binod B. De ,  Sanjay Malik ,  William A. Reinerth ,  Stephanie Dilocker

IPC: G03F7/031 ,  C08G73/10 ,  C08J5/18 ,  G03F7/037 ,  G03F7/20

CPC classification number: G03F7/031 ,  C08G73/1032 ,  C08G73/1067 ,  C08J5/18 ,  G03F7/037 ,  G03F7/2002 ,  C08J2379/08 ,  H01L21/31144

Abstract: This disclosure relates to a dielectric film forming composition that includes at least one resin; and at least one acyl germanium compound, as well as related processes, films, dry film structures, and articles.

公开(公告)号：US20220017673A1

公开(公告)日：2022-01-20

申请号：US17373827

申请日：2021-07-13

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Sanjay Malik ,  Binod B. De ,  William A. Reinerth ,  Ognian Dimov ,  Stephanie Dilocker

IPC: C08F283/04 ,  H01L23/00 ,  G03F7/004 ,  G03F7/037 ,  G03F7/00

Abstract: This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.