Abstract:
A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.
Abstract:
There is provided a resistor in which a first resistive part of a resistive element that electrically conducts between a pair of electrodes formed on either end of an insulating substrate has a meandering pattern meandering on the substrate surface and a swelling pattern that has a form in which a part of the meandering pattern swells out from the stroke width of the meandering pattern, a second resistive part that is electrically connected in series to the first resistive part is shorter than the entire length of the first resistive part, and has a wider width than the stroke width of the meandering pattern, and a trimming groove is formed in at least either the swelling pattern or the second resistive part. This can improve resistance accuracy and provide a high voltage resistor with high withstand voltage property.
Abstract:
An electrical resistor having a resistance value and capable of withstanding high power surges, utilizing a thick film deposited on a substrate and trimmed with one or more cuts configured to maintain a level of current crowding while increasing the resistance value of the resistor. A surge resistor can be modified in a similar fashion.
Abstract:
In a method of processing a circuit board formed of an aluminum nitride sintered body, a substrate (100) formed of an aluminum nitride sintered body is prepared. A groove (101) and a hole (102) are formed in the substrate (100) formed of the aluminum nitride sintered body by directing a water jet to a surface of the substrate (100). Alternatively, interconnection layers (104) and an electric resistant body (103) connecting the interconnection layers (104) are formed on the surface of the substrate (100), and a notch portion (105) is formed in the electric resistant body (103) by directing the water jet to the surface of the electric resistant body (103). In this manner, processing of the substrate (100) and adjustment of an electrical resistance value of the electric resistant body (103) can be carried out precisely.
Abstract:
The resistance of a thermal protector is varied by forming different sizes of holes therethrough to vary the area. The external size and shape of the thermal protector remains the same for ease of fixturing and mating with other parts.
Abstract:
A film-type power resistor consists of a ceramic wafer or washer having a central opening, one side of such washer being printed at its outer and inner edges with generally annular traces of termination metal. An electrically resistive film is printed on such one side over all portions of, and between, the termination metal, excepting for predetermined adjacent end portions which are connected to radially outwardly extending terminal lugs or leads. In one embodiment, the metal traces are continuous, whereas in another embodiment they are interrupted in order to create series-related resistor portions. The washer (and its associated films) are mounted over a metal base and are embedded in a thermosetting synthetic resin, the base having an upwardly extending central post which passes through the opening in the washer to the upper surface of the resin. In accordance with the method, the planar surface of a ceramic substrate is first printed with termination film traces, following which such traces are overprinted with electrically resistive film. The ceramic (with its associated coatings) is then fired in order to cure the resistive film. Thereafter, the entire outer surface of the resistive film is uniformly abraded by means of a jet of abrasive particles, the abrading continuing in a uniform manner until the resistive film is within the required tolerance. During the abrading step, the terminal regions of the terminal film traces are masked. Thereafter, terminal lugs or leads are connected to such terminal regions.
Abstract:
Miniature electrical resistors having a resistive film on a nonconductive substrate are abrasively trimmed to increase their resistance to a desired value by moving an abrasive jet between the resistor terminals, while measuring the rate of resistance increase, and then stopping and reversing the movement of the jet at a projected point in time when resistance has increased to the desired value. Capacitors and other electrical elements can be trimmed by this method.