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1.
公开(公告)号:US20240167896A1
公开(公告)日:2024-05-23
申请号:US18548528
申请日:2022-03-01
Inventor: Bernd FOLKMER , Thorsten HEHN , Manuel KOEHLER
Abstract: The invention preferably relates to an apparatus for measuring deformations, stresses, forces and/or torques of an object comprising a spring body and a sensor chip, which comprises one or more sensor elements for measuring a deformation, stress, force and/or a torque as well as an electronic circuit on a substrate. The spring body comprises a base plate on the front side of which a force conductor, preferably in the form of a pin, is installed, the sensor chip being positioned on the rear side of the base plate below the force conductor. The invention further relates to a system comprising a described apparatus and a data processing unit, wherein the data processing unit is configured for reading out measured data detected by the sensor chip and preferably detects the forces and/or torques acting on the force conductor based thereon.
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公开(公告)号:US11972105B2
公开(公告)日:2024-04-30
申请号:US17962086
申请日:2022-10-07
Inventor: Hamid Sepehr , Pablo Peso Parada , Willem Zwart , Tom Birchall , Michael Allen Kost , Tejasvi Das , Siddharth Maru , Matthew Beardsworth , Bruce E. Duewer
CPC classification number: G06F3/0488 , G06F3/0412 , G06F3/0414 , G01L5/162 , G01L5/164 , G01L5/165 , G01L5/167 , G06F2203/04105 , H04M2250/22
Abstract: A force sensing system for determining if a user input has occurred, the system comprising: an input channel, to receive an input from at least one force sensor; an activity detection stage, to monitor an activity level of the input from the at least one force sensor and, responsive to an activity level which may be indicative of a user input being reached, to generate an indication that an activity has occurred at the force sensor; and an event detection stage to receive said indication, and to determine if a user input has occurred based on the received input from the at least one force sensor.
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3.
公开(公告)号:US11650110B2
公开(公告)日:2023-05-16
申请号:US17089421
申请日:2020-11-04
Applicant: Honeywell International Inc.
Inventor: Zbynek Drasal , Jan Pekarek , Mikulas Jandak
CPC classification number: G01L1/18 , B81B7/02 , G01L5/162 , B81B2201/0264
Abstract: Techniques relating to a micro-electro-mechanical (MEMS) device configured to measure direct axial and shear stress components of a stress tensor are described. The MEMS device includes a first and second circuit configured in a double rosette structure coupled with a third circuit in a standard rosette structure to form a triple rosette piezo-resistive gauge circuit. The first circuit includes at least one piezoresistive element suspended from a substrate, and at least one piezoresistive element fixed to the substrate. The second circuit includes each piezoresistive element fixed to the substrate. The third circuit includes at least one piezoresistive element fixed to the substrate. Additionally, the MEMS device may be coupled to one or more processing systems to determine a mechanical stress tensor that is applied to the MEMS device based on measurements received from the MEMS device.
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公开(公告)号:US20230056977A1
公开(公告)日:2023-02-23
申请号:US17796600
申请日:2020-01-31
Applicant: Karlos ISHAC , Katia BOURAHMOUNE
Inventor: Karlos ISHAC , Katia BOURAHMOUNE
Abstract: A posture detection system for detecting a user's posture according to the embodiments includes a pressure sensor unit, a controller, a feedback mechanism, and a display unit. The pressure sensor unit has a sheet shape or a padded shape and includes plurality of sensors. Each of the sensors is configured to detect a pressure applied from the user. The controller is configured to classify the user's posture based on detection data detected by the pressure sensor unit. The feedback mechanism is configured to provide feedback to the user by vibrating based on a result of the classification. The display unit is configured to perform a display according to the result of the classification.
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5.
公开(公告)号:US11433550B2
公开(公告)日:2022-09-06
申请号:US16484227
申请日:2017-12-18
Applicant: TECHNISCHE UNIVERSITÄT DARMSTADT
Inventor: Sebastian Matich , Walter Albrecht
Abstract: A sensor arrangement for measuring at least one component of a force or a torque includes a sensor assembly having a first contact structure and a second contact structure, between which the at least one component of the force or torque is to be measured, and a plurality of sensor elements. The plurality of sensor elements are each connected by way of a first joint to the first contact structure and by way of a second joint to the second contact structure and configured to measure the component of force or torque between the first contact structure and the second contact structure. The first contact structure, the second contact structure and the plurality of sensor elements form a rolled-up structure that extends like a jacket along a surface of the sensor arrangement.
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公开(公告)号:US20220236120A1
公开(公告)日:2022-07-28
申请号:US17622043
申请日:2020-06-22
Applicant: Albert-Ludwigs-Universität Freiburg
Inventor: Jan Kollmitz , Matthias Kuhl , Yiannos Manoli
Abstract: In an embodiment a tactile sensor includes a plurality of stress sensors and at least one contact body, wherein the stress sensors are configured to detect a load pattern applied on a detection surface of the contact body.
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公开(公告)号:US10935444B2
公开(公告)日:2021-03-02
申请号:US15957819
申请日:2018-04-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor: Elio Guidetti , Mohammad Abbasi Gavarti , Daniele Caltabiano , Gabriele Bertagnoli
Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.
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公开(公告)号:US12092534B2
公开(公告)日:2024-09-17
申请号:US17622043
申请日:2020-06-22
Applicant: Albert-Ludwigs-Universität Freiburg
Inventor: Jan Kollmitz , Matthias Kuhl , Yiannos Manoli
Abstract: In an embodiment a tactile sensor includes a plurality of stress sensors and at least one contact body, wherein the stress sensors are configured to detect a load pattern applied on a detection surface of the contact body.
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公开(公告)号:US20240231601A1
公开(公告)日:2024-07-11
申请号:US18601585
申请日:2024-03-11
Inventor: Hamid SEPEHR , Pablo PESO PARADA , Willem ZWART , Tom BIRCHALL , Michael Allen KOST , Tejasvi DAS , Siddharth MARU , Matthew BEARDSWORTH , Bruce E. DUEWER
CPC classification number: G06F3/0488 , G06F3/0412 , G06F3/0414 , G01L5/162 , G01L5/164 , G01L5/165 , G01L5/167 , G06F2203/04105 , H04M2250/22
Abstract: A force sensing system for determining if a user input has occurred, the system comprising: an input channel, to receive an input from at least one force sensor; an activity detection stage, to monitor an activity level of the input from the at least one force sensor and, responsive to an activity level which may be indicative of a user input being reached, to generate an indication that an activity has occurred at the force sensor; and an event detection stage to receive said indication, and to determine if a user input has occurred based on the received input from the at least one force sensor.
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公开(公告)号:US11898943B2
公开(公告)日:2024-02-13
申请号:US17562829
申请日:2021-12-27
Applicant: STMICROELECTRONICS S.r.l.
Inventor: Santo Alessandro Smerzi
CPC classification number: G01M5/0041 , G01L1/18 , G01L5/162
Abstract: A stress sensor includes: a substrate, having a face and a recess, open to the face; and a sensor chip of semiconductor material, housed in the recess and bonded to the substrate, the sensor chip being provided with a plurality of sensing components of piezoresistive material. The substrate has a thickness which is less by at least one order of magnitude with respect to a main dimension of the face. Further, the sensor chip has a thickness which is less by at least one order of magnitude with respect to the thickness of the substrate, and a Young's module of the substrate and a Young's module of the sensor chip are of the same order of magnitude.
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