公开(公告)号：US06450396B1

公开(公告)日：2002-09-17

申请号：US09895371

申请日：2001-07-02

申请人： Paul Edward Krajewski

发明人： Paul Edward Krajewski

IPC分类号： B23K2000

CPC分类号： B23K20/023 ,  B23K2103/10

摘要： A method of joining at least a portion of a first substrate with at least a portion of a second substrate. The first substrate includes at least 90 weight percent aluminum and a first set of additives wherein magnesium is the dominant constituent in the additives. The second substrate includes at least 85 weight percent magnesium and a second set of additives wherein aluminum is the dominant constituent of the second set of additives. The first and second substrates are heated to an elevated temperature ranging from about 440° C. to 500° C. Pressure is applied to the first and second substrates at least at one point of contact to bond the first and second substrates together.

摘要翻译： 将第一基板的至少一部分与至少一部分第二基板接合的方法。 第一衬底包括至少90重量％的铝和第一组添加剂，其中镁是添加剂中的主要成分。 第二基材包括至少85重量％的镁和第二组添加剂，其中铝是第二组添加剂的主要成分。 将第一和第二基底加热到约440℃至500℃的升高温度。至少在一个接触点将压力施加到第一和第二基底上以将第一和第二基底结合在一起。

公开(公告)号：US06173886B1

公开(公告)日：2001-01-16

申请号：US09317295

申请日：1999-05-24

申请人： Mary Helen McCay ,  T. Dwayne McCay ,  Narendra B. Dahotre ,  John A. Hopkins ,  Frederick A. Schwartz ,  John Brice Bible

发明人： Mary Helen McCay ,  T. Dwayne McCay ,  Narendra B. Dahotre ,  John A. Hopkins ,  Frederick A. Schwartz ,  John Brice Bible

IPC分类号： B23K2000

CPC分类号： B23K26/34 ,  B23K20/008 ,  B23K20/023 ,  B23K20/16 ,  B23K20/22 ,  B23K26/32 ,  B23K35/0244 ,  B23K35/0255 ,  B23K35/36 ,  B23K35/3601 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/18 ,  B23K2103/20 ,  B23K2103/26 ,  B23K2103/50

摘要： The present invention relates to an improved method for joining metals or alloys together. Specifically, the present invention relates to a method comprising the laser alloying of a first metal/alloy piece so that it can be joined with a second metal/alloy piece of a nonidentical composition.

摘要翻译： 本发明涉及一种将金属或合金连接在一起的改进方法。 具体地说，本发明涉及一种包括第一金属/合金片的激光合金化的方法，使得它可以与不相同组成的第二金属/合金片接合。

公开(公告)号：US06264095B1

公开(公告)日：2001-07-24

申请号：US09350349

申请日：1999-07-14

申请人： Charles J. Stouffer ,  Patrick Bourke ,  James M. Marder ,  Lawrence H. Ryczek

发明人： Charles J. Stouffer ,  Patrick Bourke ,  James M. Marder ,  Lawrence H. Ryczek

IPC分类号： B23K2000

CPC分类号： B23K20/233 ,  B23K20/002 ,  B23K20/021

摘要： A process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to selective portions of the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the parts. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. Strength of the bond is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.

摘要翻译： 将金属部件彼此粘合以形成无缝的中空金属制品，特别是由铍制成的方法。 在热压之前，将模具组装到部件上，以将压力施加到部件的选择性部分。 然后将与工具组装在一起的部件在约1700°F至1750°F的温度和约2000psi至2500psi的压力下进行约3小时的热等静压。 围绕金属部件的工具用于限制部件的压缩量。 通过该方法形成的物品在空间飞行应用中特别有用，因为它们由均匀的材料形成。 由于不使用填料金属，粘结强度提高。 不存在填充金属也消除了由于热膨胀系数差异导致的任何热应力问题。

公开(公告)号：US06189763B1

公开(公告)日：2001-02-20

申请号：US09384592

申请日：1999-08-27

申请人： Nobuhiro Tazoe ,  Toshio Iwanami ,  Masami Oki ,  Kouiti Sakamoto ,  Suguhiro Fukushima ,  Toshihiro Mori

发明人： Nobuhiro Tazoe ,  Toshio Iwanami ,  Masami Oki ,  Kouiti Sakamoto ,  Suguhiro Fukushima ,  Toshihiro Mori

IPC分类号： B23K2000

CPC分类号： B21B15/0085 ,  B21B1/024 ,  B21B1/224 ,  B21B1/26 ,  B21B1/46 ,  B21B15/0007 ,  B21B39/14 ,  B21B2015/0057 ,  B23Q11/10 ,  Y10T29/5184 ,  Y10T408/45 ,  Y10T408/46 ,  Y10T409/304032 ,  Y10T409/304144 ,  Y10T483/15 ,  Y10T483/1736 ,  Y10T483/174

摘要： There is provided a rolled plate joining apparatus equipped with a truck that can travel reversibly in the rolling direction, tailing end pinch rolls that are mounted on the truck and can be moved vertically with the tailing end of a preceding rolled plate pinched horizontally, leading end pinch rolls that are mounted on the truck and can pinch horizontally the leading end of a succeeding rolled plate, machining apparatuses for cutting one surface of the tailing end of the preceding rolled plate and the other surface of the leading end of the succeeding rolled plate, and a pressure welding apparatus for compressing the preceding rolled plate and the succeeding rolled plate with the machined surfaces of the preceding rolled plate and the succeeding rolled plate overlapped to reduce them approximately to the thickness of the rolled plates, including a tailing end centering apparatus placed between the tailing end pinch rolls and the pressure welding apparatus for pressing the opposite width ends of the tailing end of the rolled plate to align the center line of the rolled plate with the center line of the joining apparatus in the rolling direction and a leading end centering apparatus placed between the pressure welding apparatus and the leading end pinch rolls for pressing the opposite width ends of the leading end of the rolled plate to align the center line of the rolled plate with the center line of the joining apparatus in the rolling direction.

摘要翻译： 本发明提供了一种装有卡车的轧制板接合装置，其能够在轧制方向上可逆地移动，拖尾端夹送辊安装在卡车上，并且可以在先前的轧制板的拖尾端水平地夹紧的状态下垂直移动， 夹持辊安装在卡车上，可以水平地夹紧后续轧制板的前端，用于切割前一轧制板的尾端的一个表面和后续轧制板的前端的另一个表面的加工装置， 以及用于压缩先前的轧制板和随后的轧制板的压力焊接装置，其中前轧制板和随后的轧制板的加工表面重叠，以将它们大致减小到轧制板的厚度，包括设置在尾部定中心装置 在后端夹送辊和用于按压相对的wi的压力焊接装置之间 轧制板的后端的第二端部，使轧制板的中心线与轧制方向的接合装置的中心线对准，并且将前端定心装置配置在压接装置与前端夹送辊之间， 将轧制板的前端的相对的宽度端压入轧制板的中心线与轧制方向的中心线对准。

公开(公告)号：US06634543B2

公开(公告)日：2003-10-21

申请号：US10040839

申请日：2002-01-07

申请人： Brian E. Curcio ,  Donald S. Farquhar ,  Elizabeth F. Foster ,  Amit K. Sarkhel

发明人： Brian E. Curcio ,  Donald S. Farquhar ,  Elizabeth F. Foster ,  Amit K. Sarkhel

IPC分类号： B23K2000

CPC分类号： H05K3/462 ,  B23K20/023 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/328 ,  H05K3/4623 ,  H05K2201/096

摘要： Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.

公开(公告)号：US06513695B2

公开(公告)日：2003-02-04

申请号：US09781997

申请日：2001-02-14

申请人： Nobuaki Yamakawa

发明人： Nobuaki Yamakawa

IPC分类号： B23K2000

CPC分类号： B23K20/02 ,  B23K2101/38

摘要： A terminal pressure-welding apparatus is provided, which includes: a first pattern; a second pattern facing the first pattern, one of the first and second patterns is provided approachably and disapproachably with respect to the other thereof; a mounting portion to mount the other of the first and second patterns; a displacing member carrying the one of the first and second patterns and being movable relatively to the other of the first and second patterns; and a stopping means to check an abutment of the first pattern and the second pattern, wherein a terminal metal fitting and an end portion of an electric wire are placed between the first and second patterns, and the terminal metal fitting and the end portion are pressure-welded by making the first and second patterns approach each other. The stopping means has a projecting portion projecting from the mounting portion toward the displacing member in order to abut against an end plane of the displacing member thereby to check the abutment of the first and second patterns. The projecting portion has an abutting plane to abut against the end plane, an adjusting means of a distance between the abutting plane and the mounting portion, and a fixing means to secure the projecting portion to the mounting portion for keeping the distance.

摘要翻译： 提供端子压焊装置，其包括：第一图案; 面向第一图案的第二图案，第一图案和第二图案中的一个相对于另一图案可接近地和不可预见地提供; 安装所述第一和第二图案中的另一个的安装部分; 移动构件承载第一和第二图案中的一个并且可相对于第一和第二图案中的另一个移动; 以及止动装置，用于检查第一图案和第二图案的邻接部，其中端子金属配件和电线的端部被放置在第一和第二图案之间，并且端子金属配件和端部是压力 通过使第一和第二模式彼此接近而被焊接。 止动装置具有从安装部朝向位移构件突出的突出部分，以便抵靠位移构件的端面，从而检查第一和第二图案的邻接。 突出部分具有邻接端面的抵接平面，邻接平面和安装部分之间的距离的调节装置，以及用于将突出部分固定到安装部分以保持距离的固定装置。

公开(公告)号：US06419146B1

公开(公告)日：2002-07-16

申请号：US09610665

申请日：2000-07-05

申请人： Frederick W. Buldhaupt ,  John R. Fischer ,  Matthew G. Kistner ,  Jeffrey D. Will

发明人： Frederick W. Buldhaupt ,  John R. Fischer ,  Matthew G. Kistner ,  Jeffrey D. Will

IPC分类号： B23K2000

CPC分类号： B64C1/12 ,  B21D26/055 ,  B21D47/00 ,  B23K26/037 ,  B23K26/123 ,  B23K26/206 ,  B23K26/244 ,  B23K26/26 ,  B23K26/28 ,  B23K26/38 ,  B23K2101/02 ,  B64C2001/0081 ,  Y10T29/18 ,  Y10T29/49371 ,  Y10T428/1234 ,  Y10T428/12347 ,  Y10T428/12361 ,  Y10T428/12375

摘要： A superplastically formed, diffusion bonded sandwich structure having integral metal hardpoints, made by joining two superplastic metal core sheets together into a core pack by welding or diffusion bonding along a pattern of lines which form junction lines between the core sheets when the pack is inflated by gas pressure at superplastic temperatures. Face sheets are laid under and over the core pack and metal inserts are interposed between the face sheets and the core. All of the sheets in the pack are sealed together around an outside peripheral edge to create a gas tight envelope. The pack is heated to superplastic temperatures in a cavity in a die, and the top and bottom face sheets are diffusion bonded to top and bottom surfaces of the metal insert by application of heat and pressure from top and bottom inner surfaces of the die cavity. While at superplastic temperatures, the pack is inflated by gas pressure against inside surfaces of a die to form an expanded metal sandwich structure having integral webs and integral hardpoints formed by the metal insert. After forming, the gas pressure is reduced to near atmospheric, the die is opened and the part is removed from the die.

摘要翻译： 一种具有整体金属硬点的超塑性扩散粘结夹层结构，其通过沿着线形图案通过焊接或扩散接合将两个超塑性金属芯片连接在一起，制成芯组件，该芯线在芯片片材之间形成连接线时， 超塑性气体压力。 将面片放置在芯组件的下面和后面，金属插入件插入在面片和芯之间。 包装中的所有片材围绕外围边缘密封在一起以形成气密封壳。 将包装件加热到模具中的空腔中的超塑性温度，并且通过从模腔的顶部和底部内表面施加热和压力将顶部和底部面板扩散结合到金属插入件的顶部和底部表面。 当在超塑性温度下，该组件通过气压对模具的内表面进行充气，以形成具有整体网状物和由该金属插入件形成的整体硬点的多孔金属夹层结构。 成型后，将气体压力降低至接近大气压，打开模具，将模具从模具中取出。

公开(公告)号：US06378760B1

公开(公告)日：2002-04-30

申请号：US09642786

申请日：2000-08-22

申请人： Takao Shimizu ,  Hirotsugu Horio ,  Kazushige Kitou ,  Shigeyuki Inagaki ,  Ryuzo Yamada

发明人： Takao Shimizu ,  Hirotsugu Horio ,  Kazushige Kitou ,  Shigeyuki Inagaki ,  Ryuzo Yamada

IPC分类号： B23K2000

CPC分类号： B23K20/028 ,  B23K20/16 ,  B23K20/22 ,  B23K2101/06

摘要： Carbon steel pipes are joined to each other in a non-oxidizing atmosphere by using an insert constituted by a Ni-base alloy or a Fe-base alloy having a melting point which is lower than 1200° C. and a thickness of 80 mm or smaller under conditions that the surface roughness Rmax of the joined surfaces of the carbon steel pipes is 20 &mgr;m or smaller, the joining temperature is not lower than 1250° C. nor higher than 1330° C., duration at the joining temperature is 30 seconds or longer and the pressure is not lower than 2 MPa nor higher than 4 MPa. The expanding operation is performed such that the maximum difference in level of the joined portion is not larger than 25% of the carbon steel pipe and the expansion ratio is 25% or lower.

摘要翻译： 碳钢管在非氧化性气氛中通过使用由Ni基合金或熔点低于1200℃，厚度为80mm的Fe基合金构成的插入件彼此接合，或 在碳钢管的接合面的表面粗糙度Rmax为20μm以下的条件下，接合温度不低于1250℃，也不高于1330℃，接合温度下的持续时间为30秒 以上，压力不低于2MPa，也不高于4MPa。 进行膨胀操作，使得接合部的最大水平差不大于碳钢管的25％，膨胀率为25％以下。

公开(公告)号：US06223967B1

公开(公告)日：2001-05-01

申请号：US09241467

申请日：1999-02-01

申请人： Rich Fogal ,  Michael B. Ball

发明人： Rich Fogal ,  Michael B. Ball

IPC分类号： B23K2000

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014

摘要： An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

摘要翻译： 一种延长移动线接合机，包括：沿第一水平面的X轴移动的第一定位台，沿着X轴和Y轴在第二水平面移动的第二定位台，所述第二定位台支撑在所述第一定位台 以及支撑在第二定位台上的结合头。 引线接合机还可以包括连接到接合头的接合工具和用于在接合工具下支撑引线框条的载体。 第一定位台可基本上移动引导框架条的整个长度，以允许接合工具在引线框条上的每个半导体管芯上连续地移动。

公开(公告)号：US06619537B1

公开(公告)日：2003-09-16

申请号：US09879543

申请日：2001-06-12

申请人： Hao Zhang ,  Jeff Hart ,  Ann Bolcavage

发明人： Hao Zhang ,  Jeff Hart ,  Ann Bolcavage

IPC分类号： B23K2000

CPC分类号： H01J37/3435 ,  B23K20/002 ,  B23K20/023 ,  B23K20/026 ,  B23K20/16 ,  B23K20/2333 ,  B23K28/006 ,  B23K35/002 ,  B23K35/007 ,  B23K35/3033 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  C23C14/3414

摘要： A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni—V, Ni—Ti, Ni—Cr, or Ni—Si, located between and joining the target and backing plate, and a method for making the assembly. The method of making involves depositing (e.g., electroplating, sputtering, plasma spraying) the interlayer on a mating surface of either the sputter target or backing plate and pressing, such as hot isostatically pressing, the sputter target and backing plate together along mating surfaces so as to form a diffusion bonded sputter target assembly.

摘要翻译： 包括优选由铝，铝合金，铝基复合材料，铜或铜合金构成的背衬板扩散的高纯度铜溅射靶的溅射靶组件和Ni合金中间层，优选由Ni- V，Ni-Ti，Ni-Cr或Ni-Si，以及用于制造组件的方法。 制造方法包括在溅射靶或背板的配合表面上沉积（例如电镀，溅射，等离子体喷涂）中间层，并按照配合表面一起按压等离子体将溅射靶和背板同时压制在一起 以形成扩散接合的溅射靶组件。