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    THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION
    3.
    发明申请
    THERMOSETTING OLIGOMER OR POLYMER, THERMOSETTING RESIN COMPOSITION INCLUDING THE OLIGOMER OR POLYMER, AND PRINTED CIRCUIT BOARD USING THE COMPOSITION 有权
    热固性低聚物或聚合物，包括低聚物或聚合物的热固化树脂组合物和使用组合物印刷的电路板

    公开(公告)号：US20100155120A1

    公开(公告)日：2010-06-24

    申请号：US12489881

    申请日：2009-06-23

    申请人： Jae Jun LEE ,  Mahn Jong KIM ,  Kwang Hee KIM

    发明人： Jae Jun LEE ,  Mahn Jong KIM ,  Kwang Hee KIM

    IPC分类号： H05K1/00 ,  C08G73/10 ,  C08L33/24

    CPC分类号： C08G73/101 ,  C08G63/685 ,  C08G73/026 ,  C08J5/24 ,  C08J2377/12 ,  C08J2379/08 ,  H05K1/032 ,  Y10T428/16 ,  Y10T428/238 ,  Y10T428/23914 ,  Y10T428/24595 ,  Y10T428/24645 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31786

    摘要： A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.

    摘要翻译： 提供了一种热固性低聚物或热固性聚合物。 热固性低聚物或热固性聚合物含有重复单元，每个重复单元在侧链中具有至少一个热固性官能团，由式1表示：其中重复单元包括X1，A1和Y1亚基，侧链单元包括连接单元L和 热固性官能团Z，n为1至4的整数。热固性低聚物或热固性聚合物具有低的热膨胀系数，高玻璃化转变温度，刚度，加工性，耐热性和机械性能。 热固性低聚物或热固性聚合物是高度可溶的，可湿润的和尺寸稳定的并且适用于薄膜，预浸料和印刷电路板。 还提供了包含热固性低聚物或热固性聚合物的热固性树脂组合物和使用该组合物的印刷电路板。

    Ventilated double-walled composite aircraft fuselage shell
    6.
    发明授权
    Ventilated double-walled composite aircraft fuselage shell 有权

    公开(公告)号：US07005175B2

    公开(公告)日：2006-02-28

    申请号：US10287463

    申请日：2002-11-04

    申请人： Dieter Hachenberg ,  Christian Rueckert

    发明人： Dieter Hachenberg ,  Christian Rueckert

    IPC分类号： B32B1/04 ,  B32B3/02 ,  B64C1/00

    CPC分类号： B64C1/067 ,  Y10T428/13 ,  Y10T428/23 ,  Y10T428/238 ,  Y10T428/239 ,  Y10T428/24942

    摘要： An aircraft fuselage shell is fabricated of a double-walled composite structural component, including a core element bonded and sandwiched between an inner cover layer and an outer cover layer. The inner cover layer forms the main load bearing fuselage inner skin, and the outer cover layer forms the fuselage outer skin which carries a smaller proportion of the loads. The core element may consist of fiber-reinforced composite material while the cover layers may consist of an aluminum alloy, another metal, or fiber-reinforced composite material. The core element is air permeable and has air flow channels extending longitudinally therethrough in at least one direction. The cover layers do not seal or enclose the core element, so the core element is ventilatable. A ventilating airflow carries moisture as water vapor out of the core element, and then the moisture is condensed and removed by a moisture management unit.

    Foil-enveloped evacuated thermal insulation elements
    7.
    发明授权
    Foil-enveloped evacuated thermal insulation elements 有权
    箔包层真空绝热元件

    公开(公告)号：US06863949B2

    公开(公告)日：2005-03-08

    申请号：US09920462

    申请日：2001-08-01

    申请人： Michael E. Ehrmanntraut

    发明人： Michael E. Ehrmanntraut

    IPC分类号： B29C63/04 ,  B29K105/04 ,  B29L31/00 ,  E04B1/80 ,  F16L59/06 ,  F16L59/065 ,  B32B1/04

    CPC分类号： E04B1/803 ,  B29C63/04 ,  B29K2025/00 ,  B29K2075/00 ,  B29K2105/04 ,  B29K2105/045 ,  B29K2995/0015 ,  B29K2995/0065 ,  B29K2995/0067 ,  F16L59/065 ,  Y02A30/242 ,  Y02B80/12 ,  Y10S493/903 ,  Y10S493/907 ,  Y10S493/908 ,  Y10T156/1034 ,  Y10T428/19 ,  Y10T428/23 ,  Y10T428/231 ,  Y10T428/233 ,  Y10T428/238 ,  Y10T428/239 ,  Y10T428/2419 ,  Y10T428/24231 ,  Y10T428/24256 ,  Y10T428/24264 ,  Y10T428/24777

    摘要： The invention relates, on the one hand, to a prismatic, especially panel-formed thermal insulation element which is enveloped in a gas-tight foil and evacuated, whereby a stable core pre-formed from a porous material is completely enveloped in a single cut sheet of the gas-tight foil; as well as a manufacturing process for same comprising the following steps: a) Manufacture of a prismatic core corresponding to the desired form of the thermal insulation element from a porous material; b) Enveloping of the principal faces of this core with a single sheet of the gas-tight foil; c) At least partial welding together of the foil which is drawn tight around the core along the face of the core; d) Folding-in of the welded seam area of the foil against the face of the core; e) Stress-free folding-together of the areas of the cut sheet of gas-tight foil projecting beyond the core, covering and in flat contact with the end surface(s) of the core; f) Welding together of the folded-together areas of foil on at least one end face of the core; g) Evacuation of the enveloped core; h) Complete welding closed of all remaining openings in the foil under vacuum.

    摘要翻译： 本发明一方面涉及一种棱形的，特别是面板形成的绝热元件，其被包封在气密箔中并抽真空，由此由多孔材料预先形成的稳定的芯完全包围在单个切口 气密箔片; 以及其制造方法，包括以下步骤：a）从多孔材料制造对应于期望形式的绝热元件的棱柱形芯; b）用单张片包裹该芯的主面 气密箔; c）至少部分地焊接在沿着芯的表面围绕芯部紧密拉伸的箔片上​​; d）将箔片的焊接区域折叠在芯部的表面上; e）不可压缩的折叠的不透气箔的切割片的区域的折叠在一起，突出超过芯，覆盖并与芯的端表面平坦接触; f）将折叠的焊接在一起 在芯的至少一个端面上的箔的区域;​​ g）包封的芯的抽出; h）在真空下完全焊接箔中所有剩余的开口。

    Method and apparatus for shock and vibration isolation of a circuit component
    8.
    发明申请
    Method and apparatus for shock and vibration isolation of a circuit component 失效
    用于电路元件的冲击和隔振的方法和装置

    公开(公告)号：US20050022375A1

    公开(公告)日：2005-02-03

    申请号：US10929168

    申请日：2004-08-30

    申请人： Thomas Augustin ,  Christopher Malone

    发明人： Thomas Augustin ,  Christopher Malone

    IPC分类号： H05K1/18 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  B23P19/00

    CPC分类号： H05K3/301 ,  H05K3/3436 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53265 ,  Y10T428/233 ,  Y10T428/238

    摘要： An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.

    摘要翻译： 一种用于改进CGA集成封装的冲击和振动隔离的装置，其利用焊料柱网格阵列来提供与印刷电路板的电连接。 CGA集成封装包括基板和封装盖。 支撑框架在附着点附接到CGA集成封装的基板或封装盖并且在与印刷电路板的第二附接点处连接。 诸如泡沫聚苯乙烯或Sorbathane的隔离材料位于支撑框架的附着点到基底或包装盖，或者位于支撑框架的第二附接点处的电路板上，使得对 电路板必须在到达集成电路之前穿过隔离材料在连接点。 还提供了一种在电路板上支撑集成电路并改善集成电路与电路板的任何振动和冲击的隔离的方法。

    Multicompartment structure for insulation and other materials
    9.
    发明授权
    Multicompartment structure for insulation and other materials 失效
    多层隔热结构等材料

    公开(公告)号：US06824887B2

    公开(公告)日：2004-11-30

    申请号：US10044895

    申请日：2002-01-09

    申请人： G. William Ragland

    发明人： G. William Ragland

    IPC分类号： B32B106

    CPC分类号： E04B1/78 ,  B65D73/0057 ,  B65D75/327 ,  B65D2575/3245 ,  Y10T428/12201 ,  Y10T428/1234 ,  Y10T428/12347 ,  Y10T428/12368 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12486 ,  Y10T428/238

    摘要： A structure for encapsulating and protecting fiber insulation material as well as other materials in multicompartment devices in order to provide unitized material which can be applied to any surface desired for insulation or other purposes. A first sheet of material is formed with pockets or depressions in the sheet which are adapted for receiving the material desired to be unitized and a second sheet placed over the first sheet, and the two sheets are attached together in the areas between the pockets or depressions thus encapsulating the material in the pockets. The material is unitized by placing the material in individual sealed metal foil containers or compartments, then the individual containers of unitized material are attached in matrix form to a continuous sheet, such as positioning the containers in openings in the continuous sheet. The product can be applied to any surface desired for insulation or other purposes. Preferably a multilayer metal foil material is employed in the structures.

    摘要翻译： 用于在多室装置中封装和保护纤维绝缘材料以及其它材料的结构，以便提供可应用于绝缘或其它目的所期望的任何表面的单元化材料。 第一片材料在片材中形成有用于容纳期望被组合的材料的凹陷或凹陷，以及放置在第一片上的第二片，并且两片在袋或凹陷之间的区域中附着在一起 从而将材料封装在口袋中。 通过将材料放置在单独密封的金属箔容器或隔室中来将材料整合在一起，然后将单位化材料的单个容器以矩阵形式附接到连续片材上，例如将容器定位在连续片材的开口中。 该产品可以应用于绝缘或其他目的所需的任何表面。 优选地，在结构中使用多层金属箔材料。