摘要:
An object of the present invention is to provide a laminate for forming an image with high sensitivity of the heat-sensitive image forming layer and excellent manufacturing suitability, and a manufacturing method of a flexographic printing plate using the same. The laminate for forming an image is a laminate for forming an image, which is for forming a mask used for manufacturing a flexographic printing plate, including, in the following order, a carrier sheet, a barrier layer, and a heat-sensitive image forming layer, in which the barrier layer contains a first infrared absorbing dye, the heat-sensitive image forming layer contains an ultraviolet absorber and a second infrared absorbing dye, both of the first infrared absorbing dye and the second infrared absorbing dye are a compound having an absorption at a wavelength of 1070 nm and having a mass absorption coefficient at the wavelength of 1070 nm of 50 L/(g·cm) or more, and both of the barrier layer and the heat-sensitive image forming layer contain a third infrared absorbing dye having an absorption at a wavelength of 830 nm.
摘要:
Provided is a negative resist film laminate comprising a thermoplastic film, which is a first support body, and a negative resist film, wherein the negative resist film contains (A) an alkali-soluble resin having a phenolic hydroxy group, (B) a plasticizer containing polyester, (C) a photoacid generator, (D) an epoxy compound containing on average four or more epoxy groups per molecule, and (E) a benzotriazole compound and/or an imidazole compound.
摘要:
A photosensitive element 1 comprises a support film 10, a protective film (polypropylene film) 30, and a photosensitive layer 20 which is arranged between the support film 10 and the protective film 30, wherein the protective film 30 has a principal surface 30a at a side of the photosensitive layer 20 and a principal surface 30b at an opposite side of the principal surface 30a, and the principal surface 30a and the principal surface 30b are smooth.
摘要:
An imageable material can be used to form a mask image for providing a relief image. This imageable material has a simplified structure and consists essentially of, in order: a transparent polymeric carrier sheet and a barrier layer comprising a first infrared radiation absorbing compound. A first ultraviolet radiation absorbing compound is provided in the transparent polymeric carrier sheet or the barrier layer. A non-silver halide thermally sensitive imageable layer is disposed on the barrier layer and comprises a second infrared radiation absorbing compound and a second ultraviolet radiation absorbing compound. A relief image is formed by imaging the imageable material to form an imaged mask material, exposing a relief-forming material with curing radiation through the imaged mask material to form exposed regions and non-exposed regions, and developing the imaged relief-forming material to form a relief image by removing its non-exposed regions.
摘要:
The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
摘要:
A method of manufacturing microstructures is disclosed, the method comprising a applying a mask to substrate; forming a pattern in the mask; processing the substrate according to the pattern; and mechanically removing the mask from the substrate. A polymer mask is disclosed for manufacturing micro scale structure, the polymer mask comprising a thin, preferably ultra thin flexible film. A method of manufacturing an integrated circuit is disclosed, the method comprising forming a plurality of isolated semiconductor devices on a common substrate; and connecting some of the devices. Apparatus for manufacturing microstructures is disclosed comprising: a mechanism for coating a mass substrate to create a structure; a mechanism for removing a mask from the substrate; and processing apparatus. A thin film transistor is disclosed comprising drain source and gate electrodes, the drain and source electrode being separated by a semiconductor, and the gate electrode being separated from the semiconductor by an insulator, comprising a bandgap alignment layer disposed between a semiconductor and the insulator.
摘要:
An improved method of manufacturing a photosensitive printing element that minimizes relief variation and improves image fidelity. The method involves a step of pre-curing the first (floor layer) of photocurable material prior to depositing an additional layer or layers of photocurable material that may be imaged and developed to produce a desired relief image on the surface of the photosensitive printing element. The photosensitive printing element is then thermally developed by contacting the photosensitive printing element with at least one roll that is capable of moving over at least a portion of the imaged surface of the flexographic printing element to remove the softened or melted non-crosslinked photopolymer. Non-crosslinked photopolymer on the imaged and exposed surface of the flexographic printing element can be softened or melted by positioning a heater adjacent to the imaged surface of the flexographic printing element and/or heating the at least one roll that contactable with the imaged surface of the flexographic printing element.
摘要:
An intaglio printing method for transferring a resin to a print receiving material, using an intaglio printing master having portions depressed in a printing shape below the surface of the printing master, includes the steps of: filling a resin paste comprising a resin in the depressed portions of the printing master, bringing the printing master, with the resin paste being filled in the depressed portions thereof, into close contact with the print receiving material, hardening the resin in the resin paste in the depressed portions of the printing master, and separating the printing master from the print receiving material so as to transfer the hardened resin in the depressed portions of the printing master to the print receiving material. An apparatus for carrying out this intaglio printing method is proposed. By use of the apparatus, for instance, an elastic and durable spacer free from fatigue destruction for a touch panel is can be prepared in a circulation process.
摘要:
A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.
摘要:
An element containing, in order: a first strippable substrate; a substantially transparent, non-photosensitive, polymeric isolation layer having a coating weight of 10 to 150 mg/dm.sup.2 ; an elastomeric layer having a coating weight of 25 to 200 mg/dm.sup.2 ; a pigmented photosensitive, preferably photopolymerizable layer; and a second different strippable substrate adjacent the photosensitive layer, wherein the photosensitive layer upon imagewise exposure to actinic radiation exhibits a lowered peel force relative to a system which does not have a polymeric isolation layer.