Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same
    10.
    发明申请
    Low-Melting-Point Glass Resin Composite Material and Electronic/Electric Apparatus Using Same 审中-公开
    低熔点玻璃树脂复合材料和使用其的电子/电气设备

    公开(公告)号:US20150337106A1

    公开(公告)日:2015-11-26

    申请号:US14655522

    申请日:2012-12-26

    申请人: HITACHI, LTD.

    IPC分类号: C08K3/22

    摘要: The purpose of the present invention is to provide a low-melting-point glass resin composite material with which the heat resistance and heat conductivity of an insulating resin can be improved. The low-melting-point glass resin composite material includes: a lead-free low-melting-point glass composition that contains Ag2O, V2O5, and TeO2, and in which the total content of Ag2O, V2O5, and TeO2 is 75 mass % or more; and a resin composition having a 5% thermal weight reduction temperature equal to or greater than a softening point temperature of the low-melting-point glass composition.

    摘要翻译: 本发明的目的是提供一种能够提高绝缘树脂的耐热性和导热性的低熔点玻璃树脂复合材料。 低熔点玻璃树脂复合材料包括:含有Ag2O,V2O5和TeO2的无铅低熔点玻璃组合物,其中Ag2O,V2O5和TeO2的总含量为75质量%,或 更多; 以及具有等于或高于低熔点玻璃组合物的软化点温度的5%热重量还原温度的树脂组合物。