公开(公告)号：US20130065057A1

公开(公告)日：2013-03-14

申请号：US13232093

申请日：2011-09-14

Applicant: Joseph Theodore Valko ,  Robin M. Peffer ,  Michael A. Mayo ,  Lawrence G. Anderson ,  Thor G. Lingenfelter ,  Beth Furar

Inventor： Joseph Theodore Valko ,  Robin M. Peffer ,  Michael A. Mayo ,  Lawrence G. Anderson ,  Thor G. Lingenfelter ,  Beth Furar

IPC: B32B27/38 ,  C25D9/02 ,  C09D163/00

CPC classification number: C25D5/44 ,  C08G59/1488 ,  C08G59/304 ,  C08G59/3272 ,  C09D5/4419 ,  C09D5/443 ,  C09D5/4442 ,  C09D5/448 ,  C09D5/4484 ,  C09D163/00 ,  C09D181/04 ,  C25D5/50 ,  C25D13/04 ,  C25D13/22 ,  Y10T428/31511

Abstract: A coating/sealant system that includes a coating and a sealant deposited over at least a portion of the coating, in which the coating includes a reaction product formed from reactants comprising a phosphated epoxy resin and a curing agent, and the sealant includes a sulfur-containing polymer.

Abstract translation: 一种涂层/密封剂系统，其包括沉积在涂层的至少一部分上的涂层和密封剂，其中所述涂层包括由包含磷酸酯化环氧树脂和固化剂的反应物形成的反应产物，并且所述密封剂包括硫 - 含聚合物。

公开(公告)号：US20110097587A1

公开(公告)日：2011-04-28

申请号：US12605368

申请日：2009-10-25

Applicant: Li-Chun Chen

Inventor： Li-Chun Chen

IPC: B32B17/10 ,  C08L63/00

CPC classification number: H05K1/0353 ,  C08G59/3272 ,  C08G59/4014 ,  C08G59/621 ,  C08L63/04 ,  C08L2205/02 ,  C09D163/04 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  C08L2666/22

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract translation: 无卤清漆包括（A）树脂，（B）固化剂，（C）阻燃剂（阻燃剂），（D）促进剂和（E）添加剂。 （A）的树脂具有酚醛环氧树脂，DOPO-CNE和DOPO-HQ-CNE。 （B）的固化剂包括苯并恶嗪树脂和酚醛清漆树脂。 将玻璃织物布浸入无卤清漆中，形成具有更好的热稳定性，抗燃性，低吸水能力和较高固化速度的预浸料。 此外，预浸料具有更多的韧性。

公开(公告)号：US09181464B2

公开(公告)日：2015-11-10

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  B32B7/12 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  C09J161/14 ,  C09J167/00 ,  C08G59/30 ,  C08G59/32 ,  C09J163/00 ,  C09J171/00 ,  H05K3/38 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  H05K1/03

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US20140010979A1

公开(公告)日：2014-01-09

申请号：US14006168

申请日：2012-03-22

Applicant: Masao Tomioka ,  Manabu Kaneko ,  Miyuki Hagiwara

Inventor： Masao Tomioka ,  Manabu Kaneko ,  Miyuki Hagiwara

IPC: C08L63/04 ,  H05K5/00

CPC classification number: C08L63/04 ,  C08G59/3272 ,  C08J5/24 ,  C08J2363/04 ,  C08K5/21 ,  C08L63/00 ,  C08L2205/02 ,  H05K5/0091 ,  Y10T428/1352 ,  Y10T428/249945

Abstract: To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), “R” is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).

Abstract translation: 本发明提供一种环氧树脂组合物和预浸料，其用于生产具有优异的固化性和优异的阻燃性和耐热性的纤维增强复合材料，以及提供使用该预浸料制备的纤维增强复合材料并提供电子 /电气设备。 环氧树脂组合物含有成分（A）：磷化合物; 组分（B）：分子中具有至少三个环氧基但不对应于组分（A）的环氧树脂，也不包括组分（A）; 组分（C）：分子中不具有脲结构的环氧树脂固化剂; 组分（D）：式（a）表示的二甲基脲化合物（式（a）中的“R”表示氢原子或碳原子数1〜10的烷基）。

公开(公告)号：US20110305883A1

公开(公告)日：2011-12-15

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  B32B7/12 ,  C09J161/14

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US09975992B2

公开(公告)日：2018-05-22

申请号：US15582767

申请日：2017-04-30

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jung-Che Lu ,  Ti-Kai Yu

IPC: C08G59/00 ,  C08G63/692 ,  C08G59/40 ,  C08L63/04

CPC classification number: C08G63/6926 ,  C08G59/3272 ,  C08G59/4071 ,  C08G59/621 ,  C08G63/692 ,  C08L63/00 ,  C08L63/04 ,  C08L67/02 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035 ,  C09D163/00 ,  C08L67/00

Abstract: A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.

公开(公告)号：US20170233524A1

公开(公告)日：2017-08-17

申请号：US15582767

申请日：2017-04-30

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying HSIEH ,  Qi SHEN ,  Jung-Che LU ,  Ti-Kai YU

IPC: C08G63/692 ,  C08L63/04 ,  C08G59/40

CPC classification number: C08G63/6926 ,  C08G59/3272 ,  C08G59/4071 ,  C08G59/621 ,  C08G63/692 ,  C08L63/00 ,  C08L63/04 ,  C08L67/02 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035 ,  C09D163/00 ,  C08L67/00

Abstract: A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.

公开(公告)号：US09181628B2

公开(公告)日：2015-11-10

申请号：US13232093

申请日：2011-09-14

Applicant: Joseph Theodore Valko ,  Robin M. Peffer ,  Michael A. Mayo ,  Lawrence G. Anderson ,  Thor G. Lingenfelter ,  Beth Furar

Inventor： Joseph Theodore Valko ,  Robin M. Peffer ,  Michael A. Mayo ,  Lawrence G. Anderson ,  Thor G. Lingenfelter ,  Beth Furar

IPC: C25D5/44 ,  C25D13/04 ,  C09D5/44 ,  C08G59/14 ,  C08G59/30 ,  C08G59/32 ,  C09D163/00 ,  C09D181/04 ,  C25D5/50 ,  C25D13/22

CPC classification number: C25D5/44 ,  C08G59/1488 ,  C08G59/304 ,  C08G59/3272 ,  C09D5/4419 ,  C09D5/443 ,  C09D5/4442 ,  C09D5/448 ,  C09D5/4484 ,  C09D163/00 ,  C09D181/04 ,  C25D5/50 ,  C25D13/04 ,  C25D13/22 ,  Y10T428/31511

Abstract: A coating/sealant system that includes a coating and a sealant deposited over at least a portion of the coating, in which the coating includes a reaction product formed from reactants comprising a phosphated epoxy resin and a curing agent, and the sealant includes a sulfur-containing polymer.

Abstract translation: 一种涂层/密封剂系统，其包括沉积在涂层的至少一部分上的涂层和密封剂，其中所述涂层包括由包含磷酸酯化环氧树脂和固化剂的反应物形成的反应产物，并且所述密封剂包括硫 - 含聚合物。

公开(公告)号：US08841388B2

公开(公告)日：2014-09-23

申请号：US13542556

申请日：2012-07-05

Applicant: Ching-Hsuan Lin ,  Yu-Wei Tian

Inventor： Ching-Hsuan Lin ,  Yu-Wei Tian

IPC: C07F9/6571 ,  C08L63/04 ,  C08G59/06 ,  C08G59/62 ,  C08G59/32

CPC classification number: C07F9/657172 ,  C08G59/063 ,  C08G59/3272 ,  C08G59/621 ,  C08L63/04

Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:

Abstract translation: 本发明提供由下式表示的单官能，双官能，多官能酚的新型磷化合物及其衍生物及其制备方法：

公开(公告)号：US20110303439A1

公开(公告)日：2011-12-15

申请号：US13203209

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: H05K1/02 ,  C09J163/02 ,  C09J11/06 ,  C09J167/00 ,  C09J177/00 ,  B32B7/12 ,  C09J185/02

CPC classification number: C09J177/00 ,  C08G59/304 ,  C08G59/3272 ,  C08K5/0066 ,  C08K5/3437 ,  C08K5/353 ,  C08K5/5399 ,  C08L63/00 ,  C08L67/00 ,  C08L77/00 ,  C08L2666/22 ,  C09J7/35 ,  C09J163/00 ,  C09J167/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2477/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0129 ,  Y10T428/287

Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.

Abstract translation: 提供一种无卤素的粘合剂组合物，并且可以在不损害粘合性或焊料耐热性的情况下满足阻燃性，以及层压体和使用其的柔性印刷线路板。 粘合剂树脂组合物含有环氧树脂; 热塑性树脂; 苯并恶嗪化合物; 无卤阻燃剂; 以及固化剂，其中至少一种环氧树脂和热塑性树脂含有含磷树脂，并且粘合剂树脂组合物的固体部分中的磷含量为2.5质量％以上。 优选使用含磷环氧树脂作为环氧树脂，使用含有10〜70质量％的含磷聚酯的热塑性树脂作为热塑性树脂，苯并恶嗪的量为5〜25重量份 质量和无卤阻燃剂的量为每100份树脂1至30质量份。