公开(公告)号：US09975992B2

公开(公告)日：2018-05-22

申请号：US15582767

申请日：2017-04-30

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jung-Che Lu ,  Ti-Kai Yu

IPC: C08G59/00 ,  C08G63/692 ,  C08G59/40 ,  C08L63/04

CPC classification number: C08G63/6926 ,  C08G59/3272 ,  C08G59/4071 ,  C08G59/621 ,  C08G63/692 ,  C08L63/00 ,  C08L63/04 ,  C08L67/02 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035 ,  C09D163/00 ,  C08L67/00

Abstract: A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.

公开(公告)号：US10563019B2

公开(公告)日：2020-02-18

申请号：US14931863

申请日：2015-11-04

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jun Chen

IPC: C08G79/04 ,  C08K3/36 ,  C08K5/5435 ,  B23B5/26 ,  B32B5/02 ,  B32B15/20 ,  B32B5/22 ,  B32B15/14 ,  H05K1/03 ,  B32B5/26

Abstract: A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.

公开(公告)号：US09790361B2

公开(公告)日：2017-10-17

申请号：US14932938

申请日：2015-11-04

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jung-Che Lu ,  Ti-Kai Yu

IPC: C08G63/00 ,  C08G65/38 ,  C08L67/02 ,  C08L63/00 ,  C08G63/692 ,  C09D163/00 ,  C08G59/32 ,  C08G59/62

CPC classification number: C08G63/6926 ,  C08G59/3272 ,  C08G59/4071 ,  C08G59/621 ,  C08G63/692 ,  C08L63/00 ,  C08L63/04 ,  C08L67/02 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/035 ,  C09D163/00 ,  C08L67/00

Abstract: A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.

公开(公告)号：US10059792B2

公开(公告)日：2018-08-28

申请号：US14821783

申请日：2015-08-09

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Chia-Ming Chang

IPC: C08G8/10 ,  C08K5/5313 ,  C08G8/28 ,  C08L63/04 ,  C08L61/14

CPC classification number: C08G8/10 ,  C08G8/28 ,  C08K5/5313 ,  C08L61/14 ,  C08L63/04 ,  C08L2201/02

Abstract: The present disclosure provides a phosphor-containing phenol formaldehyde resin compound having a general formula (I): The compound is formed of a phenol formaldehyde resin and an aromatic phosphate compound by performing a condensation reaction, which may be used as a curing agent of an epoxy resin. The phenol formaldehyde resin is formed of a phenolic compound, a bisphenol compound and formaldehyde. The present disclosure further provides a phosphor-containing phenol formaldehyde resin cured material which is formed of the phosphor-containing phenol formaldehyde resin compound and an epoxy resin under a high temperature. The phosphor-containing phenol formaldehyde resin compound is added separately or mixed with an epoxy resin curing agent.

公开(公告)号：US09956742B2

公开(公告)日：2018-05-01

申请号：US14927493

申请日：2015-10-30

Applicant: Jiangsu Yoke Technology Co., Ltd

Inventor： Tung-Ying Hsieh ,  Qi Shen ,  Jung-Che Lu

IPC: C08K3/36 ,  H05K1/02 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  B32B5/26 ,  B32B15/20 ,  B32B5/22

CPC classification number: B32B5/022 ,  B32B5/02 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/06 ,  B32B2262/08 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/20 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/714 ,  B32B2307/7242 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2553/00 ,  C08J5/24 ,  C08J2363/08 ,  C08J2463/00 ,  C08K3/013 ,  C08K3/36 ,  C08K5/5313 ,  H05K1/0373 ,  H05K2201/012 ,  C08L63/00

Abstract: A composite, a high-frequency circuit substrate using the same and method thereof are discussed. The composite includes the following solid components: a DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative compound of 10-70 wt %, a curing agent of 10-50 wt %, one or more epoxy of 10-90 wt % and an inorganic filling material of 10-40 wt %. The non-halogen low dielectric epoxy composite uses a high-purity DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative as tiny particles dispersing in the composite. The crosslinking yield of the composite is not reduced, while the heat resistance and flame retardancy are increased. The prepreg and copper foil covered laminate for use in printed circuit board, made from the epoxy composite, has great dielectric property and high glass transition temperature (GTT), satisfying the need of high frequency in electronic signal transmission and high speed in data processing of the industry of copper covered printed circuit board.