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    DIRECT BONDING OF HEAT CONDUCTING FOAM AND SUBSTRATES
    6.
    发明申请
    DIRECT BONDING OF HEAT CONDUCTING FOAM AND SUBSTRATES 有权
    导热泡沫和基材的直接结合

    公开(公告)号：US20120282454A1

    公开(公告)日：2012-11-08

    申请号：US13431361

    申请日：2012-03-27

    申请人： Eugene JANSEN ,  Scott M. MAURER

    发明人： Eugene JANSEN ,  Scott M. MAURER

    IPC分类号： B32B5/14 ,  C09J5/00

    CPC分类号： B32B37/04 ,  B32B5/18 ,  B32B7/04 ,  B32B15/046 ,  B32B15/18 ,  B32B15/20 ,  B32B27/065 ,  B32B37/08 ,  B32B2250/02 ,  B32B2266/04 ,  B32B2266/045 ,  B32B2266/057 ,  B32B2266/06 ,  B32B2305/022 ,  B32B2307/10 ,  B32B2307/30 ,  B32B2311/24 ,  B32B2313/04 ,  C09J5/00 ,  C09J2400/10 ,  C09J2400/163 ,  Y02E10/34 ,  Y10T428/249957

    摘要： A technique for joining porous foam material, such as graphite, metal or ceramic foam, to a substrate is described. The substrate can be metal, a thermoset plastic or a composite material. The substrate has a melting point below that of the foam material. The two are joined together by using the foam to apply heat locally at the surface of the substrate. Some or all of the foam is heated to the appropriate temperature at or above the melting point of the substrate material. The foam and the substrate are then brought together, with the heat from the foam melting or softening the substrate material so that the substrate material infuses into the pores of the foam. As the foam cools below the melting point temperature, the substrate material solidifies to create a mechanical bond between the foam and the substrate.

    摘要翻译： 描述了将诸如石墨，金属或陶瓷泡沫的多孔泡沫材料连接到基底的技术。 基底可以是金属，热固性塑料或复合材料。 基材的熔点低于泡沫材料的熔点。 两者通过使用泡沫在基体的表面局部施加热量而连接在一起。 将一些或全部泡沫体加热至等于或高于基底材料的熔点的适当温度。 然后将泡沫和基底聚集在一起，来自泡沫的热量熔化或软化基底材料，使得基底材料注入泡沫的孔中。 当泡沫冷却到低于熔点温度时，基底材料固化以在泡沫和基底之间产生机械结合。