Diffusion bonding for metallic membrane joining with metallic module
    10.
    发明授权
    Diffusion bonding for metallic membrane joining with metallic module 有权
    金属膜与金属模块接合的扩散接合

    公开(公告)号:US07353982B2

    公开(公告)日:2008-04-08

    申请号:US10720529

    申请日:2003-11-25

    申请人: Anwu Li

    发明人: Anwu Li

    IPC分类号: B23K20/00

    摘要: This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature above the half melting point of the metallic membrane while subjecting the metallic membrane and metallic part to a controlled environment of a proper gas atmosphere. The metallic membrane can comprise palladium and the pressurized gas can comprise one of hydrogen, an inert gas or their mixture.

    摘要翻译: 本发明涉及一种将金属膜与金属部分接合的方法,包括将金属膜的光滑表面压在金属部件的光滑表面上,并将金属膜和金属部件加热至高于金属部件的半熔点 同时使金属膜和金属部件受到适当气体气氛的受控环境的影响。 金属膜可以包括钯,并且加压气体可以包括氢气,惰性气体或其混合物中的一种。