公开(公告)号：US20230055518A1

公开(公告)日：2023-02-23

申请号：US18048513

申请日：2022-10-21

申请人： Global Circuit Innovations Inc.

发明人： Erick Merle Spory

IPC分类号： H01L23/00

摘要： A device is provided. The device includes one or more of a singular die, one of another die, a printed circuit board, and a substrate, and one or more solder balls. The singular die includes one or more reconditioned die pads, which include die pads of the singular die with a plurality of metallic layers applied. The other die, printed circuit board, and the substrate include one or more bond pads. The one or more solder balls are between the one or more reconditioned die pads and the one or more bond pads.

公开(公告)号：US11508680B2

公开(公告)日：2022-11-22

申请号：US17097162

申请日：2020-11-13

申请人： Global Circuit Innovations Inc.

发明人： Erick Merle Spory

IPC分类号： H01L23/00

摘要： A method is provided. The method includes one or more of conditioning one or more die pads of a singular die, applying a nickel layer to the one or more die pads, applying a gold layer over the nickel layer, applying a solder paste over the gold layer, applying one or more solder balls to the solder paste, and mating the one or more solder balls to one or more bond pads of another die, a printed circuit board, or a substrate.

公开(公告)号：US20200230940A1

公开(公告)日：2020-07-23

申请号：US16844027

申请日：2020-04-09

申请人： Global Circuit Innovations Inc.

发明人： Erick Merle Spory

IPC分类号： B33Y10/00 ,  B24D18/00 ,  H01B1/04 ,  H01B5/14 ,  H01B13/00 ,  B33Y30/00 ,  B29C64/106 ,  B29C64/141 ,  B29C64/20 ,  H01L21/02

摘要： A system is provided. The system includes a 3D printer, which includes a first dispenser and a second dispenser. The first dispenser is configured to apply conductive material to a surface, and the second dispenser is configured to apply conductive diamonds to a surface. The conductive material includes a mixture of an elastomer and at least one of nickel and silver, and the conductive diamonds are between 1 and 10 microns in size.

公开(公告)号：US10115645B1

公开(公告)日：2018-10-30

申请号：US15865328

申请日：2018-01-09

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L21/48 ,  H01L21/02 ,  H01L23/26 ,  H01L23/10 ,  H01L23/20 ,  H01L23/495 ,  H01L23/00 ,  H01L23/498

摘要： A method is provided. The method includes one or more of removing one or more existing ball bonds from an extracted die, reconditioning die pads of the extracted die to create a reconditioned die, securing the reconditioned die within a cavity of a new package base, providing a plurality of bond connections interconnecting the reconditioned die pads and package leads or downbonds of the new package base, applying an encapsulating compound over the reconditioned die and the plurality of bond connections to create an assembled package base, and securing a lid to the new package base. Reconditioning includes applying a plurality of metallic layers to the die pads of the extracted die, the extracted die including a fully functional semiconductor die removed from a previous package. The encapsulating compound is configured to exhibit low thermal expansion.

公开(公告)号：US10109606B2

公开(公告)日：2018-10-23

申请号：US15792312

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/26 ,  H01L23/498 ,  H01L23/057 ,  H01L23/10

摘要： A remapped extracted die is provided. The remapped extracted die includes an extracted die removed from a previous integrated circuit package. The extracted die includes a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and an interposer, bonded to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads, and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.

公开(公告)号：US20180061724A1

公开(公告)日：2018-03-01

申请号：US15792351

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/00 ,  H01L23/10 ,  H01L23/26 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/85 ,  H01L24/92 ,  H01L24/98 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0381 ,  H01L2224/0384 ,  H01L2224/04042 ,  H01L2224/05026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05562 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48482 ,  H01L2224/50 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92 ,  H01L2224/98 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/85

摘要： A method for remapping an extracted die is provided. The method includes one or more of removing an extracted die from a previous integrated circuit package, the extracted die including a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and bonding an interposer to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.

公开(公告)号：US20220005741A1

公开(公告)日：2022-01-06

申请号：US16918565

申请日：2020-07-01

申请人： Global Circuit Innovations Inc.

发明人： Timothy Mark Barry

IPC分类号： H01L23/055 ,  H01L23/00 ,  H01L23/522 ,  H01L23/66 ,  H01L23/498 ,  H01L21/48

摘要： A device is provided. The device may include one or more of a package base, a substrate, a die secured to the substrate, a plurality of bond connections, and a package lid. The package base includes a plurality of package leads and a package base body. The package base body includes an open cavity disposed through the entire package base body, a plurality of package bond pads, disposed within a periphery of the open cavity, and a mounting shelf, disposed within the open cavity. The substrate is secured to the mounting shelf, and includes a plurality of substrate bond pads. The plurality of bond connections are configured to provide electrical connections between one or more of the die, the substrate bond pads, and the package bond pads. The package lid is secured over the open cavity to the package base body.

公开(公告)号：US20210371984A1

公开(公告)日：2021-12-02

申请号：US16884829

申请日：2020-05-27

申请人： Global Circuit Innovations Inc.

发明人： Timothy Mark Barry

IPC分类号： C23C18/16 ,  C23C18/32 ,  C23C18/42 ,  H01L21/67

摘要： An apparatus is provided. The apparatus may include one or more of a container, a first magnet assembly, and a second magnet assembly. The container includes an open top and is configured to hold a liquid chemical solution. The first magnet assembly includes a first magnet having a first polarity and a cover, coupled to the first magnet. The cover is configured to be movable between an open and a closed position and limit evaporation of the solution when the cover is in the closed position. The second magnet assembly includes a second magnet having a second polarity. In response to a command, the second magnet assembly is configured to move the cover to the open position without direct contact to the first magnet assembly in response to a command.

公开(公告)号：US20190122897A1

公开(公告)日：2019-04-25

申请号：US15792472

申请日：2017-10-24

申请人： Global Circuit Innovations Inc.

发明人： Timothy Mark Barry

IPC分类号： H01L21/48 ,  H01L23/538

摘要： A method is provided. The method includes one or more of forming a cutout in a substrate, positioning a die comprising one or more bond pads in a coplanar orientation with the substrate in the cutout, securing the die in the cutout, and 3D printing one or more bond connections between the one or more bond pads and one or more connection points of the substrate or one or more bond pads of another die secured to the substrate.

公开(公告)号：US20180047685A1

公开(公告)日：2018-02-15

申请号：US15792312

申请日：2017-10-24

申请人： Erick Merle Spory

发明人： Erick Merle Spory

IPC分类号： H01L23/00 ,  H01L23/26 ,  H01L23/498 ,  H01L23/057

CPC分类号： H01L24/05 ,  H01L23/057 ,  H01L23/10 ,  H01L23/26 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/98 ,  H01L2224/03424 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05554 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/00014

摘要： A remapped extracted die is provided. The remapped extracted die includes an extracted die removed from a previous integrated circuit package. The extracted die includes a plurality of original bond pads having locations that do not correspond to desired pin assignments of a new package base and an interposer, bonded to the extracted die. The interposer includes first bond pads configured to receive new bond wires from the plurality of original bond pads, and second bond pads corresponding to desired pin assignments of the new package base, each individually electrically coupled to one of the first bond pads and configured to receive new bond wires from package leads or downbonds of the new package base.