摘要:
An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module.
摘要:
A method for manufacturing a light transmissive optical component, includes a first etching process of forming a depressed portion by applying etching to a silicon region of a plate-shaped member, a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion, and a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film. Accordingly, it is possible to realize a manufacturing method for an optical component which is capable of uniformly forming a silicon oxide film on a semi-transmissive reflecting surface which is largely inclined (or nearly vertical) with respect to a substrate surface, and an optical component produced by this method.
摘要:
A method for manufacturing a light transmissive optical component, includes a first etching process of forming a depressed portion by applying etching to a silicon region of a plate-shaped member, a thermal oxidation process of forming a silicon oxide film by thermally oxidizing an inner side surface of the depressed portion, and a nitride film formation process of forming a silicon nitride film that covers the silicon oxide film. Accordingly, it is possible to realize a manufacturing method for an optical component which is capable of uniformly forming a silicon oxide film on a semi-transmissive reflecting surface which is largely inclined (or nearly vertical) with respect to a substrate surface, and an optical component produced by this method.
摘要:
An optical module includes a first plate-shaped member having a light transmissive optical component which is formed by applying etching to a silicon region, and a second plate-shaped member having light reflective optical components (mirrors) for reflecting light transmitting through the light transmissive optical component. The first and second plate-shaped members are bonded to one another, and an optical path for light transmitting through the light transmissive optical component is along a component forming surface of the first plate-shaped member and a principal surface of the second plate-shaped member. Thereby, realizing an optical module in which it is possible to dispose the light reflective optical component and the light transmissive optical component close to one another, and a manufacturing method for the optical module.
摘要:
In a photodetector 1, a low-resistance Si substrate 3, an insulating layer 4, a high-resistance Si substrate 5, and an Si photodiode 20 construct a hermetically sealed package for an InGaAs photodiode 30 placed within a recess 6, while an electric passage part 8 of the low-resistance Si substrate 3 and a wiring film 15 achieve electric wiring for the Si photodiode 20 and InGaAs photodiode 30. While a p-type region 22 of the Si photodiode 20 is disposed in a part on the rear face 21b side of an Si substrate 21, a p-type region 32 of the InGaAs photodiode 30 is disposed in a part on the front face 31a side of an InGaAs substrate 31.
摘要:
In a photodetector 1, a low-resistance Si substrate 3, an insulating layer 4, a high-resistance Si substrate 5, and an Si photodiode 20 construct a hermetically sealed package for an InGaAs photodiode 30 placed within a recess 6, while an electric passage part 8 of the low-resistance Si substrate 3 and a wiring film 15 achieve electric wiring for the Si photodiode 20 and InGaAs photodiode 30. While a p-type region 22 of the Si photodiode 20 is disposed in a part on the rear face 21b side of an Si substrate 21, a p-type region 32 of the InGaAs photodiode 30 is disposed in a part on the front face 31a side of an InGaAs substrate 31.
摘要:
An optical module 1A is an optical module, which is manufactured from an SOI substrate having a support substrate 10 and a semiconductor layer 14 disposed on a surface 10a of the support substrate 10 via an insulating layer 12, the optical module including a movable mirror 22 in which a mirror surface 22a is formed on a side face intersecting with a Y-direction, that is movable in the Y-direction, a photodiode 32 which is provided on the surface 10a of the support substrate 10, and is optically coupled to the mirror surface 22a of the movable mirror 22, a cap member 34 which is provided on the surface 10a of the support substrate 10, that airtight-seals the movable mirror 22 and the photodiode 32, and an element electrode part 36 which is provided through the support substrate 10 and the insulating layer 12, and is electrically connected to the photodiode 32. Thereby, it is possible to realize an optical module which is capable of enhancing the airtightness of an optical system including a movable mirror, and which also can be downsized.
摘要:
An optical module comprises: a sub-mount 1, having four photodiodes 12 and two guide grooves 10 disposed on an optical element mounting surface 16; a fiber fixing member 2, having four V-grooves 21, four concave mirrors 22, and two guide rails 20 disposed on an optical fiber fixing surface 26; and four optical fibers 3, fixed to the fiber fixing member 2. With this optical module, the sub-mount 1 and fiber fixing member 2 are aligned and fixed by the fitting together of the guide grooves 10 and guide rails 20. A passive alignment type optical module that enables mass production and cost reduction is thus realized.
摘要:
An optical memory circuit comprises two photodetectors, and an intermediate signal conductor for connecting the two photodetectors, wherein the two photodetectors and the signal conductor are connected in series in a closed circuit, wherein each of the photodetectors comprises two spaced Schottky electrodes symmetrically disposed on a semiconductor substrate and the signal conductor has a capacitance with a time constant of a potential of the signal conductor such that charges are stored in the signal conductor when an optical write signal is incident on one photodetector and stored charges are released from the signal conductor when an optical read signal is incident on the other photodetector.
摘要:
An electromagnetic wave device having an amplification function comprises a medium containing free carriers, means for applying a magnetic field to the medium, means for applying an input electromagnetic wave to the medium in a direction perpendicular to the magnetic field, and means for generating an electric field to accelerating the carriers in the direction of the input electromagnetic wave. A frequency of the input electromagnetic wave is within the range of the plasma frequency plus or minus the cyclotron frequency, and a polarization direction of the input electromagnetic wave is perpendicular both to the magnetic field and its own traveling direction. Furthermore, the device has such functions as oscillation, modulation, frequency conversion, etc. depending on the type of added units.