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公开(公告)号：US08240037B2
公开(公告)日：2012-08-14
申请号：US12591240
申请日：2009-11-13
IPC分类号： H05K3/02
CPC分类号： H01L23/04 , H01L23/10 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H01L2924/15165 , H01L2924/16153 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H05K3/341 , H05K9/0056 , H05K2201/10371 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49165 , Y10T29/49171 , H01L2924/15153 , H01L2924/00 , H01L2224/05599
摘要： A process for producing a circuit module including, carried out in this order, preparing a ceramic carrier substrate having ceramic substrate pads for mounting electronic parts, forming solder paste layers on the ceramic substrate pads, forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder, preliminarily fixing stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace.
摘要翻译： 一种电路模块的制造方法，其特征在于，依次制备具有陶瓷基板焊盘的陶瓷载体基板，该陶瓷载体基板具有用于安装电子部件的陶瓷基板焊盘，在陶瓷基板焊盘上形成焊膏层，通过加热陶瓷载体基板形成预涂焊料层， 陶瓷基板焊盘上的焊膏层以熔化焊膏层，然后冷却以使焊料固化，预先将具有邻近腔体的突起和邻近腔体的阶梯盖固定到具有介入其间的突起到预涂焊料层 的陶瓷载体基板，并且将具有阶梯盖的陶瓷载体基板预先固定在预涂焊料层上的陶瓷载体基板放入回流炉中，将台阶盖连接到陶瓷载体基板上。
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公开(公告)号：US20100126008A1
公开(公告)日：2010-05-27
申请号：US12591240
申请日：2009-11-13
IPC分类号： H05K3/10
CPC分类号： H01L23/04 , H01L23/10 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H01L2924/15165 , H01L2924/16153 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H05K3/341 , H05K9/0056 , H05K2201/10371 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49165 , Y10T29/49171 , H01L2924/15153 , H01L2924/00 , H01L2224/05599
摘要： A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
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公开(公告)号：US20080174983A1
公开(公告)日：2008-07-24
申请号：US12007972
申请日：2008-01-17
CPC分类号： H01L23/04 , H01L23/10 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H01L2924/15165 , H01L2924/16153 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H05K3/341 , H05K9/0056 , H05K2201/10371 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49165 , Y10T29/49171 , H01L2924/15153 , H01L2924/00 , H01L2224/05599
摘要： A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
摘要翻译： 一种电路模块，其包含用于承载电子部件的陶瓷载体基板，设置在陶瓷载体基板的表面上的陶瓷基板焊盘，以及具有用焊料与陶瓷基板焊盘接合的空腔和底面的盖， 具有邻近腔体的突起的盖子，以及与腔体相邻的突起，其间插入突起，突起与陶瓷载体衬底接触，距离陶瓷衬底焊盘具有规定的距离，并且凹陷接合到陶瓷衬底焊盘 用焊料。
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公开(公告)号：US07738263B2
公开(公告)日：2010-06-15
申请号：US12007972
申请日：2008-01-17
IPC分类号： H05K9/00
CPC分类号： H01L23/04 , H01L23/10 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/09701 , H01L2924/15165 , H01L2924/16153 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H05K3/341 , H05K9/0056 , H05K2201/10371 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49165 , Y10T29/49171 , H01L2924/15153 , H01L2924/00 , H01L2224/05599
摘要： A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.
摘要翻译： 一种电路模块，其包含用于承载电子部件的陶瓷载体基板，设置在陶瓷载体基板的表面上的陶瓷基板焊盘，以及具有用焊料与陶瓷基板焊盘接合的空腔和底面的盖， 具有邻近腔体的突起的盖子，以及与腔体相邻的突起，其间插入突起，突起与陶瓷载体衬底接触，距离陶瓷衬底焊盘具有规定的距离，并且凹陷接合到陶瓷衬底焊盘 用焊料。
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公开(公告)号：US08912453B2
公开(公告)日：2014-12-16
申请号：US13511383
申请日：2010-12-13
IPC分类号： H05K1/16 , H01L23/552 , H01L23/00 , H01L23/053
CPC分类号： H01L23/053 , H01L23/552 , H01L23/564 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2924/16251 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.
摘要翻译： 电子部件封装包括电路板，其具有不具有无助焊剂润湿性的安装面，并且其上安装有半导体元件的焊接图案表示无助焊剂的润湿性，并且形成为包围其上的区域 安装半导体元件，具有使得在盖和电路板之间形成空腔的形状的盖，与焊接图案的接合面形成为环状，并且不显示无助焊剂的润湿性， 焊接接合部，其通过在盖的接合面上加热由无助焊剂形成的焊料预涂层而形成;以及通气孔，其通过在所述焊接预涂层的不连续部分之后露出的盖的接合面形成 焊接部分形成。
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公开(公告)号：US20120273264A1
公开(公告)日：2012-11-01
申请号：US13511383
申请日：2010-12-13
CPC分类号： H01L23/053 , H01L23/552 , H01L23/564 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2924/16251 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： An electronic component package includes a circuit board which has a mounting surface that does not show wettability for fluxless solder and on which a semiconductor element is mounted, a soldering pattern that shows wettability for the fluxless solder and is formed to surround an area on which the semiconductor element is mounted, a lid that has a shape such that a cavity is formed between the lid and the circuit board, a bonding surface to the soldering pattern is formed in a ring shape, and does not show wettability for the fluxless solder, a solder bonded part that is formed by heating a solder precoat formed of the fluxless solder on a bonding surface of the lid, and a ventilation hole that is formed by providing a bonding surface of the lid exposed in a discontinuous part of the solder precoat after the solder bonded part is formed.
摘要翻译： 电子部件封装包括电路板，其具有不具有无助焊剂润湿性的安装面，并且其上安装有半导体元件的焊接图案表示无助焊剂的润湿性，并且形成为包围其上的区域 安装半导体元件，具有使得在盖和电路板之间形成空腔的形状的盖，与焊接图案的接合面形成为环状，并且不显示无助焊剂的润湿性， 焊接接合部，其通过在盖的接合面上加热由无助焊剂形成的焊料预涂层而形成;以及通气孔，其通过在所述焊接预涂层的不连续部分之后露出的盖的接合面形成 焊接部分形成。
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公开(公告)号：US20130264972A1
公开(公告)日：2013-10-10
申请号：US13993949
申请日：2011-10-28
申请人： Minoru Hashimoto , Minami Shibagaki
发明人： Minoru Hashimoto , Minami Shibagaki
CPC分类号： H02N2/06 , B25J9/1095 , H01L41/0835 , H01L41/193 , H02N2/062
摘要： A method for controlling a displacement in the thickness direction of the contraction-type gel actuator having an effect of contraction in the thickness direction by applying a voltage between an anode and a cathode between which a gel which includes a dielectric polymeric material is interposed, which includes performing feedback control of an applied voltage, with a sampled value of a displacement when the applied voltage acts on the contraction-type gel actuator, according to the following equation (1): E=kp(xd−x)+Ed (1) In the equation, xd represents a target displacement of the contraction-type gel actuator; Ed represents an applied voltage with respect to the target displacement xd obtained by the linear approximation of the applied voltage and the displacement from a measured result of the displacement in accordance with the applied voltage of the contraction-type gel actuator; and kp represents a proportional gain.
摘要翻译： 通过在阳极和阴极之间施加电压来控制具有厚度方向收缩效果的收缩型凝胶致动器的厚度方向上的位移的方法，在该阳极和阴极之间插入包含电介质聚合物材料的凝胶， 根据以下等式（1），当所施加的电压作用在收缩型凝胶致动器时，执行施加的电压的反馈控制与位移的采样值：E = kp（xd-x）+ Ed ）在等式中，xd表示收缩型凝胶致动器的目标位移; Ed表示相对于根据施加电压的线性近似获得的目标位移xd的施加电压和根据收缩型凝胶致动器的施加电压的位移的测量结果的位移; kp表示比例增益。
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公开(公告)号：US08322609B2
公开(公告)日：2012-12-04
申请号：US12624033
申请日：2009-11-23
申请人： Minoru Hashimoto
发明人： Minoru Hashimoto
CPC分类号： B41J29/393 , G03G15/5004 , G03G15/5091 , G06F21/31 , G06F21/34 , G06F21/81 , G06F2221/2115
摘要： An image forming apparatus includes a power supply unit supplying power to a plurality of components, the power supply unit including a first power mode and a second power mode, the second power mode supplying less power than the first power mode, a control unit controlling which power mode the power supply unit uses, an authentication unit performing a user authentication when power is supplied from the power supply unit in the second power mode and an authentication request received in the second power mode, and a sending unit sending a request signal requesting the control unit to shift the power supply unit to the first power mode when the authentication unit succeeds in the user authentication, wherein the control unit controls the power supply unit to shift from the second power mode to the first power mode upon receipt of the request signal.
摘要翻译： 图像形成装置包括向多个部件供电的电源单元，所述电源单元包括第一功率模式和第二功率模式，所述第二功率模式提供比所述第一功率模式更少的功率;控制单元，其控制哪个 电源单元使用的电源模式，当以第二电源模式从电源单元供电并且以第二电源模式接收到的认证请求执行用户认证的认证单元以及发送请求信号的请求信号的发送单元 控制单元，当所述认证单元成功进行用户认证时，将所述电源单元切换到所述第一功率模式，其中，所述控制单元在接收到所述请求信号时控制所述供电单元从所述第二功率模式转换到所述第一功率模式 。
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9.发明授权Catalyst for hydrotreating hydrocarbon oil, process for producing the same, and method for hydrotreating hydrocarbon oil 有权用于加氢处理烃油的催化剂，其制备方法以及加氢处理烃油的方法公开(公告)号：US07737071B2
公开(公告)日：2010-06-15
申请号：US10594451
申请日：2005-03-22
IPC分类号： B01J27/19
CPC分类号： C10G45/12 , B01J21/12 , B01J27/1853 , B01J35/1019 , B01J35/1038 , B01J35/1042 , B01J35/1066 , C10G45/06 , C10G45/08 , C10G2300/4018 , C10G2400/02 , C10G2400/06 , C10G2400/08
摘要： There is provided a catalyst for hydrotreating a hydrocarbon oil, which comprises an inorganic oxide support containing a certain amount of phosphorus oxide having provided thereon: at least one selected from metals in the Group 6 of the periodic table, at least one selected from metals in the Group 8 of the periodic table, and carbon, and which has a certain specific surface area, pore volume, and mean pore diameter, a process for producing the same, and a method for hydrotreating a hydrocarbon oil using the same.Thereby, the catalyst can be produced in a simple and convenient manner and sulfur compounds in the hydrocarbon oil can be exceedingly highly desulfurized and simultaneously nitrogen compounds can be diminished without necessitating severe operating conditions.
摘要翻译： 提供了一种用于加氢处理烃油的催化剂，其包含含有一定量的在其上提供的一定量的氧化磷的无机氧化物载体：选自元素周期表第6族金属中的至少一种，选自金属中的至少一种 周期表第8族和碳，并且其具有一定的比表面积，孔体积和平均孔径，其制造方法以及使用其的烃油加氢处理方法。 因此，催化剂可以以简单方便的方式制造，烃油中的硫化合物可以极度高度脱硫，同时氮化合物可以减少而不需要严苛的操作条件。
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公开(公告)号：US07620740B2
公开(公告)日：2009-11-17
申请号：US11084693
申请日：2005-03-18
申请人： Makoto Takase , Kohji Takasaki , Minoru Hashimoto , Kenji Okada , Hiroshi Oshikawa , Yasuhiro Kotani , Satoshi Yamamoto , Keishi Takahashi
发明人： Makoto Takase , Kohji Takasaki , Minoru Hashimoto , Kenji Okada , Hiroshi Oshikawa , Yasuhiro Kotani , Satoshi Yamamoto , Keishi Takahashi
IPC分类号： G06F17/00
CPC分类号： G11B5/86 , G06F3/0604 , G06F3/0632 , G06F3/0634 , G06F3/0689
摘要： A file is transferred directly between a parent magnetic-disk device and a child magnetic-disk device. In one embodiment, a parent magnetic-disk device has a host-mode execution program, whereas a child magnetic-disk device is capable operating in a device mode as is the case with an ordinary magnetic-disk device. The parent magnetic-disk device has an operating-mode-setting unit including a special-purpose jumper block. An MPU employed in the parent magnetic-disk device executes the host-mode execution program to put the parent magnetic-disk device in a host mode. At an activation time, the MPU refers to the logic of the special jumper block to start an operation in the host mode. The MPU controls the parent magnetic-disk device to directly transfer a file to the child magnetic-disk device. Thus, the file can be transferred between the parent and child magnetic-disk devices without intervention by a host computer.
摘要翻译： 文件直接在父磁盘装置和子磁盘装置之间传送。 在一个实施例中，母磁盘装置具有主机模式执行程序，而子磁盘装置能够像普通磁盘装置一样在设备模式下运行。 母磁盘装置具有包括专用跳线块的操作模式设定单元。 在母磁盘装置中使用的MPU执行主机模式执行程序以将母磁盘装置置于主机模式。 在激活时，MPU参考专用跳线块的逻辑，以在主机模式下开始运行。 MPU控制母磁盘装置将文件直接传送到子磁盘装置。 因此，该文件可以在父磁盘和子磁盘设备之间进行传输，而无需主计算机的干预。
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