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80 条记录 (耗时 0.019 秒)

    Chip package and power module
    1.
    发明授权
    Chip package and power module 有权

    公开(公告)号：US11310904B2

    公开(公告)日：2022-04-19

    申请号：US16663366

    申请日：2019-10-25

    申请人： XINTEC INC.

    发明人： Tsang-Yu Liu ,  Po-Han Lee ,  Wei-Ming Chien

    IPC分类号： H05K1/02 ,  H05K1/03 ,  H01L23/00

    摘要： A chip package includes a high voltage withstanding substrate and a device chip. The high voltage withstanding substrate has a main body, a functional layer, and a grounding layer. The main body has a top surface, a bottom surface opposite the top surface, a through hole through the top surface and the bottom surface, and a sidewall surrounding the through hole. The functional layer is located on the top surface. The grounding layer covers the bottom surface and the sidewall. The device chip is located on the functional layer, and has a grounding pad that faces the main body. The grounding pad is electrically connected to the grounding layer in the through hole.

    Wafer-level packaging sensing device and method for forming the same
    2.
    发明授权
    Wafer-level packaging sensing device and method for forming the same 有权

    公开(公告)号：US10140498B2

    公开(公告)日：2018-11-27

    申请号：US15297546

    申请日：2016-10-19

    申请人： XINTEC INC.

    发明人： Tsang-Yu Liu ,  Ying-Nan Wen ,  Chi-Chang Liao ,  Yu-Lung Huang

    IPC分类号： H01L21/56 ,  G06K9/00 ,  H01L21/683 ,  H01L21/768 ,  H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/04 ,  H01L23/08 ,  G06K19/07 ,  H01L23/15 ,  H01L23/29

    摘要： A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The method also includes forming a redistribution layer on the second surface and electrically connected to the sensing region. The method further includes removing the temporary cover plate after the formation of the redistribution layer. The first substrate is bonded to a second substrate and a cover plate after the removal of the temporary cover plate so that the first substrate is positioned between the second substrate and the cover plate. In addition, the method includes filling an encapsulating layer between the second substrate and the cover plate to surround the first substrate.

    Electronic device package and fabrication method thereof
    3.
    发明授权
    Electronic device package and fabrication method thereof 有权

    公开(公告)号：US10109559B2

    公开(公告)日：2018-10-23

    申请号：US14470159

    申请日：2014-08-27

    申请人： XINTEC INC.

    发明人： Chia-Sheng Lin ,  Yen-Shih Ho ,  Tsang-Yu Liu

    IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L21/768 ,  H01L27/146 ,  H01L31/02 ,  H01L23/31

    摘要： An electronic device package and fabrication method thereof is provided. First, a semiconductor substrate is provided and the upper surface of it is etched to from recesses. A first isolation layer is formed on the upper surface and the sidewalls of the recesses. A conductive part is formed to fulfill the recesses and a conductive pad is formed on the first isolation layer to connect the conductive part. An electronic device is combined with the semiconductor substrate on the supper surface, wherein the electronic device has a connecting pad electrically connected to the conductive pad. The semiconductor substrate is thinned form its lower surface to expose the conductive part. A second isolation layer is formed below the lower surface and has an opening to expose the conductive part. A redistribution metal line is formed below the second isolation layer and in the opening to electrically connect to the conductive part.

    SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
    4.
    发明申请
    SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE 审中-公开

    公开(公告)号：US20180175101A1

    公开(公告)日：2018-06-21

    申请号：US15848600

    申请日：2017-12-20

    申请人： XINTEC INC.

    发明人： Yen-Shih Ho ,  Tsang-Yu Liu ,  Chia-Sheng Lin ,  Chaung-Lin Lai

    IPC分类号： H01L27/146 ,  H01L23/00 ,  H01L21/683

    摘要： A method for manufacturing a semiconductor structure includes the following steps. A first carrier is adhered to a first surface of a wafer by a first temporary bonding layer. A second surface of the wafer facing away from the first carrier is etched to form at least one through hole and at least one trench, in which a conductive pad of the wafer is exposed through the through hole. An isolation layer is formed on the second surface of the wafer, a sidewall of the through hole, and a sidewall of the trench. A second carrier is adhered to the second surface of the wafer by a second temporary bonding layer, and thus the through hole and the trench are covered by the second carrier. The first carrier and the first temporary bonding layer are removed.

    Manufacturing method of semiconductor structure
    9.
    发明授权
    Manufacturing method of semiconductor structure 有权
    半导体结构的制造方法

    公开(公告)号：US09450015B2

    公开(公告)日：2016-09-20

    申请号：US15086809

    申请日：2016-03-31

    申请人： XINTEC INC.

    发明人： Wei-Ming Chien ,  Chia-Sheng Lin ,  Tsang-Yu Liu ,  Yen-Shih Ho

    IPC分类号： H01L27/146 ,  H01L21/768 ,  H01L33/62

    CPC分类号： H01L27/14687 ,  H01L21/76898 ,  H01L27/14601 ,  H01L27/14636 ,  H01L33/62

    摘要： A manufacturing method of a semiconductor structure includes the following steps. A patterned photoresist layer is formed on a wafer of the wafer structure. The wafer is etched, such that channels are formed in the wafer, and a protection layer of the wafer structure is exposed through the channels. The protection layer is etched, such that openings aligned with the channels are formed in the protection layer. Landing pads in the protection layer are respectively exposed through the openings and the channels, and the caliber of each of the openings is gradually increased toward the corresponding channel. Side surfaces of the wafer surrounding the channels are etched, such that the channels are expanded to respectively form hollow regions. The caliber of the hollow region is gradually decreased toward the opening, and the caliber of the opening is smaller than that of the hollow region.

    摘要翻译： 半导体结构的制造方法包括以下步骤。 在晶片结构的晶片上形成图案化的光致抗蚀剂层。 蚀刻晶片，使得沟槽形成在晶片中，晶片结构的保护层通过沟道露出。 蚀刻保护层，使得在保护层中形成与沟道对准的开口。 保护层中的着陆垫分别通过开口和通道暴露，并且每个开口的口径朝着相应的通道逐渐增加。 蚀刻围绕通道的晶片的侧表面，使得通道膨胀以分别形成中空区域。 中空区域的口径朝向开口逐渐减小，并且开口的口径小于中空区域的口径。

    Semiconductor structure having stage difference surface and manufacturing method thereof
    10.
    发明授权
    Semiconductor structure having stage difference surface and manufacturing method thereof 有权
    具有台阶差的半导体结构及其制造方法

    公开(公告)号：US09275963B2

    公开(公告)日：2016-03-01

    申请号：US14199640

    申请日：2014-03-06

    申请人： XINTEC INC.

    发明人： Yung-Tai Tsai ,  Shu-Ming Chang ,  Chun-Wei Chang ,  Chien-Hui Chen ,  Tsang-Yu Liu ,  Yen-Shih Ho

    IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L21/78

    CPC分类号： H01L24/05 ,  H01L21/78 ,  H01L23/3185 ,  H01L23/3192 ,  H01L24/03 ,  H01L2224/02371 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/94 ,  H01L2924/10156 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00014

    摘要： A semiconductor structure includes a wafer, at least one nonmetal oxide layer, a pad, a passivation layer, an isolation layer, and a conductive layer. The wafer has a first surface, a second surface, a third surface, a first stage difference surface connected between the second and third surfaces, and a second stage difference surface connected between the first and third surfaces. The nonmetal oxide layer is located on the first surface of the wafer. The pad is located on the nonmetal oxide layer and electrically connected to the wafer. The passivation layer is located on the nonmetal oxide layer. The isolation layer is located on the passivation layer, nonmetal oxide layer, the first, second and third surfaces of the wafer, and the first and second stage difference surfaces of the wafer. The conductive layer is located on the isolation layer and electrically contacts the pad.

    摘要翻译： 半导体结构包括晶片，至少一个非金属氧化物层，焊盘，钝化层，隔离层和导电层。 晶片具有连接在第二和第三表面之间的第一表面，第二表面，第三表面，第一阶段差异表面以及连接在第一和第三表面之间的第二阶段差异表面。 非金属氧化物层位于晶片的第一表面上。 垫位于非金属氧化物层上并电连接到晶片。 钝化层位于非金属氧化物层上。 隔离层位于钝化层，非金属氧化物层，晶片的第一，第二和第三表面以及晶片的第一和第二级差分表面上。 导电层位于隔离层上并电接触焊盘。