Invention Grant
- Patent Title: Method for forming chip package
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Application No.: US14676738Application Date: 2015-04-01
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Publication No.: US09611143B2Publication Date: 2017-04-04
- Inventor: Yen-Shih Ho , Tsang-Yu Liu , Chia-Sheng Lin , Yi-Ming Chang
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Priority: TW103112450A 20140403
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; H01L21/78 ; H01L23/00 ; H01L21/683 ; H01L27/146 ; B81B7/00 ; H01L23/544
Abstract:
A method for forming a chip package is provided. The method includes providing a substrate and a capping layer, wherein the substrate has a sensing device therein adjacent to a surface of the substrate. The capping layer is attached to the surface of the substrate by an adhesive layer, wherein the adhesive layer covers the sensing device. A dicing process is performed on the substrate, the adhesive layer, and the capping layer along a direction to form individual chip packages.
Public/Granted literature
- US20150284244A1 METHOD FOR FORMING CHIP PACKAGE Public/Granted day:2015-10-08
Information query
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