Invention Grant
- Patent Title: Chip package and method for fabricating the same
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Application No.: US14251470Application Date: 2014-04-11
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Publication No.: US09881889B2Publication Date: 2018-01-30
- Inventor: Yu-Lung Huang , Shu-Ming Chang , Tsang-Yu Liu , Yen-Shih Ho
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L21/78 ; H01L21/66
Abstract:
A chip package is provided, in which includes: a packaging substrate, a chip and a plurality solder balls interposed between the packaging substrate and the chip for bonding the packaging substrate and the chip, wherein the solder balls include a first portion of a first size and a second portion of a second size that is different from the first size.
Public/Granted literature
- US20140306343A1 CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-10-16
Information query
IPC分类:
