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公开(公告)号：US12103246B2
公开(公告)日：2024-10-01
申请号：US15814267
申请日：2017-11-15
IPC分类号： B29C65/74 , B29C35/08 , B29C59/14 , B29C59/16 , B29C65/00 , B29C65/02 , B29C65/14 , B29L11/00 , B29L31/00 , B81C3/00 , C09J5/02 , H01L21/18 , H01L21/20 , H01L21/67
CPC分类号： B29C65/7415 , B29C59/14 , B29C59/16 , B29C65/1406 , B29C65/1432 , B29C66/028 , B29C66/1122 , B29C66/53461 , B29C66/54 , B29C66/83221 , B81C3/001 , C09J5/02 , H01L21/187 , H01L21/2007 , H01L21/67005 , B29C2035/0827 , B29C65/02 , B29C66/232 , B29C66/30223 , B29C66/534 , B29C66/71 , B29C66/712 , B29C66/73366 , B29C66/7465 , B29C66/919 , B29C66/92445 , B29C66/929 , B29C66/949 , B29L2011/00 , B29L2011/0016 , B29L2031/756 , C09J2400/143 , C09J2400/146 , C09J2400/163 , C09J2400/166 , B29C66/71 , B29K2083/00 , B29C66/71 , B29K2023/38 , B29C66/71 , B29K2069/00 , B29C66/71 , B29K2025/06
摘要： Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.
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公开(公告)号：US09678428B2
公开(公告)日：2017-06-13
申请号：US14867906
申请日：2015-09-28
发明人： Kenichi Hirose , Tetsuya Murakami
摘要： A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.
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公开(公告)号：US11102889B2
公开(公告)日：2021-08-24
申请号：US14655046
申请日：2013-12-26
发明人： Kenichi Hirose , Hiroki Horibe , Tomoyuki Habu , Shinichi Endo
摘要： Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.
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公开(公告)号：US10420221B2
公开(公告)日：2019-09-17
申请号：US15106039
申请日：2014-11-21
发明人： Kenichi Hirose , Makoto Wasamoto , Shinichi Endo
IPC分类号： H05K3/00 , H05K3/28 , B32B3/26 , B32B27/06 , C09D133/02 , C09D163/00 , B32B15/08 , B32B15/20 , B32B27/08 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/36 , B32B27/38 , B32B27/40
摘要： A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.
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公开(公告)号：US20160018736A1
公开(公告)日：2016-01-21
申请号：US14867906
申请日：2015-09-28
发明人： Kenichi Hirose , Tetsuya Murakami
IPC分类号： G03F7/20
摘要： A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.
摘要翻译： 一种光照射装置，其可以包括：紫外线发光灯，被配置为朝向被配置在包含氧的处理气体的气氛中的工件发射真空紫外光; 光通过窗，其适于设置在所述工件和所述紫外线发光灯之间，并且被配置为允许来自所述紫外线发射灯的真空紫外线通过，其中所述光通过窗口具有光出射表面; 以及适于设置在光通过窗口和工件之间的间隔件，以将压力施加到工件上并形成允许从光通过窗口的光出射表面到工件表面的距离的间隙 在工件的整个表面上具有均匀的尺寸。
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公开(公告)号：US09402317B2
公开(公告)日：2016-07-26
申请号：US14896016
申请日：2014-05-26
发明人： Kenichi Hirose
CPC分类号： H05K3/0055 , G03F7/427 , H01L21/67115 , H05K2203/081 , H05K2203/087
摘要： An ashing apparatus includes a treatment chamber having an object to be processed therein, and a lamp chamber having an ultraviolet lamp that radiates the object with an ultraviolet beam. The ashing apparatus is configured to accurately maintain an irradiation distance between a light source and the object. Thus, it is possible to efficiently remove a smear from a wiring board. The treatment chamber and the lamp chamber are moved relative to each other and in parallel to a surface of the object to be processed. The treatment chamber has a stage that supports the object, a gas inlet opening for supplying a treatment gas into the treatment chamber, and a gas outlet opening for discharging the treatment gas. An ultraviolet transmitting window member that partitions the treatment chamber and the lamp chamber from each other is fixed to the treatment chamber.
摘要翻译： 灰化装置包括具有待处理物体的处理室和具有用紫外线照射物体的紫外线灯的灯室。 灰化装置被配置为精确地保持光源和物体之间的照射距离。 因此，可以有效地从布线板去除污迹。 处理室和灯室相对于彼此移动并且平行于被处理物体的表面移动。 处理室具有支撑物体的台，用于将处理气体供给到处理室中的气体入口，以及用于排出处理气体的气体出口。 将处理室和灯室分隔开的紫外线透射窗构件被固定到处理室。
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公开(公告)号：US11542157B2
公开(公告)日：2023-01-03
申请号：US16758362
申请日：2018-08-07
摘要： Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size.
A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle θ1 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies θ1>90°.
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