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公开(公告)号：US20200285156A1
公开(公告)日：2020-09-10
申请号：US16804159
申请日：2020-02-28
Applicant: Tokyo Electron Limited
Inventor： Akiko Kiyotomi , Masato Hosaka , Tadashi Nishiyama , Kazuya Hisano
Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a plurality of films is formed, and an inspection recipe; and an edge detector configured to detect a target edge as an edge of an inspection target film among the films on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage. Each of edges of the films extends along the periphery of the substrate. The inspection recipe is configured by combining parameters each of which has one option specified among a plurality of options.
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公开(公告)号：US20200096321A1
公开(公告)日：2020-03-26
申请号：US16578591
申请日：2019-09-23
Applicant: Tokyo Electron Limited
Inventor： Kazuya Hisano , Akiko Kiyotomi , Yasuaki Noda , Keisuke Hamamoto , Tadashi Nishiyama
Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.
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公开(公告)号：US12230540B2
公开(公告)日：2025-02-18
申请号：US17050490
申请日：2019-04-16
Applicant: Tokyo Electron Limited
Inventor： Yoshihiro Kawaguchi , Hirotoshi Mori , Kazuya Hisano
IPC: H01L21/78 , B23K26/00 , B23K103/00 , H01L21/263 , H01L21/304 , H01L21/67 , H01L21/677 , H01L21/687
Abstract: A substrate processing system includes a pre-alignment apparatus having a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus having a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. The pre-alignment apparatus is disposed above the laser processing apparatus.
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公开(公告)号：US12191168B2
公开(公告)日：2025-01-07
申请号：US16979191
申请日：2019-03-27
Applicant: Tokyo Electron Limited
Inventor： Hirotoshi Mori , Yoshihiro Kawaguchi , Hayato Tanoue , Kazuya Hisano
IPC: H01L21/67 , B23K26/00 , B23K26/03 , B23K26/046 , B23K26/06 , B23K26/082 , B23K26/53 , G01B11/06 , H01L21/268 , H01L21/78 , H01L23/544
Abstract: A laser processing device includes a height measurement unit configured to measure a vertical direction position of an irradiation point of a processing laser beam on an upper surface of a substrate; and a controller configured to control a vertical direction position of a light condensing unit based on the vertical direction position of the irradiation point while moving the irradiation point along multiple dividing target lines. The height measurement unit includes a coaxial laser displacement meter and a separate-axis laser displacement meter. The controller controls the vertical direction position of the light condensing unit by using only one of the coaxial or the separate-axis laser displacement meter for each of the multiple dividing target lines while the substrate is processed and performs a switchover of a laser displacement meter for controlling the vertical direction position of the light condensing unit between the coaxial and the separate-axis laser displacement meters.
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5.发明授权公开(公告)号：US11669955B2
公开(公告)日：2023-06-06
申请号：US17252151
申请日：2019-06-10
Applicant: Tokyo Electron Limited
Inventor： Shin Inoue , Kazuya Hisano , Akiko Kiyotomi , Tadashi Nishiyama
CPC classification number: G06T7/001 , G03F7/162 , G06T7/0008 , G06T2207/30148
Abstract: Defects of substrates are inspected when executing a job in which a treatment recipe for substrates and the substrates being treatment objects are designated to perform predetermined treatments on the substrates. An imaging step successively images substrates. A first determination step decomposes, in order from the substrate as head of the job, a planar distribution of pixel values in a substrate image captured at the imaging step into pixel value distribution components using a Zernike polynomial, calculates Zernike coefficients of the pixel value distribution components corresponding to defects to be detected, and determines presence or absence of a defect based on the calculated Zernike coefficients. A second determination step determines, from predetermined timing after one or more substrates is determined to have no defect at the first determination step, presence or absence of a defect based on the substrate image determined to have no defect at the first determination step.
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Patent Agency Ranking
公开(公告)号：US11609502B2
公开(公告)日：2023-03-21
申请号：US16804159
申请日：2020-02-28
Applicant: Tokyo Electron Limited
Inventor： Akiko Kiyotomi , Masato Hosaka , Tadashi Nishiyama , Kazuya Hisano
Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a plurality of films is formed, and an inspection recipe; and an edge detector configured to detect a target edge as an edge of an inspection target film among the films on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage. Each of edges of the films extends along the periphery of the substrate. The inspection recipe is configured by combining parameters each of which has one option specified among a plurality of options.
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公开(公告)号：US12087588B2
公开(公告)日：2024-09-10
申请号：US17287558
申请日：2019-09-03
Applicant: Tokyo Electron Limited
Inventor： Hirotoshi Mori , Yoshihiro Kawaguchi , Kazuya Hisano , Hayato Tanoue
IPC: H01L21/304 , B23K26/53 , H01L21/306 , H01L21/67 , H01L21/68 , H01L21/687
CPC classification number: H01L21/304 , B23K26/53 , H01L21/30604 , H01L21/67092 , H01L21/67259 , H01L21/681 , H01L21/68764
Abstract: A substrate processing apparatus includes a holder configured to hold a combined substrate in which a first substrate and a second substrate are bonded to each other; a first detector configured to detect an outer end portion of the first substrate; a second detector configured to detect a boundary between a bonding region where the first substrate and the second substrate are bonded and a non-bonding region located at an outside of the bonding region; a periphery removing device configured to remove a peripheral portion of the first substrate as a removing target from the combined substrate held by the holder.
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公开(公告)号：US11823922B2
公开(公告)日：2023-11-21
申请号：US18110419
申请日：2023-02-16
Applicant: Tokyo Electron Limited
Inventor： Akiko Kiyotomi , Masato Hosaka , Tadashi Nishiyama , Kazuya Hisano
CPC classification number: H01L21/67178 , G03F7/7065 , G06Q20/08 , G06Q20/22 , G06V10/44 , G06V10/98 , H01L21/67259
Abstract: A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.
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公开(公告)号：US11378388B2
公开(公告)日：2022-07-05
申请号：US16578591
申请日：2019-09-23
Applicant: Tokyo Electron Limited
Inventor： Kazuya Hisano , Akiko Kiyotomi , Yasuaki Noda , Keisuke Hamamoto , Tadashi Nishiyama
Abstract: A substrate inspection method includes a first process of taking, while rotating a holding table where a reference substrate is held, an image of an end surface of the reference substrate; a second process of obtaining shape data on the end surface of the reference substrate by processing the image; a third process of taking, while rotating the holding table where a target substrate is held, an image of an end surface of the target substrate; a fourth process of obtaining shape data on the end surface of the target substrate by processing the image; and a fifth process of calculating a warpage amount of the target substrate by obtaining a difference between the shape data obtained in the second process and in the fourth process under a condition that a rotational position of the holding table in the first process coincides with that in the third process.
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公开(公告)号：US11268912B2
公开(公告)日：2022-03-08
申请号：US16514995
申请日：2019-07-17
Applicant: TOKYO ELECTRON LIMITED
Inventor： Kazuya Hisano , Akiko Kiyotomi
Abstract: A substrate inspection method includes: acquiring a feature amount of each of divided areas in an inspection target peripheral edge image, the inspection target peripheral edge image being an image of a peripheral portion of a target substrate as an inspection target, the divided areas being obtained by dividing a predetermined area in the image of the peripheral portion of the target substrate into a plurality of areas; and performing a predetermined determination concerning inspection of the peripheral portion of the target substrate based on an acquisition result in the acquiring the feature amount.
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