公开(公告)号：US11881373B2

公开(公告)日：2024-01-23

申请号：US17573566

申请日：2022-01-11

Applicant: Thomas Koschmieder

Inventor： Thomas Koschmieder

IPC: H01J1/46 ,  H01J1/88

CPC classification number: H01J1/46 ,  H01J1/88

Abstract: A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

公开(公告)号：US20230223229A1

公开(公告)日：2023-07-13

申请号：US17573566

申请日：2022-01-11

Applicant: Thomas Koschmieder

Inventor： Thomas Koschmieder

IPC: H01J1/46 ,  H01J1/88

CPC classification number: H01J1/46 ,  H01J1/88

Abstract: A wire bonded triode for amplification of electromagnetic signals that includes an electron emitter (cathode), control grid, and an electron collector (anode) and having one or more wire bonded structures. A method of making a triode for amplification of electromagnetic signals that includes wirebonding one or more wires to form a wire bonded structure corresponding with one or more of an anode, grid and/or cathode element.

公开(公告)号：US20060077029A1

公开(公告)日：2006-04-13

申请号：US10960676

申请日：2004-10-07

Applicant: Thomas Koschmieder

Inventor： Thomas Koschmieder

IPC: H01F27/28

CPC classification number: H01F17/0013 ,  H01F27/2847 ,  H01F2017/006 ,  H01F2027/2861 ,  H05K1/0393 ,  H05K1/165 ,  H05K3/4614 ,  H05K3/4635

Abstract: An inductive component is formed by stacking a plurality of layers of a strip comprising inductive element portions disposed at a flexible, non-conductive material to form a substrate, where each of inductive element portions is electrically coupled to an adjacent inductive element portion to form the inductive component.

Abstract translation: 电感元件是通过堆叠多层包含设置在柔性非导电材料上的电感元件部分以形成衬底的条形成的，其中每个电感元件部分电耦合到相邻的电感元件部分以形成 电感分量。

公开(公告)号：US20050285274A1

公开(公告)日：2005-12-29

申请号：US10879242

申请日：2004-06-29

Applicant: Terry Burnette ,  Thomas Koschmieder

Inventor： Terry Burnette ,  Thomas Koschmieder

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L23/52 ,  H01L23/544 ,  H01L29/40 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49816 ,  H01L22/34 ,  H01L24/81 ,  H01L2224/1181 ,  H01L2224/16 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/0269 ,  H05K3/3463 ,  H05K3/3489 ,  H05K2203/161 ,  H05K2203/163 ,  H01L2924/00

Abstract: A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.

Abstract translation: 焊料系统包括铅（Pb）指示剂和焊剂。 一种用于形成半导体器件的方法包括提供载体，将焊料系统施加到载体上，通过焊料系统将端子耦合到载体，熔化焊料系统以将端子附接到载体并形成完整的半导体器件，以及 确定完成的半导体器件是否具有与焊料系统不同的预定特性。