Invention Application
- Patent Title: Apparatus and method for constructions of stacked inductive components
- Patent Title (中): 堆叠电感元件结构的装置和方法
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Application No.: US10960676Application Date: 2004-10-07
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Publication No.: US20060077029A1Publication Date: 2006-04-13
- Inventor: Thomas Koschmieder
- Applicant: Thomas Koschmieder
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Main IPC: H01F27/28
- IPC: H01F27/28
Abstract:
An inductive component is formed by stacking a plurality of layers of a strip comprising inductive element portions disposed at a flexible, non-conductive material to form a substrate, where each of inductive element portions is electrically coupled to an adjacent inductive element portion to form the inductive component.
Information query
