-
公开(公告)号：US11353519B1
公开(公告)日：2022-06-07
申请号：US17114589
申请日：2020-12-08
发明人： Arup Polley , Srinath M. Ramaswamy , Jo Bito , Baher S. Haroun
摘要： A Hall sensor circuit includes a first Hall sensor, a second Hall sensor, a first preamplifier circuit, a second preamplifier circuit, a subtractor circuit, and a duty cycling circuit. The first preamplifier circuit includes an input and an output. The input is coupled to the first Hall sensor. The second preamplifier circuit includes a first input, a second input, and an output. The first input is coupled to the second Hall sensor. The subtractor circuit includes a first input coupled to the output of the first preamplifier circuit, a second input coupled to the output of the second preamplifier circuit, and an output coupled to the second input of the second preamplifier circuit. The duty cycling circuit is coupled to the second preamplifier circuit and the second Hall sensor.
-
公开(公告)号：US11237223B2
公开(公告)日：2022-02-01
申请号：US16521053
申请日：2019-07-24
发明人： Jo Bito , Benjamin Stassen Cook , Dok Won Lee , Keith Ryan Green , Ricky Alan Jackson , William David French
IPC分类号： G01R33/00 , G01R33/07 , B32B15/04 , G01D5/14 , G01R15/20 , G01R33/06 , G01R21/08 , G01R33/02
摘要： A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.
-
公开(公告)号：US20210050459A1
公开(公告)日：2021-02-18
申请号：US16539442
申请日：2019-08-13
IPC分类号： H01L31/0216 , H01L31/0203 , H01L31/02 , H01L23/00 , H01L31/024 , G02B5/20
摘要： An integrated filter optical package including an ambient light sensor that incorporates an infrared (IR) filter in an integrated circuit (IC) stacked-die configuration is provided. The integrated filter optical package incorporates an infrared (IR) coated glass layer to filter out or block IR light while allowing visible (ambient) light to pass through to a light sensitive die having a light sensor. The ambient light sensor detects an amount of visible light that passes through the IR coated glass layer and adjusts a brightness or intensity of a display screen on an electronic device accordingly so that the display screen is readable.
-
公开(公告)号：US12013419B2
公开(公告)日：2024-06-18
申请号：US17871873
申请日：2022-07-22
发明人： Dok Won Lee , Jo Bito , Keith Ryan Green
CPC分类号： G01R15/207 , G01R15/202 , H01L23/49586 , H10N52/00 , H10N52/80 , H10B61/00 , H10N59/00
摘要： In one example, circuitry is formed in a semiconductor die. A magnetic concentrator is formed on a surface of the semiconductor die and over the circuitry. An isolation spacer is placed on a lead frame. The semiconductor die is placed on the isolation spacer, and the magnetic concentrator is aligned to overlap the lead frame. Electrical interconnects are formed between the semiconductor die and the lead frame.
-
公开(公告)号：US12080633B2
公开(公告)日：2024-09-03
申请号：US16123100
申请日：2018-09-06
发明人： Jo Bito , Benjamin Stassen Cook , Steven Kummerl
IPC分类号： H01L23/495 , H01L23/498
CPC分类号： H01L23/49541 , H01L23/4951 , H01L23/49537 , H01L23/49816
摘要： A packaged semiconductor device includes an IC die having bump features that are coupled to bond pads flip chip attached to a custom LF. The custom LF includes metal structures including metal leads on at least 2 sides, and printed metal providing a printed LF portion including printed metal traces that connect to and extend inward from at least one of the metal leads over the dielectric support material that are coupled to FC pads configured for receiving the bump features including at least some of the printed metal traces coupled to the bond pads on the IC die. The IC die is flip chip mounted on the printed LF portion so that the bump features are connected to the FC pads.
-
公开(公告)号：US20240319234A1
公开(公告)日：2024-09-26
申请号：US18737108
申请日：2024-06-07
发明人： Dok Won Lee , Jo Bito , Keith Ryan Green
CPC分类号： G01R15/207 , G01R15/202 , H01L23/49586 , H10N52/00 , H10N52/80 , H10B61/00 , H10N59/00
摘要： In one example, a device comprises a lead frame, a semiconductor die, a spacer, and a magnetic concentrator. The lead frame comprises a conductor. The spacer is between the semiconductor die and the conductor. The magnetic concentrator overlaps at least partially with the conductor.
-
公开(公告)号：US11774519B2
公开(公告)日：2023-10-03
申请号：US17003693
申请日：2020-08-26
发明人： Yong Deng , Jo Bito , Benjamin Stassen Cook
CPC分类号： G01R33/0076 , G01R33/07 , H05K9/0045 , H05K9/0075
摘要： In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.
-
公开(公告)号：US11422167B2
公开(公告)日：2022-08-23
申请号：US16932299
申请日：2020-07-17
发明人： Dok Won Lee , Jo Bito , Keith Ryan Green
IPC分类号： G01R15/20 , H01L43/06 , H01L23/495 , H01L43/04 , H01L27/22
摘要： A packaged current sensor includes a lead frame, an integrated circuit, an isolation spacer, a first magnetic concentrator, and a second magnetic concentrator. The lead frame includes a conductor. The isolation spacer is between the lead frame and the integrated circuit. The first magnetic concentrator is aligned with the conductor. The second magnetic concentrator is aligned with the conductor.
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.013 秒)
