摘要:
The present invention relates to an air-water switching unit which consists of an air-water switching chamber with a movable piston residing inside the chamber and separating air coming into the chamber through an air inlet at one side and water coming into the chamber through a water inlet at the other side of the chamber. An air-water outlet is located between the air inlet and the water inlet. The movement of the piston is controlled by the pressure difference between the air pressure on one side and the water pressure on the other side of the piston. The air mixing water pump according to the present invention comprises the air-water switching unit, an air pump connected to the air inlet of the air-water switching chamber of the air-water switching unit, water supply from the output of a water filter connected to the water inlet of the air-water switching chamber, and a PVC tube connected to the air-water outlet of the air-water switching chamber. The PVC tube goes back to the aquarium at the location above the water level. The present invention also includes the application of the air-water switching unit and the air mixing water pump system in a fountain aquarium and an aquagarden.
摘要:
In this invention, an Electrically Alterable Non-Volatile Memory (EANOM) cell is disclosed. The EANOM ceil comprises an MOS transistor, having a source, a gate and a drain. The EANOM cell also has a two-terminal tunnel device, one end of which is connected to the gate of the MOS transistor. The other terminal being labelled "T". The tunnel device causes charges to be stored or removed from the gate of the MOS transistor. In a preferred embodiment, a four-terminal EANOM cell is disclosed. The four terminals of the EANOM cell are terminals T, S (source of the MOS transistor), D (drain of the MOS transistor) and a terminal C which is capacitively coupled to the gate of the MOS transistor. The EANOM cell can be used in a memory circuit to increase the reliability thereof. Two or more EANOM cells are connected in tandem and operate simultaneously. Catastrophic failure of one EANOM cell results in an open circuit with the other EANOM cell continuing to function.
摘要:
An EEPROM floating gate memory device includes: a floating gate disposed over the channel between the buried drain and the buried source, and insulated from the channel by 200 Å to 1000 Å of gate oxide; an add-on floating gate shorted electrically to the floating gate, and disposed over and insulated from the buried drain by 15 Å to 150 Å of tunnel dielectric; and a control gate disposed over and insulated from the floating gate and the channel between the floating gate and the buried source. Both the floating gate and the channel underneath are self-aligned to and flanked by the field oxide in the trench along the direction perpendicular to the channel current flow. The add-on floating gate forms both a self-aligned endcap on the field oxide and the self-aligned tunnel area on the buried drain. The architecture allows a reduction in memory cell size. The memory cells are particularly suited for a proposed segmented bit line page memory array architecture with the common drain line and the common source line in separate Y-column direction, and with the common control gate line in the X-row direction. A semiconductor device has a gate disposed over the channel and insulated from the channel by the gate oxide, an add-on poly spacer shorted electrically to the gate, and disposed over and insulated from the lightly doped source and drain by oxide. The add-on poly spacer also foams the self-aligned encap of the device on the field oxide.
摘要:
The flash EEPROM memory device with the floating gate that is over the channel area and insulated from the channel by 200 to 1000 A of gate oxide, and that is also over the thin tunnel dielectric area at the source and insulated from the source by 70 A to 200 A of tunnel dielectric. Another improvement of the proposed version of the flash EEPROM memory device is that the tunnel dielectric area is small and self aligned to the floating gate.
摘要翻译:闪存EEPROM存储器件,其浮动栅极位于通道区域上方并与通道隔离200至1000A的栅极氧化物,并且还在源极处的薄隧道电介质区域并与源极绝缘70 A 到200A的隧道电介质。 闪存EEPROM存储器件的提出版本的另一改进是隧道介电区域小并且与浮置栅极自对准。
摘要:
The EEPROM has the selection device in series with the memory device having a floating gate disposed over the channel between the buried drain and the buried source, and insulated from the channel by 200 A to 1000 A of gate oxide, an add-on floating gate shorted electrically to the floating gate, and disposed over and insulated from the buried drain by 40 A to 150 A of tunnel dielectric, and a control gate disposed over and insulated from the floating gate. The improvement in the proposed version of the memory device in the EEPROM is that the tunnel dielectric area is very small and is self aligned to the floating gate.
摘要:
An N-channel, double level poly, MOS read only memory or ROM array is electrically programmable by floating gates positioned beneath control gates formed by row address lines. The cells may be electrically programmed by applying selected voltages to the source, drain, control gate and substrate; the floating gate is charged through an insulator between the floating gate and the channel. A simplified process for fabrication of the devices eliminates photoresist and implant steps yet produces improved characteristics in the form of higher gain and lower body effect.
摘要:
A non-volatile semiconductor memory device of the electrically erasable type employs a floating gate which is programmed by application to high voltage across the source and drain so that hot electrons traverse the gate oxide. The floating gate is discharged by electron tunneling through an erase window which is separated from the control gate. Very small cell size is provided by a triple level polysilicon structure.
摘要:
An N-channel, double level poly, MOS read only memory or ROM array is electrically programmable by floating gates positioned beneath control gates formed by row address lines. The cells may be electrically programmed by applying selected voltages to the source, drain, control gate and substrate; the floating gate is charged through an insulator between the floating gate and the channel. A simplified process for fabrication of the devices eliminates photoresist and implant steps yet produces improved characteristics in the form of higher gain and lower body effect.
摘要:
Integrated circuit resistor elements ideally suited for load devices in static MOS RAM cells are made in second-level polycrystalline silicon by an ion implant step compatible with a self-aligned N-channel silicon-gate process. The second-level polysilicon is insulated from first-level polysilicon by multi-layer insulation; first, a thermal oxide layer provides better edge breakdown characteristics for transistors, then secondly a layer of doped deposited oxide provides improved step coverage, and finally an undoped deposited oxide is used to prevent out diffusion from doped oxide to second level polysilicon which would change the characteristics of the resistors.
摘要:
Integrated circuit resistor elements ideally suited for load devices in static MOS RAM cells are made in second-level polycrystalline silicon by an ion implant step compatible with a self-aligned N-channel silicon-gate process. The second-level polysilicon is insulated from first-level polysilicon by multi-layer insulation; first, a thermal oxide layer provides better edge breakdown characteristics for transistors, then secondly a layer of doped deposited oxide provides improved step coverage, and finally an undoped deposited oxide is used to prevent out diffusion from doped oxide to second level polysilicon which would change the characteristics of the resistors.