公开(公告)号：US20240128219A1

公开(公告)日：2024-04-18

申请号：US18530286

申请日：2023-12-06

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Hui-Min Huang ,  Wei-Hung Lin ,  Kai Jun Zhan ,  Chang-Jung Hsueh ,  Wan-Yu Chiang ,  Ming-Da Cheng

IPC分类号： H01L23/00 ,  H01L23/522

CPC分类号： H01L24/13 ,  H01L23/5226 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02181 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/11622 ,  H01L2224/13018

摘要： A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

公开(公告)号：US11887955B2

公开(公告)日：2024-01-30

申请号：US17412551

申请日：2021-08-26

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Hui-Min Huang ,  Ming-Da Cheng ,  Chang-Jung Hsueh ,  Wei-Hung Lin ,  Kai Jun Zhan ,  Wan-Yu Chiang

IPC分类号： H01L23/522 ,  H01L23/00

CPC分类号： H01L24/13 ,  H01L23/5226 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02181 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/11622 ,  H01L2224/13018

摘要： A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.