公开(公告)号：US20150323589A1

公开(公告)日：2015-11-12

申请号：US14804319

申请日：2015-07-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Min-Jer Wang ,  Ching-Nen PENG ,  Chewn-Pu JOU ,  Feng Wei KUO ,  Hao CHEN ,  Hung-Chih LIN ,  Huan-Neng CHEN ,  Kuang-Kai YEN ,  Ming-Chieh LIU ,  Tsung-Hsiung LEE

IPC: G01R31/28 ,  H01L23/538 ,  H02J5/00 ,  H01L25/065

CPC classification number: H02J50/40 ,  G01R31/2856 ,  G01R31/2884 ,  G01R31/2889 ,  G01R31/3025 ,  G06F17/5068 ,  H01L23/538 ,  H01L23/544 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/54446 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/15192 ,  H01L2924/15311 ,  H02J5/005 ,  H02J50/10 ,  H02J50/20 ,  H02J50/80 ,  H01L2224/81

Abstract: A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.

Abstract translation: 复合集成电路（IC）包括第一电路层，具有第一芯片和第二芯片的第二电路层以及第一芯片或第一电路层中的第一无线电力传输（WPT）装置。 第一WPT装置通过从电磁信号中提取能量来产生电源电压。 第二芯片或第一电路层中的第一跟踪电路由来自第一WPT设备的电源电压供电，并响应于从电磁信号提取的指令存储或输出跟踪数据。

公开(公告)号：US10379156B2

公开(公告)日：2019-08-13

申请号：US14815038

申请日：2015-07-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chewn-Pu Jou ,  Min-Jer Wang

IPC: G01R31/28

Abstract: An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.

公开(公告)号：US11387683B2

公开(公告)日：2022-07-12

申请号：US17015602

申请日：2020-09-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC: G01R31/28 ,  H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/302 ,  H01L23/544 ,  G06F30/39 ,  H02J50/20 ,  H01L23/00

Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US10790707B2

公开(公告)日：2020-09-29

申请号：US16220514

申请日：2018-12-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC: G06F11/00 ,  G01R31/28 ,  H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/302 ,  H01L23/544 ,  G06F30/39 ,  H02J5/00 ,  H02J50/20 ,  H01L23/00

Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US10164480B2

公开(公告)日：2018-12-25

申请号：US15589435

申请日：2017-05-08

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC: G06F11/00 ,  G01R31/28 ,  H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/302 ,  G06F17/50 ,  H01L23/544 ,  H02J5/00 ,  H02J50/20 ,  H01L23/00

Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US09653927B2

公开(公告)日：2017-05-16

申请号：US14804319

申请日：2015-07-20

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC: G06F11/00 ,  G01R31/28 ,  H02J5/00 ,  H01L23/538 ,  G06F17/50 ,  H01L23/544 ,  H01L25/065 ,  G01R31/302 ,  H01L23/00

CPC classification number: H02J50/40 ,  G01R31/2856 ,  G01R31/2884 ,  G01R31/2889 ,  G01R31/3025 ,  G06F17/5068 ,  H01L23/538 ,  H01L23/544 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/54446 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06596 ,  H01L2924/15192 ,  H01L2924/15311 ,  H02J5/005 ,  H02J50/10 ,  H02J50/20 ,  H02J50/80 ,  H01L2224/81

Abstract: A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.