Invention Grant
- Patent Title: Composite integrated circuits and methods for wireless interactions therewith
-
Application No.: US14804319Application Date: 2015-07-20
-
Publication No.: US09653927B2Publication Date: 2017-05-16
- Inventor: Min-Jer Wang , Ching-Nen Peng , Chewn-Pu Jou , Feng Wei Kuo , Hao Chen , Hung-Chih Lin , Huan-Neng Chen , Kuang-Kai Yen , Ming-Chieh Liu , Tsung-Hsiung Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G01R31/28 ; H02J5/00 ; H01L23/538 ; G06F17/50 ; H01L23/544 ; H01L25/065 ; G01R31/302 ; H01L23/00

Abstract:
A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.
Public/Granted literature
- US20150323589A1 COMPOSITE INTEGRATED CIRCUITS AND METHODS FOR WIRELESS INTERACTIONS THEREWITH Public/Granted day:2015-11-12
Information query