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公开(公告)号:US11899357B2
公开(公告)日:2024-02-13
申请号:US17321852
申请日:2021-05-17
IPC分类号: G03F1/32
CPC分类号: G03F1/32
摘要: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
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公开(公告)号:US11846881B2
公开(公告)日:2023-12-19
申请号:US17875255
申请日:2022-07-27
发明人: Ching-Huang Chen , Chi-Yuan Sun , Hua-Tai Lin , Hsin-Chang Lee , Ming-Wei Chen
IPC分类号: G03F1/24 , H01L21/033 , G03F1/54 , G03F1/80
CPC分类号: G03F1/24 , G03F1/54 , G03F1/80 , H01L21/0332 , H01L21/0337
摘要: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, a photo catalytic layer disposed on the capping layer, and an absorber layer disposed on the photo catalytic layer and carrying circuit patterns having openings. Part of the photo catalytic layer is exposed at the openings of the absorber layer, and the photo catalytic layer includes one selected from the group consisting of titanium oxide (TiO2), tin oxide (SnO), zinc oxide (ZnO) and cadmium sulfide (CdS).
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公开(公告)号:US11726399B2
公开(公告)日:2023-08-15
申请号:US17556681
申请日:2021-12-20
发明人: Pei-Cheng Hsu , Ching-Huang Chen , Hung-Yi Tsai , Ming-Wei Chen , Ta-Cheng Lien , Hsin-Chang Lee
IPC分类号: G03F1/24
CPC分类号: G03F1/24
摘要: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes one or more alternating pairs of a first Cr based layer and a second Cr based layer different from the first Cr based layer.
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公开(公告)号:US20220413378A1
公开(公告)日:2022-12-29
申请号:US17722457
申请日:2022-04-18
发明人: Ping-Hsun Lin , Pei-Cheng Hsu , Huan-Ling Lee , Ta-Cheng Lien , Hsin-Chang Lee , Chin-Hsiang Lin
IPC分类号: G03F1/64
摘要: Methods for removing a catalyst particle from a nanotube film used in a photolithographic patterning process are disclosed. The catalyst particle is identified based on its size in the nanotube film. This identification can be done using an inspection device such as a confocal microscope, which permits comparison of images taken in two or more separate focal planes to determine the size of particles. The catalyst particle is then exposed to a first absorption wavelength using a laser, which is selectively absorbed by the catalyst particle and which heats the catalyst particle to remove the catalyst particle from the nanotube film. Optionally, the catalyst particle-free nanotube film can be further exposed to a second absorption wavelength which is selectively absorbed by the film and promotes repair of the film. The resulting nanotube film can be used in a pellicle membrane.
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公开(公告)号:US10295899B2
公开(公告)日:2019-05-21
申请号:US15626643
申请日:2017-06-19
发明人: Hsin-Chang Lee , Chia-Jen Chen , Chih-Cheng Lin , Ping-Hsun Lin
IPC分类号: G03F1/22 , G03F1/44 , G03F1/54 , G03F1/72 , G03F1/76 , G03F1/78 , G03F1/84 , G03F7/20 , H01L21/027
摘要: A photomask includes a pattern region and a plurality of defects in the pattern region. The photomask further includes a first fiducial mark outside of the pattern region, wherein the first fiducial mark includes identifying information for the photomask, the first fiducial mark has a first size and a first shape. The photomask further includes a second fiducial mark outside of the pattern region. The second fiducial mark has a second size different from the first size, or a second shape different from the first shape.
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公开(公告)号:US10036951B2
公开(公告)日:2018-07-31
申请号:US14726317
申请日:2015-05-29
发明人: Pei-Cheng Hsu , Chih-Cheng Lin , Hsin-Chang Lee , Ta-Cheng Lien , Anthony Yen
CPC分类号: G03F1/64 , G03F7/70741
摘要: A method for fabricating a pellicle assembly for a lithography process includes fabricating a pellicle frame including a sidewall having a porous material. In some embodiments, the pellicle frame is subjected to an anodization process to form the porous material. The porous material includes a plurality of pore channels extending, in a direction perpendicular to an exterior surface of the sidewall, from the exterior surface to an interior surface of the sidewall. In various embodiments, a pellicle membrane is formed, and the pellicle membrane is attached to the pellicle frame such that the pellicle membrane is suspended by the pellicle frame. Some embodiments disclosed herein further provide a system including a membrane and a pellicle frame that secures the membrane across the pellicle frame. In some examples, a portion of the pellicle frame includes a porous material, where the porous material includes the plurality of pore channels.
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公开(公告)号:US09535317B2
公开(公告)日:2017-01-03
申请号:US14582459
申请日:2014-12-24
发明人: Pei-Cheng Hsu , Chih-Cheng Lin , Ta-Cheng Lien , Wei-Shiuan Chen , Hsin-Chang Lee , Anthony Yen
摘要: A method for forming a lithography mask includes forming a capping layer on a reflective multilayer layer, the capping layer comprising a first material, forming a patterned patterning layer on the capping layer, and introducing a secondary material into the capping layer, the secondary material having an atomic number that is smaller than 15.
摘要翻译: 一种形成光刻掩模的方法包括在反射多层层上形成覆盖层,封盖层包括第一材料,在封盖层上形成图案化图案层,并将次材料引入覆盖层中,第二材料具有 小于15的原子序数。
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公开(公告)号:US09244341B2
公开(公告)日:2016-01-26
申请号:US14630487
申请日:2015-02-24
发明人: Hsin-Chang Lee , Chia-Jen Chen , Pei-Cheng Hsu , Anthony Yen
摘要: A photomask having a machine-readable identifying mark and suitable for manufacturing integrated circuit devices and a method for forming the photomask and identifying mark are disclosed. An exemplary embodiment includes receiving a design layout corresponding to a pattern to be formed on a photomask blank. A specification of an identifying code is also received along with the photomask blank, which includes a substrate, a reflective layer, and an absorptive layer. A first patterning is performed using the design layout. A second patterning is performed using the specification of the identifying code.
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公开(公告)号:US20150205194A1
公开(公告)日:2015-07-23
申请号:US14158068
申请日:2014-01-17
发明人: Yun-Yue LIN , Hsin-Chang Lee , Chia-Jen Chen , Anthony Yen
IPC分类号: G03F1/48
CPC分类号: G03F1/48
摘要: The present disclosure provides a lithography mask comprising a substrate, a reflective multiplayer (ML) on the substrate, a barrier layer on the reflective ML, and an absorber layer over the barrier layer. In some embodiments, a thickness of the barrier layer is less than or equal to about 10 nm. In some embodiments, a portion of the absorber layer and a portion of the barrier layer are removed. The present disclosure also provides a method for fabricating a lithography mask, and a method for patterning a substrate using a lithography mask.
摘要翻译: 本公开提供了一种光刻掩模,其包括衬底,衬底上的反射多人(ML),反射ML上的阻挡层,以及阻挡层上的吸收层。 在一些实施例中,阻挡层的厚度小于或等于约10nm。 在一些实施例中,吸收层的一部分和阻挡层的一部分被去除。 本公开还提供了一种用于制造光刻掩模的方法,以及使用光刻掩模图案化衬底的方法。
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公开(公告)号:US09057961B2
公开(公告)日:2015-06-16
申请号:US14336231
申请日:2014-07-21
摘要: Structure of mask blanks and masks, and methods of making masks are disclosed. The new mask blank and mask comprise a tripe etching stop layer to prevent damages to the quartz substrate when the process goes through etching steps three times. The triple etching stop layer may comprise a first sub-layer of tantalum containing nitrogen (TaN), a second sub-layer of tantalum containing oxygen (TaO), and a third sub-layer of TaN. Alternatively, the triple etching stop layer may comprise a first sub-layer of SiON material, a second sub-layer of TaO material, and a third sub-layer of SiON material. Another alternative may be one layer of low etching rate MoxSiyONz material which can prevent damages to the quartz substrate when the process goes through etching steps three times. The island mask is defined on the mask blank by using various optical proximity correction rules.
摘要翻译: 公开了掩模毛坯和掩模的结构,以及制造掩模的方法。 当过程经过蚀刻步骤三次时,新的掩模坯料和掩模包括三层蚀刻停止层,以防止损坏石英基板。 三重蚀刻停止层可以包括含有氮(TaN)的钽的第一子层,含有氧(TaO)的钽的第二子层和TaN的第三子层。 或者,三重蚀刻停止层可以包括SiON材料的第一子层,TaO材料的第二子层和SiON材料的第三子层。 另一个替代方案可以是一层低蚀刻速率的MoxSiyONz材料,当该工艺经过蚀刻步骤三次时,其可以防止对石英衬底的损坏。 通过使用各种光学邻近校正规则在掩模空白上定义岛掩模。
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