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13 条记录 (耗时 0.016 秒)

    CIRCUIT MODULE
    1.
    发明申请
    CIRCUIT MODULE 有权
    电路模块

    公开(公告)号：US20150043171A1

    公开(公告)日：2015-02-12

    申请号：US14086472

    申请日：2013-11-21

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Eiji MUGIYA ,  Kenzo KITAZAKI ,  Masaya SHIMAMURA

    IPC分类号： H05K7/06

    CPC分类号： H05K7/06 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

    摘要： There is provided a circuit module including a circuit substrate being a wiring substrate having a mount surface, a surface wiring layer disposed on the mount surface, and an inner wiring layer formed within the substrate, a first mount component mounted on the mount surface, a second mount component mounted on the mount surface, and electrically connected to the first mount component via the inner wiring layer, a sealing body formed on the mount surface, covering the first mount component and the second mount component and having a trench formed from a main surface of the sealing body to the surface wiring layer between the first mount component and the second mount component, and a shield having an inner shield section formed within the trench that abuts on the surface wiring layer and an outer shield section covering the sealing body and the inner shield section.

    摘要翻译： 提供了一种电路模块，包括：电路基板，具有安装表面的布线基板;布置在安装表面上的表面布线层;以及形成在基板内部的内部布线层;安装在安装表面上的第一安装部件; 第二安装部件安装在安装表面上，并且经由内部布线层电连接到第一安装部件;形成在安装表面上的密封体，覆盖第一安装部件和第二安装部件，并且具有由主体 密封体的表面与第一安装部件和第二安装部件之间的表面布线层的表面以及形成在沟槽内形成的内屏蔽部的屏蔽部，该屏蔽部形成在表面布线层上，外屏蔽部覆盖密封体， 内屏蔽部分。

    CIRCUIT MODULE
    2.
    发明申请
    CIRCUIT MODULE 审中-公开
    电路模块

    公开(公告)号：US20150062835A1

    公开(公告)日：2015-03-05

    申请号：US14102241

    申请日：2013-12-10

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Takehiko KAI ,  Eiji MUGIYA ,  Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Hiroshi NAKAMURA ,  Tetsuo SAJI

    IPC分类号： H05K1/02 ,  H05K3/10

    CPC分类号： H05K1/0218 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/101 ,  H05K9/003 ,  H05K2201/0715 ,  Y10T29/4913

    摘要： A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.

    摘要翻译： 电路模块包括具有第一，第二和第三区域的安装表面的布线基板; 安装在所述区域上的多个电子部件; 绝缘密封层，其具有主表面和侧表面并且覆盖所述多个电子部件，所述主表面具有沟槽，所述沟槽沿着要沿着所述发散的区域之间的边界顺序地形成，并且具有朝向所述安装件的锥形形状 表面，所述侧表面围绕所述主表面形成; 以及具有第一和第二屏蔽部分并且包括导电树脂的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的侧表面并具有第一厚度，所述第二屏蔽部分设置在所述沟槽中，并且具有大于 第一厚度在第二屏蔽部分的总高度的一半的高度处。

    METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE
    4.
    发明申请
    METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE 审中-公开

    公开(公告)号：US20180286817A1

    公开(公告)日：2018-10-04

    申请号：US15935829

    申请日：2018-03-26

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo KITAZAKI ,  Takehiko KAI ,  Masaya SHIMAMURA ,  Mikio AOKI ,  Jin MIKATA ,  Taiji ITO

    IPC分类号： H01L23/552 ,  H01L23/66 ,  H01L21/56 ,  H01L21/78

    摘要： Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

    CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME
    5.
    发明申请
    CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME 有权
    电路模块及其制造方法

    公开(公告)号：US20160095267A1

    公开(公告)日：2016-03-31

    申请号：US14861867

    申请日：2015-09-22

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo KITAZAKI ,  Eiji MUGIYA ,  Masaya SHIMAMURA

    IPC分类号： H05K9/00 ,  H05K1/02 ,  H05K3/28 ,  H05K1/18 ,  H05K3/30

    CPC分类号： H05K1/0216 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K3/0052 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/0715 ,  H01L2924/00012

    摘要： A circuit module, including: a substrate having electronic components mounted thereon and further having a conductive pattern that defines respective shielded areas where the electronic components are mounted; a sealing layer covering the substrate and the electronic components, the sealing layer having grooves formed therein along the conductive pattern; and a conductive shield, including: a first shielding section covering a top surface of the sealing layer; a second shielding section covering side faces of the sealing layer; and a third shielding section filling the grooves in the sealing layer, wherein the grooves are shaped such that the third shielding section has at least one end thereof connected to the second shielding section, the third shielding section thereby acting as shielding walls partitioning the respective shielded areas, and that said at least one end of the third shielding section has a width wider than other portions of the third shielding section.

    摘要翻译： 一种电路模块，包括：具有安装在其上的电子部件并且还具有限定电子部件安装的相应屏蔽区域的导电图案的基板; 覆盖所述基板和所述电子部件的密封层，所述密封层沿着所述导电图案形成在其中; 以及导电屏蔽，包括：覆盖所述密封层的顶表面的第一屏蔽部分; 覆盖所述密封层的侧面的第二遮蔽部; 以及填充所述密封层中的凹槽的第三屏蔽部分，其中所述凹槽成形为使得所述第三屏蔽部分的至少一端连接到所述第二屏蔽部分，所述第三屏蔽部分用作屏蔽壁， 并且所述第三屏蔽部分的至少一端的宽度比所述第三屏蔽部分的其它部分宽。

    ELECTRONIC COMPONENT MODULE
    9.
    发明申请
    ELECTRONIC COMPONENT MODULE 审中-公开

    公开(公告)号：US20180286816A1

    公开(公告)日：2018-10-04

    申请号：US15934829

    申请日：2018-03-23

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Kenzo KITAZAKI ,  Takehiko KAI ,  Masaya SHIMAMURA ,  Mikio AOKI ,  Jin MIKATA ,  Taiji ITO

    IPC分类号： H01L23/552 ,  H01L23/28 ,  H01L23/02

    摘要： To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.

    CIRCUIT MODULE
    10.
    发明申请
    CIRCUIT MODULE 有权
    电路模块

    公开(公告)号：US20150049439A1

    公开(公告)日：2015-02-19

    申请号：US14090387

    申请日：2013-11-26

    申请人： Taiyo Yuden Co., Ltd.

    发明人： Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Eiji MUGIYA ,  Tatsuro SAWATARI ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/107 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09972 ,  H01L2924/00

    摘要： A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

    摘要翻译： 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。